摘要:
A networking operation dispatch system based on electronic zones for rail vehicle comprises: a zone-end relay computer, a communication ranging antenna along rail, a locomotive-mounted response computer and a road networking computer, wherein: the zone-end relay computer is installed on an end of each electronic zone; the communication ranging antenna along rail has an equivalent length to the electronic zone, a first end of the communication ranging antenna along rail is connected with the zone-end relay computer and a second thereof is disposed in the air; the locomotive-mounted response computer is installed on each locomotive and communicates with the zone-end relay computer in the electronic zone occupied by the locomotive via the communication ranging antenna; and the road networking computer connects each zone-end relay computer to form a network. A rail security detecting sensor is provided in the electronic zone.
摘要:
A networking operation dispatch system based on electronic zones for rail vehicle comprises: a zone-end relay computer, a communication ranging antenna along rail, a locomotive-mounted response computer and a road networking computer, wherein: the zone-end relay computer is installed on an end of each electronic zone; the communication ranging antenna along rail has an equivalent length to the electronic zone, a first end of the communication ranging antenna along rail is connected with the zone-end relay computer and a second thereof is disposed in the air; the locomotive-mounted response computer is installed on each locomotive and communicates with the zone-end relay computer in the electronic zone occupied by the locomotive via the communication ranging antenna; and the road networking computer connects each zone-end relay computer to form a network. A rail security detecting sensor is provided in the electronic zone.
摘要:
The present invention provides a method for improving operation density of rail vehicles and for preventing head-on collision and rear-ending collision. Said method divides a rail line into equidistant electronic zones, the length of a zone being greater than the shortest safe distance between two running vehicles. Said method installs a locomotive passing detection alarm device in each zone, when a locomotive travels at high speed on the rail, the locomotive passing detection alarm device corresponding to the zone occupied by the locomotive itself will simultaneously access adjacent front and back zones, and determine whether the two adjacent zones are simultaneously occupied by locomotives. If the two adjacent. zones are simultaneously occupied by locomotives, the locomotive passing alarm device will send an alarm signal to the locomotives to warn or otherwise take measures. The aforesaid method can avoid locomotive head-on collision and rear-end collision and increase transportation density according to the vehicle speed and distance at the same time, thus improving the transportation efficiency.
摘要:
The present invention provides a method for improving operation density of rail vehicles and for preventing head-on collision and rear-ending collision. Said method divides a rail line into equidistant electronic zones, the length of a zone being greater than the shortest safe distance between two running vehicles. Said method installs a locomotive passing detection alarm device in each zone, when a locomotive travels at high speed on the rail, the locomotive passing detection alarm device corresponding to the zone occupied by the locomotive itself will simultaneously access adjacent front and back zones, and determine whether the two adjacent zones are simultaneously occupied by locomotives. If the two adjacent. zones are simultaneously occupied by locomotives, the locomotive passing alarm device will send an alarm signal to the locomotives to warn or otherwise take measures. The aforesaid method can avoid locomotive head-on collision and rear-end collision and increase transportation density according to the vehicle speed and distance at the same time, thus improving the transportation efficiency.
摘要:
Apparatus, packaging, and methods of manufacture of an integrated circuit are provided. The integrated circuit includes a component of a first type fabricated on a first substrate containing a first material, and a component of a second type fabricated on a second substrate containing a second material. The first material has better compatibility than the second material with fabrication and/or performance of the component of the first type, while the second material has better compatibility than the first material with fabrication and/or performance of the component of the second type. Also described, is a method of making the above-mentioned integrated circuit, the method including, among other steps, the step of disposing the first and second substrates opposite one another, and the step of establishing an electrical connection between the components.
摘要:
Apparatus, packaging, and methods of manufacture of an integrated circuit are provided. The integrated circuit includes a component of a first type fabricated on a first substrate containing a first material, and a component of a second type fabricated on a second substrate containing a second material. The first material has better compatibility than the second material with fabrication and/or performance of the component of the first type, while the second material has better compatibility than the first material with fabrication and/or performance of the component of the second type. Also described, is a method of making the above-mentioned integrated circuit, the method including, among other steps, the step of disposing the first and second substrates opposite one another, and the step of establishing an electrical connection between the components.
摘要:
A device comprises a first substrate, a second substrate and a compliant element. The compliant element is composed of a first, compliant material between the first substrate and the second substrate and has a side surface coated at least in part with a layer of a second material. The compliant element exhibits deformation consistent with the first substrate and a second side having been pressed together. In some embodiments, the second material is electrically conductive such that the compliant element provides a reliable electrical connection between the substrates. In other embodiments, the second material increases the hermeticity of the compliant element such that the compliant element provides a better hermetic seal between the substrates.
摘要:
A micro-machined frit is provided for use in a chromatography column, having a substrate with a thickness, and holes extending through the thickness and providing fluid communication through the substrate. A micro-machined flow distributor is provided for use in a chromatography column having a substrate, holes extending through the substrate, and channels in fluid communication with the holes. A micro-machined integrated frit and flow distributor device is also provided having a substrate with a thickness, holes extending through the thickness and providing fluid communication therethrough, and channels in fluid communication with at least one of the holes. A chromatography column is provided having a tube, an extraction medium contained therein, and a micro-machined frit positioned proximate an end of the tube. The column can include a micro-machined flow distributor positioned between the frit and the end of the tube.
摘要:
A device comprises a first substrate, a second substrate and a compliant element. The compliant element is composed of a first, compliant material between the first substrate and the second substrate and has a side surface coated at least in part with a layer of a second material. The compliant element exhibits deformation consistent with the first substrate and a second side having been pressed together. In some embodiments, the second material is electrically conductive such that the compliant element provides a reliable electrical connection between the substrates. In other embodiments, the second material increases the hermeticity of the compliant element such that the compliant element provides a better hermetic seal between the substrates.
摘要:
A microfabricated device has a first substrate, a second substrate, a film bulk acoustic resonator (FBAR) device, and a circuit. The second substrate is bonded to the first substrate to define a chamber. The FBAR device is located on a surface of the first substrate and inside the chamber. The circuit is located on a surface of the second substrate and inside the chamber. An electrical connection connects the circuit and the FBAR device.