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公开(公告)号：US20120298729A1
公开(公告)日：2012-11-29
申请号：US13299710
申请日：2011-11-18
CPC分类号： C08K5/09 , C08L69/00 , H01L23/293 , H01L2924/0002 , H01L2924/01322 , H05K13/00 , H05K13/0465 , H01L2924/00
摘要： Embodiments in accordance with the present invention encompass polymer compositions that are useful in the assembly of microelectronic components onto a variety of substrate materials. Such polymer compositions providing for both holding the microelectronic components at desired positions on a substrate, providing fluxing for the solder bonding of such components to the substrate and remaining in place as an underfill for such components.
摘要翻译： 根据本发明的实施方案包括可用于将微电子组件组装到各种基材上的聚合物组合物。 这种聚合物组合物提供将微电子组件保持在基底上的期望位置，为这些组分焊接到基底上的焊料提供助熔剂，并作为这种组分的底部填充物保留在适当位置。
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2.发明授权公开(公告)号：US09115300B2
公开(公告)日：2015-08-25
申请号：US13524511
申请日：2012-06-15
申请人： W. C. Peter Tsang , Andrew Bell
发明人： W. C. Peter Tsang , Andrew Bell
IPC分类号： C08K5/09 , C09J169/00 , C08K5/19 , H05K3/30 , C08K5/3462 , B23K35/36 , C08K5/3442 , C08G64/02 , C08K5/3467 , C08K5/17 , C08K5/31 , C08K5/3415 , H05K3/34
CPC分类号： C08G64/1608 , B23K35/3613 , B23K35/3615 , B23K35/3618 , C08G64/0208 , C08K5/09 , C08K5/175 , C08K5/19 , C08K5/31 , C08K5/3415 , C08K5/3442 , C08K5/3445 , C08K5/3462 , C08K5/3467 , C08L2205/02 , C09J169/00 , H05K3/303 , H05K3/3436 , H05K3/3489 , Y02P70/613 , C08L69/00
摘要： Embodiments in accordance with the present invention provide sacrifical polymer compositions and methods for fabricating electronic devices using such sacrifical polymer compositions where such methods include (1) providing a tacky sacrifical polymer composition that holds components in a desired alignment to one another, (2) providing solder fluxing for effecting electrical coupling; and (3) thermal decomposition or depolymerization of the sacrificial polymer composition to provide essentially residue free surfaces.
摘要翻译： 根据本发明的实施方案提供了牺牲性的聚合物组合物和使用这种牺牲聚合物组合物制造电子器件的方法，其中这些方法包括（1）提供粘合的牺牲聚合物组合物，其将组分保持在彼此期望的对准中，（2）提供 助焊剂进行电耦合; 和（3）牺牲聚合物组合物的热分解或解聚以提供基本上无残留的表面。
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公开(公告)号：US08575248B2
公开(公告)日：2013-11-05
申请号：US13204036
申请日：2011-08-05
CPC分类号： B23K35/362 , B23K35/26 , B23K35/3613 , C08G64/0208 , C08K5/0033 , C08K5/07 , C08K5/09 , C08K5/1535 , C08K5/42 , C08K5/55 , C09J169/00
摘要： Embodiments in accordance with the present invention encompass polymer compositions that act as both a tack agent and a fluxing agent for the assembly of microelectronic components onto a variety of substrate materials. Such polymer compositions embodiments encompass a sacrificial polymer, a carrier solvent, a thermal acid generator and, optionally, formic acid.
摘要翻译： 根据本发明的实施方案包括用作将微电子组件组装到各种基材上的粘合剂和助熔剂两者的聚合物组合物。 这样的聚合物组合物实施方案包括牺牲聚合物，载体溶剂，热酸产生剂和任选的甲酸。
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4.发明申请Sacrificial Polymer Compositions Including Polycarbonates Having Repeat Units Derived from Stereospecific Polycyclic 2,3-Diol Monomers 失效牺牲聚合物组合物包括具有源自立体专一性多环2,3-二醇单体的重复单元的聚碳酸酯公开(公告)号：US20120031556A1
公开(公告)日：2012-02-09
申请号：US13204044
申请日：2011-08-05
CPC分类号： B23K35/362 , B23K35/26 , B23K35/3613 , C08G64/0208 , C08K5/0033 , C08K5/07 , C08K5/09 , C08K5/1535 , C08K5/42 , C08K5/55 , C09J169/00
摘要： Embodiments according to the present invention relate to sacrificial polymer compositions that include polycarbonate polymers having repeat units derived from stereospecific polycyclic 2,3-diol monomers. The sacrificial polymer compositions also include an acid generator that is selected from at least one photoacid generator and/or at least one thermal acid generator. In addition, embodiments according to the present invention relate to a method of forming a structure that includes a three-dimensional space interposed between a substrate and an overcoat layer, and a method of temporarily bonding first and second substrates together, which make use of the polycarbonate polymers.
摘要翻译： 根据本发明的实施方案涉及牺牲聚合物组合物，其包含具有衍生自立体特异性多环2,3-二醇单体的重复单元的聚碳酸酯聚合物。 牺牲聚合物组合物还包括选自至少一种光致酸产生剂和/或至少一种热酸产生剂的酸产生剂。 此外，根据本发明的实施例涉及一种形成包括介于基板和外涂层之间的三维空间的结构的方法，以及将第一和第二基板临时粘合在一起的方法，其利用 聚碳酸酯聚合物。
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5.发明授权Sacrificial polymer compositions including polycarbonates having repeat units derived from stereospecific polycyclic 2,3-diol monomers 失效牺牲聚合物组合物包括具有衍生自立体特异性多环2,3-二醇单体的重复单元的聚碳酸酯公开(公告)号：US08575297B2
公开(公告)日：2013-11-05
申请号：US13204044
申请日：2011-08-05
CPC分类号： B23K35/362 , B23K35/26 , B23K35/3613 , C08G64/0208 , C08K5/0033 , C08K5/07 , C08K5/09 , C08K5/1535 , C08K5/42 , C08K5/55 , C09J169/00
摘要： Embodiments according to the present invention relate to sacrificial polymer compositions that include polycarbonate polymers having repeat units derived from stereospecific polycyclic 2,3-diol monomers. The sacrificial polymer compositions also include an acid generator that is selected from at least one photoacid generator and/or at least one thermal acid generator. In addition, embodiments according to the present invention relate to a method of forming a structure that includes a three-dimensional space interposed between a substrate and an overcoat layer, and a method of temporarily bonding first and second substrates together, which make use of the polycarbonate polymers.
摘要翻译： 根据本发明的实施方案涉及牺牲聚合物组合物，其包含具有衍生自立体特异性多环2,3-二醇单体的重复单元的聚碳酸酯聚合物。 牺牲聚合物组合物还包括选自至少一种光致酸产生剂和/或至少一种热酸产生剂的酸产生剂。 此外，根据本发明的实施例涉及一种形成包括介于基板和外涂层之间的三维空间的结构的方法，以及将第一和第二基板临时粘合在一起的方法，其利用 聚碳酸酯聚合物。
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公开(公告)号：US08535454B2
公开(公告)日：2013-09-17
申请号：US13299710
申请日：2011-11-18
IPC分类号： B23K35/34
CPC分类号： C08K5/09 , C08L69/00 , H01L23/293 , H01L2924/0002 , H01L2924/01322 , H05K13/00 , H05K13/0465 , H01L2924/00
摘要： Embodiments in accordance with the present invention encompass polymer compositions that are useful in the assembly of microelectronic components onto a variety of substrate materials. Such polymer compositions providing for both holding the microelectronic components at desired positions on a substrate, providing fluxing for the solder bonding of such components to the substrate and remaining in place as an underfill for such components.
摘要翻译： 根据本发明的实施方案包括可用于将微电子组件组装到各种基材上的聚合物组合物。 这种聚合物组合物提供将微电子组件保持在基底上的期望位置，为这些组分焊接到基底上的焊料提供助熔剂，并作为这种组分的底部填充物保留在适当位置。
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7.发明申请THERMALLY DECOMPOSABLE POLYMER COMPOSITIONS INCORPORATING THERMALLY ACTIVATED BASE GENERATORS 有权包含热启动基因发生器的热分解聚合物组合物公开(公告)号：US20120318854A1
公开(公告)日：2012-12-20
申请号：US13524511
申请日：2012-06-15
申请人： W. C. Peter Tsang , Andrew Bell
发明人： W. C. Peter Tsang , Andrew Bell
IPC分类号： C09D169/00 , B23K31/02
CPC分类号： C08G64/1608 , B23K35/3613 , B23K35/3615 , B23K35/3618 , C08G64/0208 , C08K5/09 , C08K5/175 , C08K5/19 , C08K5/31 , C08K5/3415 , C08K5/3442 , C08K5/3445 , C08K5/3462 , C08K5/3467 , C08L2205/02 , C09J169/00 , H05K3/303 , H05K3/3436 , H05K3/3489 , Y02P70/613 , C08L69/00
摘要： Embodiments in accordance with the present invention provide sacrifical polymer compositions and methods for fabricating electronic devices using such sacrifical polymer compositions where such methods include (1) providing a tacky sacrifical polymer composition that holds components in a desired alignment to one another, (2) providing solder fluxing for effecting electrical coupling; and (3) thermal decomposition or depolymerization of the sacrificial polymer composition to provide essentially residue free surfaces.
摘要翻译： 根据本发明的实施方案提供了牺牲性的聚合物组合物和使用这种牺牲聚合物组合物制造电子器件的方法，其中这些方法包括（1）提供粘合的牺牲聚合物组合物，其将组分保持在彼此期望的对准中，（2）提供 助焊剂进行电耦合; 和（3）牺牲聚合物组合物的热分解或解聚以提供基本上无残留的表面。
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公开(公告)号：US20120034387A1
公开(公告)日：2012-02-09
申请号：US13204036
申请日：2011-08-05
CPC分类号： B23K35/362 , B23K35/26 , B23K35/3613 , C08G64/0208 , C08K5/0033 , C08K5/07 , C08K5/09 , C08K5/1535 , C08K5/42 , C08K5/55 , C09J169/00
摘要： Embodiments in accordance with the present invention encompass polymer compositions that act as both a tack agent and a fluxing agent for the assembly of microelectronic components onto a variety of substrate materials. Such polymer compositions embodiments encompass a sacrificial polymer, a carrier solvent, a thermal acid generator and, optionally, formic acid.
摘要翻译： 根据本发明的实施方案包括用作将微电子组件组装到各种基材上的粘合剂和助熔剂两者的聚合物组合物。 这样的聚合物组合物实施方案包括牺牲聚合物，载体溶剂，热酸产生剂和任选的甲酸。
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