Method of patterning ferroelectric layers
    4.
    发明授权
    Method of patterning ferroelectric layers 失效
    铁电层图案的方法

    公开(公告)号:US06730562B2

    公开(公告)日:2004-05-04

    申请号:US10364819

    申请日:2003-02-11

    IPC分类号: H01L218242

    CPC分类号: H01L28/55 H01L21/31122

    摘要: A method for structuring ferroelectric layers on semiconductor substrates retains or regenerates the adherence and breakdown voltage resistance of the ferroelectric layer, which is especially significant for producing storage capacitors in large-scale integrated FeRAM and DRAM memory components. The addition of H2O or O2 results principally in the recovery of the electrostatic breakdown strength of the ferroelectric layer, which is of importance in particular when the ferroelectric serves as a dielectric of a storage capacitor and has to withstand electric fields of 5-10×106 V/m without a significant leakage current.

    摘要翻译: 用于在半导体衬底上构造铁电层的方法保留或再生强电介质层的粘附和耐击穿电压,这对于在大规模集成的FeRAM和DRAM存储器组件中产生存储电容器尤其重要。 H 2 O或O 2的添加主要导致铁电层的静电击穿强度的恢复,特别是当铁电体用作储能电容器的电介质并且必须承受5-10×10 6的电场时,这尤其重要 > V / m,没有明显的漏电流。

    Method for the production of an integrated semiconductor memory configuration
    7.
    发明授权
    Method for the production of an integrated semiconductor memory configuration 有权
    用于生产集成半导体存储器配置的方法

    公开(公告)号:US06197633B1

    公开(公告)日:2001-03-06

    申请号:US09281822

    申请日:1999-03-30

    IPC分类号: H01L218242

    CPC分类号: H01L27/10852 H01L27/10817

    摘要: A method for producing a memory configuration that comprises a multiplicity of memory cells, and has storage capacitors whose first electrodes are configured in plate form in a parallel manner one above the other. These electrodes are in electrical contact with selection transistors of the memory cell through contact plugs having different lengths. The first electrodes preferably extend beyond the cell area of one memory cell.

    摘要翻译: 一种用于产生包括多个存储单元的存储器配置的方法,并且具有其第一电极以彼此并列的方式配置为板形的存储电容器。 这些电极通过具有不同长度的接触插塞与存储器单元的选择晶体管电接触。 优选地,第一电极延伸超过一个存储单元的单元区域。

    Microelectronic structure having a hydrogen barrier layer
    10.
    发明授权
    Microelectronic structure having a hydrogen barrier layer 有权
    具有氢阻挡层的微电子结构

    公开(公告)号:US07276300B2

    公开(公告)日:2007-10-02

    申请号:US10476579

    申请日:2002-04-22

    IPC分类号: B32B9/00

    摘要: The invention relates to a microelectronic structure which provides improved protection of a hydrogen-sensitive dielectric against hydrogen contamination. According to the invention, the hydrogen sensitive dielectric (14) is covered at lest by an intermediate oxide (18), where material thickness is at lest five times the thickness of the hydrogen-sensitive dielectric. The intermediate oxide (18) simultaneously acts as an internal dielectric and is metabolized on its surface for this purpose. The intermediate oxide (18), which has a sufficient thickness absorbers the hydrogen that may be released during the deposition of a hydrogen barrier layer (22, 26), thus protecting the hydrogen-sensitive dielectric (14).

    摘要翻译: 本发明涉及一种微电子结构,其提供对氢敏感介质的改善的防止氢污染的保护。 根据本发明,氢敏电介质(14)几乎被中间氧化物(18)覆盖,其中材料厚度是氢敏电介质厚度的五倍。 中间氧化物(18)同时作为内部电介质,为此目的在其表面上代谢。 具有足够厚度的中间氧化物(18)吸收在氢阻挡层(22,26)的沉积过程中可释放的氢,从而保护感应电介质(14)。