公开(公告)号：US07286890B2

公开(公告)日：2007-10-23

申请号：US11475196

申请日：2006-06-27

申请人： Wataru Machiyama ,  Shigeru Ishizawa ,  Hiroshi Koizumi ,  Tsutomu Hiroki ,  Keisuke Kondoh

发明人： Wataru Machiyama ,  Shigeru Ishizawa ,  Hiroshi Koizumi ,  Tsutomu Hiroki ,  Keisuke Kondoh

IPC分类号： G06F19/00 ,  G05B19/18

CPC分类号： H01L21/67742 ,  H01L21/67276 ,  H01L21/67745

摘要： A processing system includes a transfer chamber, a plurality of chambers connected to the transfer chamber, a transfer apparatus disposed in the transfer chamber, and a control section configured to control the transfer apparatus. The transfer apparatus includes a base and transfer arm configured to perform a slide motion and a swing motion, respectively. The control section includes a storage portion and an operational controller. The storage portion stores pattern model data concerning a plurality of motion patterns each indicative of a composite motion of the slide motion and the swing motion, and track model data concerning time-based motion tracks respectively corresponding to the motion patterns. The operational controller is configured to retrieve necessary data from the pattern model data and the track model data and control the transfer apparatus in accordance therewith.

摘要翻译： 一种处理系统，包括传送室，连接到传送室的多个室，设置在传送室中的传送装置和被配置为控制传送装置的控制部。 传送装置包括分别执行滑动运动和摆动运动的底座和传送臂。 控制部分包括存储部分和操作控制器。 存储部分存储关于多个运动模式的模式模型数据，每个运动模式指示滑动运动和摆动运动的复合运动，以及跟踪分别对应于运动模式的基于时间运动轨迹的模型数据。 操作控制器被配置为从模式模型数据和轨道模型数据中检索必要的数据，并根据其控制传送装置。

公开(公告)号：US20060291988A1

公开(公告)日：2006-12-28

申请号：US11475196

申请日：2006-06-27

申请人： Wataru Machiyama ,  Shigeru Ishizawa ,  Hiroshi Koizumi ,  Tsutomu Hiroki ,  Keisuke Kondoh

发明人： Wataru Machiyama ,  Shigeru Ishizawa ,  Hiroshi Koizumi ,  Tsutomu Hiroki ,  Keisuke Kondoh

IPC分类号： B65G57/02

CPC分类号： H01L21/67742 ,  H01L21/67276 ,  H01L21/67745

摘要： A processing system includes a transfer chamber, a plurality of chambers connected to the transfer chamber, a transfer apparatus disposed in the transfer chamber, and a control section configured to control the transfer apparatus. The transfer apparatus includes a base and transfer arm configured to perform a slide motion and a swing motion, respectively. The control section includes a storage portion and an operational controller. The storage portion stores pattern model data concerning a plurality of motion patterns each indicative of a composite motion of the slide motion and the swing motion, and track model data concerning time-based motion tracks respectively corresponding to the motion patterns. The operational controller is configured to retrieve necessary data from the pattern model data and the track model data and control the transfer apparatus in accordance therewith.

摘要翻译： 一种处理系统，包括传送室，连接到传送室的多个室，设置在传送室中的传送装置和被配置为控制传送装置的控制部。 传送装置包括分别执行滑动运动和摆动运动的底座和传送臂。 控制部分包括存储部分和操作控制器。 存储部分存储关于多个运动模式的模式模型数据，每个运动模式指示滑动运动和摆动运动的复合运动，以及跟踪分别对应于运动模式的基于时间的运动轨迹的模型数据。 操作控制器被配置为从模式模型数据和轨道模型数据中检索必要的数据，并根据其控制传送装置。

公开(公告)号：US20080069669A1

公开(公告)日：2008-03-20

申请号：US11857271

申请日：2007-09-18

申请人： Keisuke Kondoh ,  Hiroshi Koizumi

发明人： Keisuke Kondoh ,  Hiroshi Koizumi

IPC分类号： H01L21/67 ,  B65D85/86 ,  H01L21/687

CPC分类号： H01L21/67253 ,  H01L21/67196 ,  H01L21/67748 ,  H01L21/67772

摘要： A method adjusts a pressure in a substrate processing device. The substrate processing device has a processing chamber for executing a predetermined processing for a substrate to be processed mounted on a mounting table; a pressure adjustment unit for the processing chamber which adjusts a pressure within the processing chamber; a transfer chamber connected to the processing chamber via a gate valve; and a pressure adjustment unit for the transfer chamber which adjusts a pressure in the transfer chamber and adjusts a pressure within the processing chamber while the gate valve is opened. The method is to adjust a pressure within the processing chamber to a predetermined pressure by using both the pressure adjustment unit for the processing chamber and the pressure adjustment unit for the transfer chamber.

摘要翻译： 一种方法调节衬底处理装置中的压力。 基板处理装置具有用于对安装在安装台上的待加工基板进行预定处理的处理室; 用于处理室的压力调节单元，其调节处理室内的压力; 经由闸阀连接到处理室的传送室; 以及用于传送室的压力调节单元，其调节所述传送室中的压力并且在所述闸阀打开时调节所述处理室内的压力。 该方法是通过使用用于处理室的压力调节单元和用于传送室的压力调节单元来将处理室内的压力调节到预定压力。

公开(公告)号：US20110178631A1

公开(公告)日：2011-07-21

申请号：US13079356

申请日：2011-04-04

申请人： Keisuke KONDOH ,  Hiroshi Koizumi

发明人： Keisuke KONDOH ,  Hiroshi Koizumi

IPC分类号： H01L21/677 ,  G06F17/00 ,  H01L21/68

CPC分类号： H01L21/68 ,  H01L21/67196 ,  H01L21/67259

摘要： In a vacuum transfer chamber, a position detecting mechanism for detecting the positions of semiconductor wafers is arranged. The semiconductor wafers disposed at predetermined positions in a load lock chamber and vacuum processing chambers are transferred to the position detecting mechanism by a vacuum transfer mechanism and the positions of the wafers are detected. Then, based on the detection results, aligning between the load lock chamber and the vacuum processing chambers is performed.

摘要翻译： 在真空传送室中，布置有用于检测半导体晶片的位置的位置检测机构。 设置在负载锁定室和真空处理室中的预定位置的半导体晶片通过真空传递机构传送到位置检测机构，并且检测晶片的位置。 然后，基于检测结果，进行负载锁定室与真空处理室的对准。

公开(公告)号：US20080304952A1

公开(公告)日：2008-12-11

申请号：US12094783

申请日：2007-03-12

申请人： Keisuke Kondoh ,  Hiroshi Koizumi

发明人： Keisuke Kondoh ,  Hiroshi Koizumi

IPC分类号： H01L21/68

CPC分类号： H01L21/68 ,  H01L21/67196 ,  H01L21/67259

摘要： In a vacuum transfer chamber 10, a position detecting mechanism 33 for detecting the positions of semiconductor wafers W is arranged. The semiconductor wafers W disposed at predetermined positions in a load lock chamber 17 and vacuum processing chambers 11 to 16 are transferred to the position detecting mechanism 33 by a vacuum transfer mechanism 30 and the positions of the wafers are detected. Then, based on the detection results, aligning between the load lock chamber 17 and the vacuum processing chambers 11 to 16 is performed.

摘要翻译： 在真空传送室10中设置有检测半导体晶片W的位置的位置检测机构33。 设置在负载锁定室17和真空处理室11至16中的预定位置的半导体晶片W通过真空传送机构30传送到位置检测机构33，并且检测晶片的位置。 然后，基于检测结果，进行负载锁定室17与真空处理室11〜16的对准。

公开(公告)号：US08663489B2

公开(公告)日：2014-03-04

申请号：US12732451

申请日：2010-03-26

申请人： Shigeru Ishizawa ,  Hiroshi Koizumi ,  Tatsuya Ogi

发明人： Shigeru Ishizawa ,  Hiroshi Koizumi ,  Tatsuya Ogi

IPC分类号： B44C1/22

CPC分类号： H01L21/67745 ,  H01L21/67748

摘要： A method for replacing plural substrates to be processed by a substrate processing apparatus which includes a substrate processing chamber, a load lock chamber, and a conveying apparatus including first and second conveying members for conveying the plural substrates into and out from the substrate processing chamber and the load lock chamber. The method includes the steps of a) conveying a first substrate out from the substrate processing chamber with the first conveying member, b) conveying a second substrate into the substrate processing chamber with the second conveying member, c) conveying the second substrate out from the load lock chamber with the second conveying member, and d) conveying the first substrate into the load lock chamber with the first conveying member. The steps c) and d) are performed between step a) and step b).

摘要翻译： 一种用于替换多个基板的方法，所述基板处理装置包括基板处理室，负载锁定室和输送装置，所述基板处理装置包括用于将多个基板输入和移出基板处理室的第一和第二输送部件， 负载锁定室。 该方法包括以下步骤：a）用第一输送部件从基板处理室输出第一基板，b）用第二输送部件将第二基板输送到基板处理室中，c）将第二基板从 负载锁定室与第二输送构件，以及d）用第一输送构件将第一基板输送到装载锁定室。 在步骤a）和步骤b）之间执行步骤c）和d）。

公开(公告)号：US08740535B2

公开(公告)日：2014-06-03

申请号：US13079356

申请日：2011-04-04

申请人： Keisuke Kondoh ,  Hiroshi Koizumi

发明人： Keisuke Kondoh ,  Hiroshi Koizumi

IPC分类号： H01L21/677

CPC分类号： H01L21/68 ,  H01L21/67196 ,  H01L21/67259

摘要： In a vacuum transfer chamber, a position detecting mechanism for detecting the positions of semiconductor wafers is arranged. The semiconductor wafers disposed at predetermined positions in a load lock chamber and vacuum processing chambers are transferred to the position detecting mechanism by a vacuum transfer mechanism and the positions of the wafers are detected. Then, based on the detection results, aligning between the load lock chamber and the vacuum processing chambers is performed.

摘要翻译： 在真空传送室中，布置有用于检测半导体晶片的位置的位置检测机构。 设置在负载锁定室和真空处理室中的预定位置的半导体晶片通过真空传递机构传送到位置检测机构，并且检测晶片的位置。 然后，基于检测结果，进行负载锁定室与真空处理室的对准。

公开(公告)号：US07942622B2

公开(公告)日：2011-05-17

申请号：US12094783

申请日：2007-03-12

申请人： Keisuke Kondoh ,  Hiroshi Koizumi

发明人： Keisuke Kondoh ,  Hiroshi Koizumi

IPC分类号： H01L21/68

CPC分类号： H01L21/68 ,  H01L21/67196 ,  H01L21/67259

摘要： In a vacuum transfer chamber 10, a position detecting mechanism 33 for detecting the positions of semiconductor wafers W is arranged. The semiconductor wafers W disposed at predetermined positions in a load lock chamber 17 and vacuum processing chambers 11 to 16 are transferred to the position detecting mechanism 33 by a vacuum transfer mechanism 30 and the positions of the wafers are detected. Then, based on the detection results, aligning between the load lock chamber 17 and the vacuum processing chambers 11 to 16 is performed.

摘要翻译： 在真空传送室10中设置有检测半导体晶片W的位置的位置检测机构33。 设置在负载锁定室17和真空处理室11至16中的预定位置的半导体晶片W通过真空传送机构30传送到位置检测机构33，并且检测晶片的位置。 然后，基于检测结果，进行负载锁定室17与真空处理室11〜16的对准。

公开(公告)号：US20100252532A1

公开(公告)日：2010-10-07

申请号：US12732451

申请日：2010-03-26

申请人： SHIGERU ISHIZAWA ,  Hiroshi Koizumi ,  Tatsuya Ogi

发明人： SHIGERU ISHIZAWA ,  Hiroshi Koizumi ,  Tatsuya Ogi

IPC分类号： C23F1/08 ,  C23C16/458 ,  C23F1/00 ,  C23C16/00

CPC分类号： H01L21/67745 ,  H01L21/67748

摘要： A method for replacing plural substrates to be processed by a substrate processing apparatus which includes a substrate processing chamber, a load lock chamber, and a conveying apparatus including first and second conveying members for conveying the plural substrates into and out from the substrate processing chamber and the load lock chamber. The method includes the steps of a) conveying a first substrate out from the substrate processing chamber with the first conveying member, b) conveying a second substrate into the substrate processing chamber with the second conveying member, c) conveying the second substrate out from the load lock chamber with the second conveying member, and d) conveying the first substrate into the load lock chamber with the first conveying member. The steps c) and d) are performed between step a) and step b).

摘要翻译： 一种用于替换多个基板的方法，所述基板处理装置包括基板处理室，负载锁定室和输送装置，所述基板处理装置包括用于将多个基板输入和移出基板处理室的第一和第二输送部件， 负载锁定室。 该方法包括以下步骤：a）用第一输送部件从基板处理室输出第一基板，b）用第二输送部件将第二基板输送到基板处理室中，c）将第二基板从 负载锁定室与第二输送构件，以及d）用第一输送构件将第一基板输送到装载锁定室。 在步骤a）和步骤b）之间执行步骤c）和d）。

公开(公告)号：US08754429B2

公开(公告)日：2014-06-17

申请号：US13154999

申请日：2011-06-07

申请人： Hiroshi Koizumi ,  Yasuhide Okada ,  Susumu Obata ,  Tomomichi Naka ,  Kazuhito Higuchi ,  Kazuo Shimokawa ,  Yoshiaki Sugizaki ,  Akihiro Kojima

发明人： Hiroshi Koizumi ,  Yasuhide Okada ,  Susumu Obata ,  Tomomichi Naka ,  Kazuhito Higuchi ,  Kazuo Shimokawa ,  Yoshiaki Sugizaki ,  Akihiro Kojima

IPC分类号： H01L33/00 ,  H01L21/00

CPC分类号： H01L33/44 ,  H01L33/0079 ,  H01L33/0095 ,  H01L33/50 ,  H01L33/58 ,  H01L33/62 ,  H01L2224/16 ,  H01L2933/0058

摘要： According to one embodiment, an optical semiconductor device includes a light emitting layer, a transparent layer, a first metal post, a second metal post and a sealing layer. The light emitting layer includes a first and a second major surface, a first and a second electrode. The second major surface is a surface opposite to the first major surface, and the first electrode and second electrodes are formed on the second major surface. The transparent layer is provided on the first major surface. The first metal post is provided on the first electrode. The second metal post is provided on the second electrode. The sealing layer is provided on the second major surface. The sealing layer covers a side surface of the light emitting layer and seals the first and second metal posts while leaving end portions of the first and second metal posts exposed.

摘要翻译： 根据一个实施例，光学半导体器件包括发光层，透明层，第一金属柱，第二金属柱和密封层。 发光层包括第一和第二主表面，第一和第二电极。 第二主表面是与第一主表面相对的表面，并且第一电极和第二电极形成在第二主表面上。 透明层设置在第一主表面上。 第一金属柱设置在第一电极上。 第二金属柱设置在第二电极上。 密封层设置在第二主表面上。 密封层覆盖发光层的侧表面，并且密封第一和第二金属柱，同时使第一和第二金属柱的端部露出。