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1.发明申请公开(公告)号：US20060261340A1
公开(公告)日：2006-11-23
申请号：US11494453
申请日：2006-07-28
申请人： Warren Farnworth , Sidney Rigg , William Hiatt , Kyle Kirby , Peter Benson , James Wark , Alan Wood , David Hembree , Salman Akram , Charles Watkins
发明人： Warren Farnworth , Sidney Rigg , William Hiatt , Kyle Kirby , Peter Benson , James Wark , Alan Wood , David Hembree , Salman Akram , Charles Watkins
IPC分类号： H01L29/04 , H01L33/00 , H01L29/768 , H01L27/148 , H01L31/0203
CPC分类号： H01L27/14618 , H01L23/481 , H01L24/48 , H01L31/0203 , H01L31/02325 , H01L2224/48227 , H01L2924/00014 , H01L2924/01046 , H01L2924/01077 , H01L2924/01078 , H01L2924/04941 , H01L2924/12042 , H01L2924/14 , H01L2924/15174 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： Microelectronic imagers and methods for packaging microelectronic imagers are disclosed herein. In one embodiment, a microelectronic imaging unit can include a microelectronic die, an image sensor, an integrated circuit electrically coupled to the image sensor, and a bond-pad electrically coupled to the integrated circuit. An electrically conductive through-wafer interconnect extends through the die and is in contact with the bond-pad. The interconnect can include a passage extending completely through the substrate and the bond-pad with conductive fill material at least partially disposed in the passage. An electrically conductive support member is carried by and projects from the bond-pad. A cover over the image sensor is coupled to the support member.
摘要翻译： 本文公开了微电子成像器和用于封装微电子成像器的方法。 在一个实施例中，微电子成像单元可以包括微电子管芯，图像传感器，电耦合到图像传感器的集成电路以及电耦合到集成电路的接合焊盘。 导电晶片互连延伸穿过管芯并且与焊盘接触。 互连可以包括完全延伸穿过基底的通道和具有至少部分地设置在通道中的导电填充材料的接合垫。 导电支撑构件由接合垫承载和突出。 图像传感器上的盖连接到支撑构件。
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2.发明申请公开(公告)号：US20050275048A1
公开(公告)日：2005-12-15
申请号：US10867352
申请日：2004-06-14
申请人： Warren Farnworth , Sidney Rigg , William Hiatt , Kyle Kirby , Peter Benson , James Wark , Alan Wood , David Hembree , Salman Akram , Charles Watkins
发明人： Warren Farnworth , Sidney Rigg , William Hiatt , Kyle Kirby , Peter Benson , James Wark , Alan Wood , David Hembree , Salman Akram , Charles Watkins
IPC分类号： H01L21/00 , H01L23/02 , H01L23/48 , H01L27/14 , H01L27/146 , H01L31/00 , H01L31/0203 , H01L31/0232
CPC分类号： H01L27/14618 , H01L23/481 , H01L24/48 , H01L31/0203 , H01L31/02325 , H01L2224/48227 , H01L2924/00014 , H01L2924/01046 , H01L2924/01077 , H01L2924/01078 , H01L2924/04941 , H01L2924/12042 , H01L2924/14 , H01L2924/15174 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： Microelectronic imagers and methods for packaging microelectronic imagers are disclosed herein. In one embodiment, a microelectronic imaging unit can include a microelectronic die, an image sensor, an integrated circuit electrically coupled to the image sensor, and a bond-pad electrically coupled to the integrated circuit. An electrically conductive through-wafer interconnect extends through the die and is in contact with the bond-pad. The interconnect can include a passage extending completely through the substrate and the bond-pad with conductive fill material at least partially disposed in the passage. An electrically conductive support member is carried by and projects from the bond-pad. A cover over the image sensor is coupled to the support member.
摘要翻译： 本文公开了微电子成像器和用于封装微电子成像器的方法。 在一个实施例中，微电子成像单元可以包括微电子管芯，图像传感器，电耦合到图像传感器的集成电路以及电耦合到集成电路的接合焊盘。 导电晶片互连延伸穿过管芯并且与焊盘接触。 互连可以包括完全延伸穿过基底的通道和具有至少部分地设置在通道中的导电填充材料的接合垫。 导电支撑构件由接合垫承载和突出。 图像传感器上的盖连接到支撑构件。
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公开(公告)号：US20060011809A1
公开(公告)日：2006-01-19
申请号：US10894262
申请日：2004-07-19
申请人： Warren Farnworth , Sidney Rigg , William Hiatt , Alan Wood , Peter Benson , James Wark , David Hembree , Kyle Kirby , Charles Watkins , Salman Akram
发明人： Warren Farnworth , Sidney Rigg , William Hiatt , Alan Wood , Peter Benson , James Wark , David Hembree , Kyle Kirby , Charles Watkins , Salman Akram
IPC分类号： H01L27/00
CPC分类号： H01L27/00 , B33Y80/00 , H01L27/14618 , H01L27/14625 , H01L27/14683 , H01L27/14687 , H01L2224/48091 , H01L2224/48227 , H01L2924/01077 , H01L2924/01078 , H01L2924/00014
摘要： Microelectronic imager assemblies comprising a workpiece including a substrate and a plurality of imaging dies on and/or in the substrate. The substrate includes a front side and a back side, and the imaging dies comprise imaging sensors at the front side of the substrate and external contacts operatively coupled to the image sensors. The microelectronic imager assembly further comprises optics supports superimposed relative to the imaging dies. The optics supports can be directly on the substrate or on a cover over the substrate. Individual optics supports can have (a) an opening aligned with one of the image sensors, and (b) a bearing element at a reference distance from the image sensor. The microelectronic imager assembly can further include optical devices mounted or otherwise carried by the optics supports.
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公开(公告)号：US20070170350A1
公开(公告)日：2007-07-26
申请号：US11727545
申请日：2007-03-27
申请人： Warren Farnworth , Sidney Rigg , William Hiatt , Alan Wood , Peter Benson , James Wark , David Hembree , Kyle Kirby , Charles Watkins , Salman Akram
发明人： Warren Farnworth , Sidney Rigg , William Hiatt , Alan Wood , Peter Benson , James Wark , David Hembree , Kyle Kirby , Charles Watkins , Salman Akram
IPC分类号： H01L27/00
CPC分类号： H01L27/00 , B33Y80/00 , H01L27/14618 , H01L27/14625 , H01L27/14683 , H01L27/14687 , H01L2224/48091 , H01L2224/48227 , H01L2924/01077 , H01L2924/01078 , H01L2924/00014
摘要： Microelectronic imager assemblies comprising a workpiece including a substrate and a plurality of imaging dies on and/or in the substrate. The substrate includes a front side and a back side, and the imaging dies comprise imaging sensors at the front side of the substrate and external contacts operatively coupled to the image sensors. The microelectronic imager assembly further comprises optics supports superimposed relative to the imaging dies. The optics supports can be directly on the substrate or on a cover over the substrate. Individual optics supports can have (a) an opening aligned with one of the image sensors, and (b) a bearing element at a reference distance from the image sensor. The microelectronic imager assembly can further include optical devices mounted or otherwise carried by the optics supports.
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公开(公告)号：US20060243889A1
公开(公告)日：2006-11-02
申请号：US11476015
申请日：2006-06-28
申请人： Warren Farnworth , Sidney Rigg , William Hiatt , Alan Wood , Peter Benson , James Wark , David Hembree , Kyle Kirby , Charles Watkins , Salman Akram
发明人： Warren Farnworth , Sidney Rigg , William Hiatt , Alan Wood , Peter Benson , James Wark , David Hembree , Kyle Kirby , Charles Watkins , Salman Akram
IPC分类号： H01L27/00
CPC分类号： H01L27/00 , B33Y80/00 , H01L27/14618 , H01L27/14625 , H01L27/14683 , H01L27/14687 , H01L2224/48091 , H01L2224/48227 , H01L2924/01077 , H01L2924/01078 , H01L2924/00014
摘要： Microelectronic imager assemblies comprising a workpiece including a substrate and a plurality of imaging dies on and/or in the substrate. The substrate includes a front side and a back side, and the imaging dies comprise imaging sensors at the front side of the substrate and external contacts operatively coupled to the image sensors. The microelectronic imager assembly further comprises optics supports superimposed relative to the imaging dies. The optics supports can be directly on the substrate or on a cover over the substrate. Individual optics supports can have (a) an opening aligned with one of the image sensors, and (b) a bearing element at a reference distance from the image sensor. The microelectronic imager assembly can further include optical devices mounted or otherwise carried by the optics supports.
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公开(公告)号：US20110233777A1
公开(公告)日：2011-09-29
申请号：US13154550
申请日：2011-06-07
申请人： Salman Akram , Charles Watkins , Mark Hiatt , David Hembree , James Wark , Warren Farnworth , Mark Tuttle , Sidney Rigg , Steven Oliver , Kyle Kirby , Alan Wood , Lu Velicky
发明人： Salman Akram , Charles Watkins , Mark Hiatt , David Hembree , James Wark , Warren Farnworth , Mark Tuttle , Sidney Rigg , Steven Oliver , Kyle Kirby , Alan Wood , Lu Velicky
IPC分类号： H01L23/498 , H01L23/48
CPC分类号： H01L21/76877 , H01L21/6835 , H01L21/76898 , H01L23/481 , H01L24/45 , H01L27/14634 , H01L27/14636 , H01L2221/6834 , H01L2224/02166 , H01L2224/0554 , H01L2224/05567 , H01L2224/05573 , H01L2224/16 , H01L2224/45144 , H01L2224/48463 , H01L2924/00014 , H01L2924/01013 , H01L2924/01014 , H01L2924/01028 , H01L2924/01029 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/04941 , H01L2924/10253 , H01L2924/12042 , H01L2924/14 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A through-wafer interconnect for imager, memory and other integrated circuit applications is disclosed, thereby eliminating the need for wire bonding, making devices incorporating such interconnects stackable and enabling wafer level packaging for imager devices. Further, a smaller and more reliable die package is achieved and circuit parasitics (e.g., L and R) are reduced due to the reduced signal path lengths.
摘要翻译： 公开了一种用于成像器，存储器和其他集成电路应用的透晶片互连，从而消除了对引线接合的需要，使得结合这种互连的器件可堆叠并且实现成像器件的晶片级封装。 此外，实现了更小且更可靠的管芯封装，并且由于信号路径长度的减小，电路寄生（例如，L和R）被减小。
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公开(公告)号：US20100171217A1
公开(公告)日：2010-07-08
申请号：US12725724
申请日：2010-03-17
申请人： Salman Akram , Charles Watkins , Mark Hiatt , David Hembree , James Wark , Warren Farnworth , Mark Tuttle , Sidney Rigg , Steven Oliver , Kyle Kirby , Alan Wood , Lu Velicky
发明人： Salman Akram , Charles Watkins , Mark Hiatt , David Hembree , James Wark , Warren Farnworth , Mark Tuttle , Sidney Rigg , Steven Oliver , Kyle Kirby , Alan Wood , Lu Velicky
IPC分类号： H01L23/498
CPC分类号： H01L21/76877 , H01L21/6835 , H01L21/76898 , H01L23/481 , H01L24/45 , H01L27/14634 , H01L27/14636 , H01L2221/6834 , H01L2224/02166 , H01L2224/0554 , H01L2224/05567 , H01L2224/05573 , H01L2224/16 , H01L2224/45144 , H01L2224/48463 , H01L2924/00014 , H01L2924/01013 , H01L2924/01014 , H01L2924/01028 , H01L2924/01029 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/04941 , H01L2924/10253 , H01L2924/12042 , H01L2924/14 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A through-wafer interconnect for imager, memory and other integrated circuit applications is disclosed, thereby eliminating the need for wire bonding, making devices incorporating such interconnects stackable and enabling wafer level packaging for imager devices. Further, a smaller and more reliable die package is achieved and circuit parasitics (e.g., L and R) are reduced due to the reduced signal path lengths.
摘要翻译： 公开了一种用于成像器，存储器和其他集成电路应用的透晶片互连，从而消除了对引线接合的需要，使得结合这种互连的器件可堆叠并且实现成像器件的晶片级封装。 此外，实现了更小且更可靠的管芯封装，并且由于信号路径长度的减小，电路寄生（例如，L和R）被减小。
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公开(公告)号：US20080111213A1
公开(公告)日：2008-05-15
申请号：US11924781
申请日：2007-10-26
申请人： Salman Akram , Charles Watkins , Mark Hiatt , David Hembree , James Wark , Warren Farnworth , Mark Tuttle , Sidney Rigg , Steven Oliver , Kyle Kirby , Alan Wood , Lu Velicky
发明人： Salman Akram , Charles Watkins , Mark Hiatt , David Hembree , James Wark , Warren Farnworth , Mark Tuttle , Sidney Rigg , Steven Oliver , Kyle Kirby , Alan Wood , Lu Velicky
IPC分类号： H01L23/488
CPC分类号： H01L21/76877 , H01L21/6835 , H01L21/76898 , H01L23/481 , H01L24/45 , H01L27/14634 , H01L27/14636 , H01L2221/6834 , H01L2224/02166 , H01L2224/0554 , H01L2224/05567 , H01L2224/05573 , H01L2224/16 , H01L2224/45144 , H01L2224/48463 , H01L2924/00014 , H01L2924/01013 , H01L2924/01014 , H01L2924/01028 , H01L2924/01029 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/04941 , H01L2924/10253 , H01L2924/12042 , H01L2924/14 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A through-wafer interconnect for imager, memory and other integrated circuit applications is disclosed, thereby eliminating the need for wire bonding, making devices incorporating such interconnects stackable and enabling wafer level packaging for imager devices. Further, a smaller and more reliable die package is achieved and circuit parasitics (e.g., L and R) are reduced due to the reduced signal path lengths.
摘要翻译： 公开了一种用于成像器，存储器和其他集成电路应用的透晶片互连，从而消除了对引线接合的需要，使得结合这种互连的器件可堆叠并且实现成像器件的晶片级封装。 此外，实现了更小且更可靠的管芯封装，并且由于信号路径长度的减小，电路寄生（例如，L和R）被减小。
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公开(公告)号：US07300857B2
公开(公告)日：2007-11-27
申请号：US10932296
申请日：2004-09-02
申请人： Salman Akram , Charles Watkins , Mark Hiatt , David Hembree , James Wark , Warren Farnworth , Mark Tuttle , Sidney Rigg , Steven Oliver , Kyle Kirby , Alan Wood , Lu Velicky
发明人： Salman Akram , Charles Watkins , Mark Hiatt , David Hembree , James Wark , Warren Farnworth , Mark Tuttle , Sidney Rigg , Steven Oliver , Kyle Kirby , Alan Wood , Lu Velicky
IPC分类号： H01L21/441
CPC分类号： H01L21/76877 , H01L21/6835 , H01L21/76898 , H01L23/481 , H01L24/45 , H01L27/14634 , H01L27/14636 , H01L2221/6834 , H01L2224/02166 , H01L2224/0554 , H01L2224/05567 , H01L2224/05573 , H01L2224/16 , H01L2224/45144 , H01L2224/48463 , H01L2924/00014 , H01L2924/01013 , H01L2924/01014 , H01L2924/01028 , H01L2924/01029 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/04941 , H01L2924/10253 , H01L2924/12042 , H01L2924/14 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A through-wafer interconnect for imager, memory and other integrated circuit applications is disclosed, thereby eliminating the need for wire bonding, making devices incorporating such interconnects stackable and enabling wafer level packaging for imager devices. Further, a smaller and more reliable die package is achieved and circuit parasitics (e.g., L and R) are reduced due to the reduced signal path lengths.
摘要翻译： 公开了一种用于成像器，存储器和其他集成电路应用的透晶片互连，从而消除了对引线接合的需要，使得结合这种互连的器件可堆叠并且实现成像器件的晶片级封装。 此外，实现了更小且更可靠的管芯封装，并且由于信号路径长度的减小，电路寄生（例如，L和R）被减小。
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公开(公告)号：US20060043599A1
公开(公告)日：2006-03-02
申请号：US10932296
申请日：2004-09-02
申请人： Salman Akram , Charles Watkins , Mark Hiatt , David Hembree , James Wark , Warren Farnworth , Mark Tuttle , Sidney Rigg , Steven Oliver , Kyle Kirby , Alan Wood , Lu Velicky
发明人： Salman Akram , Charles Watkins , Mark Hiatt , David Hembree , James Wark , Warren Farnworth , Mark Tuttle , Sidney Rigg , Steven Oliver , Kyle Kirby , Alan Wood , Lu Velicky
CPC分类号： H01L21/76877 , H01L21/6835 , H01L21/76898 , H01L23/481 , H01L24/45 , H01L27/14634 , H01L27/14636 , H01L2221/6834 , H01L2224/02166 , H01L2224/0554 , H01L2224/05567 , H01L2224/05573 , H01L2224/16 , H01L2224/45144 , H01L2224/48463 , H01L2924/00014 , H01L2924/01013 , H01L2924/01014 , H01L2924/01028 , H01L2924/01029 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/04941 , H01L2924/10253 , H01L2924/12042 , H01L2924/14 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A through-wafer interconnect for imager, memory and other integrated circuit applications is disclosed, thereby eliminating the need for wire bonding, making devices incorporating such interconnects stackable and enabling wafer level packaging for imager devices. Further, a smaller and more reliable die package is achieved and circuit parasitics (e.g., L and R) are reduced due to the reduced signal path lengths.
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