公开(公告)号：US4857746A

公开(公告)日：1989-08-15

申请号：US101617

申请日：1987-09-28

申请人： Werner Kuhlmann ,  Werner Spaeth ,  Guenter Waitl ,  Joerg Klann

发明人： Werner Kuhlmann ,  Werner Spaeth ,  Guenter Waitl ,  Joerg Klann

IPC分类号： G02B6/122 ,  G01V8/12 ,  G02F1/015 ,  G02F1/025 ,  H01L31/0232 ,  H01L31/12 ,  H01L31/167

CPC分类号： G01V8/12 ,  H01L31/167

摘要： In order to manufacture respectively optocouplers or reflex light barriers particularly efficiently, semiconductor light transmitters and semiconductor light receivers are situated on a single substrate. The optic coupling or optic isolation of light transmitter and light receiver takes place in the substrate. Only then are semiconductor elements separated into discrete units.

摘要翻译： 为了特别有效地制造光耦合器或反射光栅，半导体光发射器和半导体光接收器位于单个衬底上。 光发射器和光接收器的光耦合或光隔离发生在衬底中。 只有这样，半导体元件被分离成离散的单元。

公开(公告)号：US4888081A

公开(公告)日：1989-12-19

申请号：US126067

申请日：1987-11-27

申请人： Hans Althaus ,  Werner Kuhlmann ,  Werner Spaeth

发明人： Hans Althaus ,  Werner Kuhlmann ,  Werner Spaeth

IPC分类号： G02B6/00 ,  G02B6/42

CPC分类号： G02B6/4204 ,  G02B6/4202 ,  G02B6/4236 ,  G02B6/4238 ,  G02B6/4239 ,  Y10T156/1089 ,  Y10T29/49826 ,  Y10T29/49885 ,  Y10T29/49895 ,  Y10T29/49901

摘要： A method and arrangement for the positioning and bonding of a solid body (2), in which one part of the solid body (2) together with the bonding agent (6) is to be attached to a further element (7) and bonded to a base (4) is to be capable of positioning the solid body (2), at the point attained after positioning, with both high precision and high long term stability. The solid body (2) is immersed in the bonding agent (6) and this bonding agent is in turn located in a groove of a further electrically conducting body (7). The further body (7) is heated by current flow to a temperature at which the solid body (2) is movable within the bonding agent. Upon attaining the desired positioning of the solid body (2), the bonding agent is allowed to cool through controlled reduction of the heating current until solidification occurs.

摘要翻译： 固体（2）的定位和结合的方法和装置，其中固体（2）与粘合剂（6）一起的一部分将附着到另一元件（7）上，并粘合到 基座（4）能够将定位后的固体（2）定位在高精度和高长期稳定性的位置。 将固体（2）浸渍在粘合剂（6）中，并且该粘合剂又位于另一个导电体（7）的凹槽中。 另外的主体（7）通过电流流动被加热到固体（2）可以在粘合剂内移动的温度。 在获得固体（2）的所需定位后，通过控制的加热电流的降低使粘合剂冷却，直到发生凝固。

公开(公告)号：US5654559A

公开(公告)日：1997-08-05

申请号：US637581

申请日：1996-04-25

申请人： Werner Spaeth ,  Norbert Stath ,  Ernst Nirschl ,  Walter Wegleiter ,  Werner Kuhlmann ,  Rudolf Buchberger

发明人： Werner Spaeth ,  Norbert Stath ,  Ernst Nirschl ,  Walter Wegleiter ,  Werner Kuhlmann ,  Rudolf Buchberger

IPC分类号： H01L23/48 ,  H01L25/065 ,  H01L31/173 ,  H01L31/167

CPC分类号： H01L23/48 ,  H01L31/173 ,  H01L2224/48463

摘要： An optical coupling device and method for manufacturing the same is disclosed wherein a light-emitting semiconductor transmitter chip is secured to a light-detecting semiconductor receiver chip via a transparent insulating layer, a structured spacer layer and a transparent connecting layer. The resultant optocoupler has a high coupling factor and may be reliably manufactured into SMT compatible packages.

摘要翻译： 公开了一种光耦合器件及其制造方法，其中通过透明绝缘层，结构化间隔层和透明连接层将发光半导体发射器芯片固定到光检测半导体接收器芯片。 所得的光耦合器具有高耦合系数，并且可以可靠地制造成与SMT兼容的封装。

公开(公告)号：US4741796A

公开(公告)日：1988-05-03

申请号：US855275

申请日：1986-04-24

申请人： Hans Althaus ,  Werner Kuhlmann ,  Werner Spaeth

发明人： Hans Althaus ,  Werner Kuhlmann ,  Werner Spaeth

IPC分类号： G02B6/00 ,  G02B6/42 ,  B29C65/02 ,  B29C65/04 ,  B29C65/14 ,  B29C65/18

CPC分类号： G02B6/4204 ,  G02B6/4202 ,  G02B6/4236 ,  G02B6/4238 ,  G02B6/4239 ,  Y10T156/1089 ,  Y10T29/49826 ,  Y10T29/49885 ,  Y10T29/49895 ,  Y10T29/49901

摘要： A method and arrangement for the positioning and bonding of a solid body (2), in which one part of the solid body (2) together with the bonding agent (6) is to be attached to a further element (7) and bonded to a base (4) is to be capable of positioning the solid body (2), at the point attained from positioning, with both high precision and high long term stability. The solid body (2) is immersed in the bonding agent (6) and this bonding agent is in turn located in a groove of a further electrically conducting body (7). The further body (7) is heated by current flow to a temperature at which the solid body (2) is movable within the bonding agent. Upon attaining the desired positioning of the solid body (2), the bonding agent is allowed to cool through controlled reduction of the heating current until solidification occurs.

摘要翻译： 固体（2）的定位和结合的方法和装置，其中固体（2）与粘合剂（6）一起的一部分将附着到另一元件（7）上，并粘合到 基座（4）能够在从定位获得的位置上以高精度和高长期稳定性定位固体（2）。 将固体（2）浸渍在粘合剂（6）中，并且该粘合剂又位于另一个导电体（7）的凹槽中。 另外的主体（7）通过电流流动被加热到固体（2）可以在粘合剂内移动的温度。 在获得固体（2）的所需定位后，通过控制的加热电流的降低使粘合剂冷却，直到发生凝固。

公开(公告)号：US4875750A

公开(公告)日：1989-10-24

申请号：US151372

申请日：1988-02-02

申请人： Werner Spaeth ,  Guenther Waitl ,  Werner Kuhlmann ,  Hans-Ludwig Althaus ,  Rolf Birkmann ,  Waltraud Klos ,  Axel Schubert

发明人： Werner Spaeth ,  Guenther Waitl ,  Werner Kuhlmann ,  Hans-Ludwig Althaus ,  Rolf Birkmann ,  Waltraud Klos ,  Axel Schubert

IPC分类号： G02B6/32 ,  G02B6/36 ,  G02B6/42

CPC分类号： G02B6/4249 ,  G02B6/4204

摘要： An optoelectronic coupling element and method for manufacturing the coupling element. The coupling element includes a light wave guide, a microlens, a first carrier chip and a light emitting and/or light detecting semiconductor element. The microlens is preferably spherical in shape and is adapted for optically coupling the light wave guide and the semiconductor element. The semiconductor element can be part of the first carrier chip or, according to another embodiment, can be part of a second carrier chip. The purpose of this coupling element is to facilitate the precise mounting of the microlens in a position between the light wave guide and the semiconductor element and also facilitate the adjustment of the microlens to optimally perform its light coupling function. The method for manufacturing the coupling element provides for the formation of a receptacle having trapezoidal shape sides in the carrier chip. The microlens is mounted within the receptacle with a connecting medium such as glass. The size of the receptacle is determined by the size of the microlens and the point of contact between the microlens and carrier. Applications of the optoelectronic coupling element according to the invention are, in particular, in LED transmitter structural elements, receiver structural elements and laser modules. This method of production substantially avoids impairment of the carrier chip due to effects such as mechanical deformation. Additionally, this type of coupling element can be mass-produced cost-effectively in spite of the miniature size of these components.

摘要翻译： 一种用于制造耦合元件的光电耦合元件和方法。 耦合元件包括光波导，微透镜，第一载体芯片和发光和/或光检测半导体元件。 微透镜的形状优选为球形，并且适于光学耦合光波导和半导体元件。 半导体元件可以是第一载体芯片的一部分，或者根据另一实施例，半导体元件可以是第二载体芯片的一部分。 该耦合元件的目的是便于将微透镜精确地安装在光波导和半导体元件之间的位置，并且还便于微透镜的调节以最佳地执行其光耦合功能。 用于制造耦合元件的方法提供了在载体芯片中形成具有梯形形状侧面的插座。 微透镜用诸如玻璃的连接介质安装在容器内。 容器的尺寸由微透镜的尺寸和微透镜与载体之间的接触点决定。 根据本发明的光电耦合元件的应用尤其在LED发射机结构元件，接收器结构元件和激光模块中。 这种生产方法基本上避免了由于诸如机械变形的影响而导致的载体芯片的损伤。 另外，尽管这些部件的尺寸很小，但是这种类型的联接元件可以经济高效地批量生产。

公开(公告)号：US5020873A

公开(公告)日：1991-06-04

申请号：US406662

申请日：1989-09-13

申请人： Hans Althaus ,  Werner Kuhlmann ,  Werner Spaeth

发明人： Hans Althaus ,  Werner Kuhlmann ,  Werner Spaeth

IPC分类号： G02B6/00 ,  G02B6/42

CPC分类号： G02B6/4204 ,  G02B6/4202 ,  G02B6/4236 ,  G02B6/4238 ,  G02B6/4239 ,  Y10T156/1089 ,  Y10T29/49826 ,  Y10T29/49885 ,  Y10T29/49895 ,  Y10T29/49901

摘要： A method and arrangement for the positioning and bonding of a solid body (2) in which one part of the solid body (2) together with the bonding agent (6) is to be attached to a further element (7) and bonded to a base (4) is to be capable of positioning the solid body (2), at the point attained after positioning, with both high precision and high long term stability. The solid body (2) is immersed in the bonding agent (6) and this bonding agent is in turn located in a groove of a further electrically conducting body (7). The further body (7) is heated by current flow to a temperature at which the solid body (2) is movable within the bonding agent. Upon attaining the desired positioning of the solid body (2), the bonding agent is allowed to cool through controlled reduction of the heating current until solidification occurs.

公开(公告)号：US20100097609A1

公开(公告)日：2010-04-22

申请号：US12516831

申请日：2007-11-29

申请人： Arndt Jaeger ,  Peter Stauss ,  Klaus Streubel ,  Werner Kuhlmann

发明人： Arndt Jaeger ,  Peter Stauss ,  Klaus Streubel ,  Werner Kuhlmann

IPC分类号： G01J3/50

CPC分类号： G01J1/4228 ,  G01J1/0488 ,  G01J3/36 ,  G01J3/46 ,  G01J3/465 ,  G01J3/50 ,  G01J3/51 ,  G01J3/513 ,  G01J2003/507 ,  H01L31/105

摘要： A radiation detector is disclosed with a detector arrangement, which has a plurality of detector elements, by means of which a detector signal is obtained during operation of the radiation detector, and with a control device, wherein the detector elements each have a spectral sensitivity distribution, and are suited for generating signals. At least one detector element includes a compound semiconductor material, and this detector element is designed for detecting radiation in the visible spectral region. The radiation detector is designed such that the sensitivity distributions of the detector elements are used to form different spectral sensitivity channels of the radiation detector. A channel signal assigned to the respective sensitivity channel can be generated in these sensitivity channels using the detector elements, and the control device is designed such that the contributions of different channel signals to the detector signal of the radiation detector are differently controlled.

摘要翻译： 公开了一种具有检测器装置的检测器装置，其具有多个检测器元件，通过该检测器元件在放射线检测器的操作期间获得检测器信号，并且具有控制装置，其中检测器元件各自具有光谱灵敏度分布 ，并且适于产生信号。 至少一个检测器元件包括化合物半导体材料，并且该检测器元件被设计用于检测可见光谱区域中的辐射。 辐射检测器被设计成使得检测器元件的灵敏度分布用于形成辐射检测器的不同光谱灵敏度通道。 可以使用检测器元件在这些灵敏度通道中产生分配给相应灵敏度通道的通道信号，并且控制装置被设计成使得不同通道信号对辐射检测器的检测器信号的贡献被不同地控制。

公开(公告)号：US07582909B2

公开(公告)日：2009-09-01

申请号：US11450902

申请日：2006-06-09

申请人： Melanie Ring ,  Benjamin Prodinger ,  Werner Kuhlmann

发明人： Melanie Ring ,  Benjamin Prodinger ,  Werner Kuhlmann

IPC分类号： H01L27/15 ,  H01L31/12 ,  H01L33/00

CPC分类号： H01L23/485 ,  H01L23/147 ,  H01L24/33 ,  H01L24/45 ,  H01L24/48 ,  H01L24/83 ,  H01L33/62 ,  H01L2224/2919 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2224/8389 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01032 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/0665 ,  H01L2924/07811 ,  H01L2924/12041 ,  H01L2924/12043 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207

摘要： An assembly and adhesive layer for semiconductor components is arranged between a silicon support (submount) and an electronic functional element for the formation of an electrically-conducting connection between the silicon support and the functional element. The assembly and adhesive layer are arranged on the support. The assembly and adhesive layer are made from a Ti/TiN layer (6), applied to an aluminum contact surface (5) of the silicon support (1), by means of a deposition method. The aluminum contact surface (5) is located on a landing pad (2) on the silicon support (1).

摘要翻译： 用于半导体部件的组装和粘合剂层被布置在硅支撑件（基座）和用于在硅支撑件和功能元件之间形成导电连接的电子功能元件之间。 组件和粘合剂层布置在支撑件上。 组装和粘合层由通过沉积方法施加到硅载体（1）的铝接触表面（5）上的Ti / TiN层（6）制成。 铝接触表面（5）位于硅支撑件（1）上的定位垫（2）上。

公开(公告)号：US5990499A

公开(公告)日：1999-11-23

申请号：US163599

申请日：1998-09-28

申请人： Werner Kuhlmann ,  Norbert Stath ,  Hans-Ludwig Althaus ,  Werner Spath

发明人： Werner Kuhlmann ,  Norbert Stath ,  Hans-Ludwig Althaus ,  Werner Spath

IPC分类号： H01L33/64 ,  H01S5/00 ,  H01S5/026 ,  H01L33/00

CPC分类号： H01L33/641 ,  H01L25/167 ,  H01L2224/48464

摘要： An integrated semiconductor circuit has a component formed of a semiconductor substrate with an active pn junction formed between a first semiconductor region of a first conductivity type and a second semiconductor region of a second conductivity type. The semiconductor circuit also has a protective circuit that is associated with the component and serves to dissipate overvoltages and/or electrostatic charges. The protective circuit has a protective pn junction formed in a semiconductor mount with a first semiconductor mount region of the first conductivity type and a second semiconductor mount region of the second conductivity type. The second semiconductor mount region of the second conductivity type is electrically coupled to the first semiconductor region formed in the semiconductor substrate of the first conductivity type.

摘要翻译： 集成半导体电路具有由在第一导电类型的第一半导体区域和第二导电类型的第二半导体区域之间形成的具有活性pn结的半导体衬底形成的部件。 半导体电路还具有与部件相关联的保护电路，并用于消除过电压和/或静电电荷。 保护电路具有形成在具有第一导电类型的第一半导体安装区域和第二导电类型的第二半导体安装区域的半导体安装件中的保护性pn结。 第二导电类型的第二半导体安装区域电耦合到形成在第一导电类型的半导体衬底中的第一半导体区域。

公开(公告)号：US5498546A

公开(公告)日：1996-03-12

申请号：US392757

申请日：1995-02-24

申请人： Werner Kuhlmann ,  Hans-Willi Kling

发明人： Werner Kuhlmann ,  Hans-Willi Kling

IPC分类号： G01N31/00 ,  D06F35/00 ,  D06L1/12 ,  G01N31/22 ,  G01N1/00 ,  G01N33/00 ,  G01N35/08

CPC分类号： G01N31/22 ,  Y10T436/117497 ,  Y10T436/12 ,  Y10T436/25125

摘要： A process for determining the concentration of washing-active substances in a wash liquor involving the steps of:(a) preparing a wash liquor containing washing-active substances;(b) adding a reducing sugar to the wash liquor in an amount proportional to the washing-active substances present in the wash liquor; and(c) measuring the content of reducing sugar present in the wash liquor.

摘要翻译： PCT No.PCT / EP93 / 02170 371日期：1995年2月24日 102（e）1995年2月24日PCT PCT 1993年8月16日PCT公布。 第WO94 / 04741号公报 1。一种确定洗涤液中洗涤活性物质浓度的方法，包括以下步骤：（a）制备含有洗涤活性物质的洗涤液; （b）以与洗涤液中存在的洗涤活性物质成比例的量向洗涤液中加入还原糖; 和（c）测量洗涤液中存在的还原糖的含量。