公开(公告)号：US4857746A

公开(公告)日：1989-08-15

申请号：US101617

申请日：1987-09-28

申请人： Werner Kuhlmann ,  Werner Spaeth ,  Guenter Waitl ,  Joerg Klann

发明人： Werner Kuhlmann ,  Werner Spaeth ,  Guenter Waitl ,  Joerg Klann

IPC分类号： G02B6/122 ,  G01V8/12 ,  G02F1/015 ,  G02F1/025 ,  H01L31/0232 ,  H01L31/12 ,  H01L31/167

CPC分类号： G01V8/12 ,  H01L31/167

摘要： In order to manufacture respectively optocouplers or reflex light barriers particularly efficiently, semiconductor light transmitters and semiconductor light receivers are situated on a single substrate. The optic coupling or optic isolation of light transmitter and light receiver takes place in the substrate. Only then are semiconductor elements separated into discrete units.

摘要翻译： 为了特别有效地制造光耦合器或反射光栅，半导体光发射器和半导体光接收器位于单个衬底上。 光发射器和光接收器的光耦合或光隔离发生在衬底中。 只有这样，半导体元件被分离成离散的单元。

公开(公告)号：US4888081A

公开(公告)日：1989-12-19

申请号：US126067

申请日：1987-11-27

申请人： Hans Althaus ,  Werner Kuhlmann ,  Werner Spaeth

发明人： Hans Althaus ,  Werner Kuhlmann ,  Werner Spaeth

IPC分类号： G02B6/00 ,  G02B6/42

CPC分类号： G02B6/4204 ,  G02B6/4202 ,  G02B6/4236 ,  G02B6/4238 ,  G02B6/4239 ,  Y10T156/1089 ,  Y10T29/49826 ,  Y10T29/49885 ,  Y10T29/49895 ,  Y10T29/49901

摘要： A method and arrangement for the positioning and bonding of a solid body (2), in which one part of the solid body (2) together with the bonding agent (6) is to be attached to a further element (7) and bonded to a base (4) is to be capable of positioning the solid body (2), at the point attained after positioning, with both high precision and high long term stability. The solid body (2) is immersed in the bonding agent (6) and this bonding agent is in turn located in a groove of a further electrically conducting body (7). The further body (7) is heated by current flow to a temperature at which the solid body (2) is movable within the bonding agent. Upon attaining the desired positioning of the solid body (2), the bonding agent is allowed to cool through controlled reduction of the heating current until solidification occurs.

摘要翻译： 固体（2）的定位和结合的方法和装置，其中固体（2）与粘合剂（6）一起的一部分将附着到另一元件（7）上，并粘合到 基座（4）能够将定位后的固体（2）定位在高精度和高长期稳定性的位置。 将固体（2）浸渍在粘合剂（6）中，并且该粘合剂又位于另一个导电体（7）的凹槽中。 另外的主体（7）通过电流流动被加热到固体（2）可以在粘合剂内移动的温度。 在获得固体（2）的所需定位后，通过控制的加热电流的降低使粘合剂冷却，直到发生凝固。

公开(公告)号：US5654559A

公开(公告)日：1997-08-05

申请号：US637581

申请日：1996-04-25

申请人： Werner Spaeth ,  Norbert Stath ,  Ernst Nirschl ,  Walter Wegleiter ,  Werner Kuhlmann ,  Rudolf Buchberger

发明人： Werner Spaeth ,  Norbert Stath ,  Ernst Nirschl ,  Walter Wegleiter ,  Werner Kuhlmann ,  Rudolf Buchberger

IPC分类号： H01L23/48 ,  H01L25/065 ,  H01L31/173 ,  H01L31/167

CPC分类号： H01L23/48 ,  H01L31/173 ,  H01L2224/48463

摘要： An optical coupling device and method for manufacturing the same is disclosed wherein a light-emitting semiconductor transmitter chip is secured to a light-detecting semiconductor receiver chip via a transparent insulating layer, a structured spacer layer and a transparent connecting layer. The resultant optocoupler has a high coupling factor and may be reliably manufactured into SMT compatible packages.

摘要翻译： 公开了一种光耦合器件及其制造方法，其中通过透明绝缘层，结构化间隔层和透明连接层将发光半导体发射器芯片固定到光检测半导体接收器芯片。 所得的光耦合器具有高耦合系数，并且可以可靠地制造成与SMT兼容的封装。

公开(公告)号：US4741796A

公开(公告)日：1988-05-03

申请号：US855275

申请日：1986-04-24

申请人： Hans Althaus ,  Werner Kuhlmann ,  Werner Spaeth

发明人： Hans Althaus ,  Werner Kuhlmann ,  Werner Spaeth

IPC分类号： G02B6/00 ,  G02B6/42 ,  B29C65/02 ,  B29C65/04 ,  B29C65/14 ,  B29C65/18

CPC分类号： G02B6/4204 ,  G02B6/4202 ,  G02B6/4236 ,  G02B6/4238 ,  G02B6/4239 ,  Y10T156/1089 ,  Y10T29/49826 ,  Y10T29/49885 ,  Y10T29/49895 ,  Y10T29/49901

摘要： A method and arrangement for the positioning and bonding of a solid body (2), in which one part of the solid body (2) together with the bonding agent (6) is to be attached to a further element (7) and bonded to a base (4) is to be capable of positioning the solid body (2), at the point attained from positioning, with both high precision and high long term stability. The solid body (2) is immersed in the bonding agent (6) and this bonding agent is in turn located in a groove of a further electrically conducting body (7). The further body (7) is heated by current flow to a temperature at which the solid body (2) is movable within the bonding agent. Upon attaining the desired positioning of the solid body (2), the bonding agent is allowed to cool through controlled reduction of the heating current until solidification occurs.

摘要翻译： 固体（2）的定位和结合的方法和装置，其中固体（2）与粘合剂（6）一起的一部分将附着到另一元件（7）上，并粘合到 基座（4）能够在从定位获得的位置上以高精度和高长期稳定性定位固体（2）。 将固体（2）浸渍在粘合剂（6）中，并且该粘合剂又位于另一个导电体（7）的凹槽中。 另外的主体（7）通过电流流动被加热到固体（2）可以在粘合剂内移动的温度。 在获得固体（2）的所需定位后，通过控制的加热电流的降低使粘合剂冷却，直到发生凝固。

公开(公告)号：US4875750A

公开(公告)日：1989-10-24

申请号：US151372

申请日：1988-02-02

申请人： Werner Spaeth ,  Guenther Waitl ,  Werner Kuhlmann ,  Hans-Ludwig Althaus ,  Rolf Birkmann ,  Waltraud Klos ,  Axel Schubert

发明人： Werner Spaeth ,  Guenther Waitl ,  Werner Kuhlmann ,  Hans-Ludwig Althaus ,  Rolf Birkmann ,  Waltraud Klos ,  Axel Schubert

IPC分类号： G02B6/32 ,  G02B6/36 ,  G02B6/42

CPC分类号： G02B6/4249 ,  G02B6/4204

摘要： An optoelectronic coupling element and method for manufacturing the coupling element. The coupling element includes a light wave guide, a microlens, a first carrier chip and a light emitting and/or light detecting semiconductor element. The microlens is preferably spherical in shape and is adapted for optically coupling the light wave guide and the semiconductor element. The semiconductor element can be part of the first carrier chip or, according to another embodiment, can be part of a second carrier chip. The purpose of this coupling element is to facilitate the precise mounting of the microlens in a position between the light wave guide and the semiconductor element and also facilitate the adjustment of the microlens to optimally perform its light coupling function. The method for manufacturing the coupling element provides for the formation of a receptacle having trapezoidal shape sides in the carrier chip. The microlens is mounted within the receptacle with a connecting medium such as glass. The size of the receptacle is determined by the size of the microlens and the point of contact between the microlens and carrier. Applications of the optoelectronic coupling element according to the invention are, in particular, in LED transmitter structural elements, receiver structural elements and laser modules. This method of production substantially avoids impairment of the carrier chip due to effects such as mechanical deformation. Additionally, this type of coupling element can be mass-produced cost-effectively in spite of the miniature size of these components.

摘要翻译： 一种用于制造耦合元件的光电耦合元件和方法。 耦合元件包括光波导，微透镜，第一载体芯片和发光和/或光检测半导体元件。 微透镜的形状优选为球形，并且适于光学耦合光波导和半导体元件。 半导体元件可以是第一载体芯片的一部分，或者根据另一实施例，半导体元件可以是第二载体芯片的一部分。 该耦合元件的目的是便于将微透镜精确地安装在光波导和半导体元件之间的位置，并且还便于微透镜的调节以最佳地执行其光耦合功能。 用于制造耦合元件的方法提供了在载体芯片中形成具有梯形形状侧面的插座。 微透镜用诸如玻璃的连接介质安装在容器内。 容器的尺寸由微透镜的尺寸和微透镜与载体之间的接触点决定。 根据本发明的光电耦合元件的应用尤其在LED发射机结构元件，接收器结构元件和激光模块中。 这种生产方法基本上避免了由于诸如机械变形的影响而导致的载体芯片的损伤。 另外，尽管这些部件的尺寸很小，但是这种类型的联接元件可以经济高效地批量生产。

公开(公告)号：US5020873A

公开(公告)日：1991-06-04

申请号：US406662

申请日：1989-09-13

申请人： Hans Althaus ,  Werner Kuhlmann ,  Werner Spaeth

发明人： Hans Althaus ,  Werner Kuhlmann ,  Werner Spaeth

IPC分类号： G02B6/00 ,  G02B6/42

CPC分类号： G02B6/4204 ,  G02B6/4202 ,  G02B6/4236 ,  G02B6/4238 ,  G02B6/4239 ,  Y10T156/1089 ,  Y10T29/49826 ,  Y10T29/49885 ,  Y10T29/49895 ,  Y10T29/49901

摘要： A method and arrangement for the positioning and bonding of a solid body (2) in which one part of the solid body (2) together with the bonding agent (6) is to be attached to a further element (7) and bonded to a base (4) is to be capable of positioning the solid body (2), at the point attained after positioning, with both high precision and high long term stability. The solid body (2) is immersed in the bonding agent (6) and this bonding agent is in turn located in a groove of a further electrically conducting body (7). The further body (7) is heated by current flow to a temperature at which the solid body (2) is movable within the bonding agent. Upon attaining the desired positioning of the solid body (2), the bonding agent is allowed to cool through controlled reduction of the heating current until solidification occurs.

公开(公告)号：US20050162993A1

公开(公告)日：2005-07-28

申请号：US11025682

申请日：2004-12-28

申请人： Stephen Farnsworth ,  Werner Spaeth ,  Kirk Cook

发明人： Stephen Farnsworth ,  Werner Spaeth ,  Kirk Cook

IPC分类号： G11B5/596 ,  G11B7/00

CPC分类号： G11B5/59677

摘要： A lensless optical servo system (100) has an unfocused light source (102) and patterned photodetectors (104, 106, 108). The unfocused light is reflected by the markings on an LS-120 disk (40) and the reflected light carries the pattern of the markings the considerable distance in its far-field to the photodetectors (104, 106, 108). The convolution of this light pattern and a mating geometric pattern (110, 112, 114) on the photodetectors (104, 106, 108) causes the photodetectors to generate signals representing the position of the track on the disk. According to a presently preferred embodiment, a laser diode (102) and three detectors (104, 106, 108) are formed on the same silicon substrate (101). Sinusoidal metalization (110, 112, 114) is applied to the detectors (104, 106, 108) in the radial direction. The period of the sinusoidal metalization is two times the tracking pitch of the disk radially and tangentially. The metalization on the first detector is approximately ninety degrees behind the metalization on the second detector and the metalization on the third detector is approximately ninety degrees ahead of the metalization on the second detector. Preferably, each detector (104, 106, 108) is provided with two sinusoidal patterns (110a, 110b, 112a, 112b, 114a, 114b), approximately one hundred eighty degrees out of phase with each other, and spaced apart in the tangential direction.

摘要翻译： 无镜头光学伺服系统（100）具有未聚焦光源（102）和图案化光电检测器（104,106,108）。 未聚焦的光被LS-120盘（40）上的标记反射，并且反射光将其远场中的相当距离的标记的图案携带到光电检测器（104,106,108）。 这种光图案和在光电检测器（104,106,108）上的匹配几何图案（110,112,114）的卷积导致光电检测器产生表示盘上磁道位置的信号。 根据目前优选的实施例，激光二极管（102）和三个检测器（104,106,108）形成在同一硅衬底（101）上。 在径向上将正弦金属化（110,112,114）施加到检测器（104,106,108）。 正弦金属化的周期是径向和切向的盘的跟踪间距的两倍。 第一检测器上的金属化在第二检测器上的金属化之后大约九十度，并且第三检测器上的金属化比第二检测器上的金属化大约九十度。 优选地，每个检测器（104,106,108）被提供有彼此相差近似180度的两个正弦图案（110a，110b，112a，112b，114a，114b），以及 沿切线方向间隔开。

公开(公告)号：US06240232B1

公开(公告)日：2001-05-29

申请号：US09155632

申请日：1998-09-29

申请人： Hartmut Schneider ,  Werner Spaeth ,  Stefan Groetsch

发明人： Hartmut Schneider ,  Werner Spaeth ,  Stefan Groetsch

IPC分类号： G02B610

CPC分类号： G02B6/4249 ,  G02B6/122 ,  G02B6/136

摘要： Process for the production of a waveguide beam converter for shaping a laser beam collection. A plurality of waveguides are produced and arranged in such a way that at least one individual laser beam can be injected into each waveguide. The waveguides are firstly produced on a substrate using planar technology, and subsequently detached from the substrate over a part of their length, starting from their beam exit ends. The free ends are then arranged and fixed in accordance with an intended output beam arrangement of the output laser beam collection.

摘要翻译： 用于制造用于成形激光束收集的波导束转换器的方法。 制造并布置多个波导，使得至少一个单独的激光束可以被注入到每个波导中。 首先使用平面技术在衬底上制造波导，然后从它们的光束出射端开始，在其长度的一部分上从衬底上分离波导。 然后根据输出激光束收集的预期输出光束布置来布置和固定自由端。

公开(公告)号：US6021238A

公开(公告)日：2000-02-01

申请号：US941371

申请日：1997-09-30

申请人： Werner Spaeth

发明人： Werner Spaeth

IPC分类号： G02B6/32 ,  G02B6/42 ,  H01S5/00 ,  H04B10/02 ,  H04B10/28 ,  G02B6/26 ,  G02B6/36

CPC分类号： G02B6/4246 ,  G02B6/4204 ,  G02B6/4214

摘要： An optoelectronic module for bidirectional optical data transmission includes a molded part acting as a beam-splitter device, formed substantially of a material transparent to emitted radiation and received radiation and having a beam-splitter layer embedded therein. A transmit component, a receive component and a radiation-focusing device are directly connected to the molded part and are provided with a sealing jacket.

摘要翻译： 用于双向光学数据传输的光电子模块包括用作分束器装置的模制部件，其基本上由对发射的辐射和接收的辐射透明的材料形成并且具有嵌入其中的分束器层。 发射部件，接收部件和辐射聚焦装置直接连接到模制部件并且设置有密封护套。

公开(公告)号：US5999552A

公开(公告)日：1999-12-07

申请号：US9606

申请日：1998-01-20

申请人： Georg Bogner ,  Herbert Brunner ,  Heinz Haas ,  Johann Luft ,  Ernst Nirschl ,  Werner Spaeth ,  Norbert Stath ,  Wolfgang Teich

发明人： Georg Bogner ,  Herbert Brunner ,  Heinz Haas ,  Johann Luft ,  Ernst Nirschl ,  Werner Spaeth ,  Norbert Stath ,  Wolfgang Teich

IPC分类号： H01L33/56 ,  H01S3/00 ,  H01S5/00 ,  H01S5/022 ,  H01S3/18 ,  H01L33/00

CPC分类号： H01S5/02244 ,  H01S5/02228 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/181 ,  H01L2933/0091 ,  H01L33/56

摘要： A radiation emitter component, in particular an infrared emitter component with a conventional light-emitting diode housing, includes two electrode connections, one of which has a well-shaped reflector. The housing has an optically transparent, electrically non-conducting encapsulation material. A semiconductor laser chip is fastened in a well-shaped reflector of the light-emitting diode housing. The semiconductor laser chip has a quantum well structure, in particular with a strained layer structure, for example MOVPE epitaxial layers with a layer sequence GaAlAs-InGaAs-GaAlAs. A diffusor material can be inserted into the optically transparent, electrically non-conducting material of the light-emitting diode housing. The diffusor material is constructed or inserted with regard to type and concentration in such a way that in connection with the semiconductor laser chip encapsulated in the light-emitting diode housing, a radiation characteristic curve or an increase of an effective emission surface is produced that is comparable to that of a conventional infrared light-emitting diode.

摘要翻译： 辐射发射器部件，特别是具有传统发光二极管外壳的红外发射器部件包括两个电极连接件，其中之一具有良好形状的反射器。 壳体具有光学透明的非导电封装材料。 将半导体激光芯片紧固在发光二极管壳体的形状好的反射器中。 半导体激光芯片具有量子阱结构，特别是具有应变层结构，例如具有层序列GaAlAs-InGaAs-GaAlAs的MOVPE外延层。 漫射材料可以插入到发光二极管外壳的光学透明的非导电材料中。 关于类型和浓度来构造或插入扩散材料，使得与封装在发光二极管外壳中的半导体激光器芯片有关，产生辐射特性曲线或有效发射表面的增加，即， 与传统的红外发光二极管相当。