公开(公告)号：US07728564B2

公开(公告)日：2010-06-01

申请号：US11678373

申请日：2007-02-23

申请人： William Bryce Fricke ,  Aaron Dobbins ,  James P. Steiner ,  Chen Ming Wu ,  Russell Weightman ,  David J. Perreault ,  Ryan Lane ,  Joseph William Sapp ,  Kyle A. McCarter

发明人： William Bryce Fricke ,  Aaron Dobbins ,  James P. Steiner ,  Chen Ming Wu ,  Russell Weightman ,  David J. Perreault ,  Ryan Lane ,  Joseph William Sapp ,  Kyle A. McCarter

IPC分类号： G05F1/455 ,  H02J3/12

CPC分类号： H05B39/08 ,  H02J7/345 ,  H02M5/2573

摘要： A load control device is adapted to be disposed in series with an AC voltage source and an electrical load and is operable to provide substantially all voltage provided by the AC voltage source to the load. The load control device comprises a controllably conductive device, a controller, a zero-crossing detector, and a power supply for generating a substantially DC voltage for powering the controller. The power supply is operable to charge an energy storage device to a predetermined amount of energy each half-cycle. The controller is operable to determine when the power supply has stopped charging from the zero-crossing detector each half-cycle, and to immediately render the controllably conductive device conductive to conduct the full load current. Before the controllably conductive device begins to conduct each half-cycle, only a minimal voltage develops across the power supply to allow the energy storage device to charge.

摘要翻译： 负载控制装置适于与AC电压源和电负载串联设置，并且可操作以将基本上由AC电压源提供的所有电压提供给负载。 负载控制装置包括可控导电装置，控制器，过零检测器和用于产生用于为控制器供电的基本上DC电压的电源。 电源可操作以每半周期将能量存储装置充电至预定量的能量。 控制器可操作以确定电源何时从过零检测器每个半周期停止充电，并且立即使可控导电器件导通以传导满载电流。 在可控制的导电器件开始进行每个半周期之前，在电源上仅产生最小的电压，以允许能量存储器件充电。

公开(公告)号：US20070159153A1

公开(公告)日：2007-07-12

申请号：US11678373

申请日：2007-02-23

申请人： William Fricke ,  Aaron Dobbins ,  James Steiner ,  Chen Wu ,  Russell Weightman ,  David Perreault ,  Ryan Lane ,  Joseph Sapp ,  Kyle McCarter

发明人： William Fricke ,  Aaron Dobbins ,  James Steiner ,  Chen Wu ,  Russell Weightman ,  David Perreault ,  Ryan Lane ,  Joseph Sapp ,  Kyle McCarter

IPC分类号： G05F1/00

CPC分类号： H05B39/08 ,  H02J7/345 ,  H02M5/2573

摘要： A load control device is adapted to be disposed in series with an AC voltage source and an electrical load and is operable to provide substantially all voltage provided by the AC voltage source to the load. The load control device comprises a controllably conductive device, a controller, a zero-crossing detector, and a power supply for generating a substantially DC voltage for powering the controller. The power supply is operable to charge an energy storage device to a predetermined amount of energy each half-cycle. The controller is operable to determine when the power supply has stopped charging from the zero-crossing detector each half-cycle, and to immediately render the controllably conductive device conductive to conduct the full load current. Before the controllably conductive device begins to conduct each half-cycle, only a minimal voltage develops across the power supply to allow the energy storage device to charge.

摘要翻译： 负载控制装置适于与AC电压源和电负载串联设置，并且可操作以将基本上由AC电压源提供的所有电压提供给负载。 负载控制装置包括可控导电装置，控制器，过零检测器和用于产生用于为控制器供电的基本上DC电压的电源。 电源可操作以每半周期将能量存储装置充电至预定量的能量。 控制器可操作以确定电源何时从过零检测器每个半周期停止充电，并且立即使可控导电器件导通以传导满载电流。 在可控制的导电器件开始进行每个半周期之前，在电源上仅产生最小的电压，以允许能量存储器件充电。

公开(公告)号：US20060007159A1

公开(公告)日：2006-01-12

申请号：US11124625

申请日：2005-05-06

申请人： Ryan Lane ,  Eric Hull ,  Tyrol Graham

发明人： Ryan Lane ,  Eric Hull ,  Tyrol Graham

IPC分类号： G09G5/00

CPC分类号： G06F3/021 ,  G06F3/02 ,  G06F3/0202 ,  G06F3/0213 ,  G06F3/0219 ,  G06F3/0221 ,  G06F3/03543 ,  G06F3/0395

摘要： A keyboard can be modified to facilitate use in a variety of applications such as, for example, gaming. Examples of modifications include, but are not limited to, placing a numeric keypad to the left of an alphanumeric keypad, having particular keys with a different color, changing the relative arrangement of keys, adding new keys, and moving functions to different sites on the keyboard.

摘要翻译： 可以修改键盘以便于在各种应用中使用，例如游戏。 修改的示例包括但不限于在数字小键盘的左侧放置数字小键盘，具有不同颜色的特定键，改变键的相对布置，添加新键以及将功能移动到不同的位置上 键盘。

公开(公告)号：US20050184390A1

公开(公告)日：2005-08-25

申请号：US11025486

申请日：2004-12-28

申请人： Justin Gagne ,  Mark Veatch ,  Ryan Lane

发明人： Justin Gagne ,  Mark Veatch ,  Ryan Lane

IPC分类号： H01L23/498 ,  H01L23/50 ,  H05K1/02 ,  H05K1/11 ,  H01L23/52

CPC分类号： H05K1/0231 ,  H01L23/49816 ,  H01L23/49838 ,  H01L23/50 ,  H01L23/552 ,  H01L23/642 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/48095 ,  H01L2224/48227 ,  H01L2224/49111 ,  H01L2224/49113 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01033 ,  H01L2924/0106 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/30107 ,  H01L2924/3025 ,  H05K1/112 ,  H05K2201/09627 ,  H05K2201/10522 ,  H05K2201/10734 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00012

摘要： A high-speed semiconductor device includes a substrate having an upper substrate surface, a lower substrate surface, and a periphery bounding the upper and the lower substrate surfaces, the substrate further having an upper substrate ground trace providing an electrical path to the lower substrate surface through a substrate ground via; an array of solder balls attached to the lower substrate surface, the array of solder balls including a plurality of ground solder balls disposed at the periphery and electrically connected to the substrate ground via.

摘要翻译： 高速半导体器件包括具有上基板表面，下基板表面和限定上基板表面和下基板表面的周边的基板，该基板还具有上基板接地迹线，该上基板接地迹线提供到下基板表面的电路径 通过衬底接地通孔; 连接到下基板表面的焊球的阵列，焊球阵列包括设置在外围并与电路连接到衬底接地通孔的多个接地焊球。

公开(公告)号：US06891275B2

公开(公告)日：2005-05-10

申请号：US10624787

申请日：2003-07-21

申请人： Ryan Lane ,  Edward Reyes ,  Mark Veatch ,  Tom Gregorich

发明人： Ryan Lane ,  Edward Reyes ,  Mark Veatch ,  Tom Gregorich

IPC分类号： H01L23/498 ,  H01L29/40

CPC分类号： H01L23/49838 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05554 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/49171 ,  H01L2224/49433 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01076 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/10162 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： An area array package comprising a die attach area for attaching a die to a substrate, a network of staggered bond fingers, and a network of bond islands for coupling bond wires between the bond islands and die bond pads is provided. A network of package leads, for example, a network of solder balls in a ball grid array, is depopulated to permit greater trace route flexibility and via placement within the substrate. Stacked die and multi-chip packages are also disclosed. A method for accommodating a high pin-count die in an area array package is also included.

摘要翻译： 提供了一种区域阵列封装，其包括用于将管芯附接到衬底的管芯附着区域，交错键合指状物的网络和用于耦合接合岛和管芯接合焊盘之间的接合线的接合岛网络。 封装引线的网络，例如，球栅阵列中的焊球网络被排挤，以允许更大的迹线路径灵活性和通孔放置在基板内。 还公开了堆叠管芯和多芯片封装。 还包括用于容纳区域阵列封装中的高引脚数管芯的方法。

公开(公告)号：US08803305B2

公开(公告)日：2014-08-12

申请号：US12620971

申请日：2009-11-18

申请人： Ratibor Radojcic ,  Arvind Chandrasekaran ,  Ryan Lane

发明人： Ratibor Radojcic ,  Arvind Chandrasekaran ,  Ryan Lane

IPC分类号： H01L23/52 ,  H01L23/538 ,  H01L21/60

CPC分类号： H01L25/0657 ,  H01L24/73 ,  H01L25/105 ,  H01L2224/13025 ,  H01L2224/16146 ,  H01L2224/16227 ,  H01L2224/16265 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/73207 ,  H01L2224/73253 ,  H01L2224/73257 ,  H01L2224/73265 ,  H01L2225/06506 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2924/01029 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19104 ,  H01L2924/30107 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A hybrid interconnect includes a through silicon via and a wire bond. Hybrid interconnects enable better layout of a stacked IC by combining benefits from both interconnect technologies. In one hybrid interconnect, wire bonds couples a second tier die mounted on a first tier die to a redistribution layer in the first tier die. Through silicon vias in the first tier die are coupled to the wire bonds to provide communication. In another hybrid interconnect, a wire bond couples a redistribution layer on a first tier die to a packaging substrate on which the first tier die is mounted. The redistribution layer couples to a second tier die mounted on the first tier die to provide a power supply to the second tier die. Through silicon vias in the first tier die couple to the second tier die to provide communication from the packaging substrate to the second tier die.

摘要翻译： 混合互连包括直通硅通孔和引线接合。 混合互连通过结合互连技术的优势，实现了堆叠式IC的更好布局。 在一个混合互连中，引线接合将安装在第一层管芯上的第二层管芯连接到第一层管芯中的再分配层。 通过第一层芯片中的硅通孔耦合到引线键以提供通信。 在另一个混合互连中，引线接合将第一层管芯上的再分配层与其上安装有第一层管芯的封装衬底连接。 再分配层耦合到安装在第一层管芯上的第二层管芯，以向第二层管芯提供电源。 通过第一层管芯中的硅通孔耦合到第二层管芯以提供从封装衬底到第二层管芯的通信。

公开(公告)号：US20050259070A1

公开(公告)日：2005-11-24

申请号：US11121772

申请日：2005-05-04

申请人： Eric Hull ,  Jeffrey Allison ,  Tyrol Graham ,  Ryan Lane

发明人： Eric Hull ,  Jeffrey Allison ,  Tyrol Graham ,  Ryan Lane

IPC分类号： G06F3/02 ,  G09G5/00 ,  H03K17/94 ,  H03M11/00

CPC分类号： G06F3/021 ,  G06F3/02 ,  G06F3/0202 ,  G06F3/0213 ,  G06F3/0219 ,  G06F3/0221 ,  G06F3/03543 ,  G06F3/0395

摘要： A multi-positional, multi-level user interface system including a keyboard hinged over a base surface for a pointing device such as a mouse. The keyboard and base rotate relative to each other about a hinge axis to reveal the surface, providing a portable keyboard and pointing surface. A kickstand can support the keyboard above the base while in an open position. The keyboard and pointing device can be used with two hands with the system resting in a user's lap. The keyboard can also swivel about an axis other than the hinge axis. The keyboard can swivel 180 degrees for left-handed use, and can be positioned at other detent angles. A mouse can also be stowed on the base with a magnetic, friction, or other coupling. The interface system can further act as a communication hub for other peripheral devices, such as a joystick, to communicate with a computing device.

摘要翻译： 一种多位置多级用户界面系统，包括铰接在用于诸如鼠标的指示装置的基面上的键盘。 键盘和底座围绕铰链轴线相对于彼此旋转以露出表面，提供便携式键盘和指示面。 一个支架可以在打开位置时支撑基座上方的键盘。 键盘和指点设备可以用双手使用，系统休息在用户的膝盖上。 键盘也可以围绕铰链轴线以外的轴线旋转。 键盘可以旋转180度左右使用，并可以定位在其他制动角度。 鼠标也可以用磁力，摩擦力或其他耦合装载在基座上。 接口系统还可以充当用于诸如操纵杆的其它外围设备的通信集线器，以与计算设备进行通信。

公开(公告)号：US20050258981A1

公开(公告)日：2005-11-24

申请号：US11122642

申请日：2005-05-05

申请人： Tyrol Graham ,  Eric Hull ,  Ryan Lane

发明人： Tyrol Graham ,  Eric Hull ,  Ryan Lane

IPC分类号： G06F3/02 ,  G09G5/00 ,  H03K17/94 ,  H03M11/00

CPC分类号： G06F3/021 ,  G06F3/02 ,  G06F3/0202 ,  G06F3/0213 ,  G06F3/0219 ,  G06F3/0221 ,  G06F3/03543 ,  G06F3/0395

摘要： A modified keyboard to facilitate use in a variety of applications such as, for example, gaming is provided. The modified keyboard can include features such as, for example, the relocation of the numeric keypad to the left of an alphanumeric keypad, the change in color of particular keys, the change in relative arrangement of keys, the addition of new keys, and the movement of functions to different sites on the keyboard.

摘要翻译： 提供了一种改进的键盘，以便于在各种应用中使用，例如游戏。 修改的键盘可以包括诸如数字键盘在字母数字键盘的左侧的重新定位，特定键的颜色的改变，键的相对布置的改变，新的键的添加以及 功能移动到键盘上的不同位置。

公开(公告)号：US20110115064A1

公开(公告)日：2011-05-19

申请号：US12620971

申请日：2009-11-18

申请人： Ratibor Radojcic ,  Arvind Chandrasekaran ,  Ryan Lane

发明人： Ratibor Radojcic ,  Arvind Chandrasekaran ,  Ryan Lane

IPC分类号： H01L23/52 ,  H01L23/538 ,  H01L21/60

CPC分类号： H01L25/0657 ,  H01L24/73 ,  H01L25/105 ,  H01L2224/13025 ,  H01L2224/16146 ,  H01L2224/16227 ,  H01L2224/16265 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/73207 ,  H01L2224/73253 ,  H01L2224/73257 ,  H01L2224/73265 ,  H01L2225/06506 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2924/01029 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19104 ,  H01L2924/30107 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A hybrid interconnect includes a through silicon via and a wire bond. Hybrid interconnects enable better layout of a stacked IC by combining benefits from both interconnect technologies. In one hybrid interconnect, wire bonds couples a second tier die mounted on a first tier die to a redistribution layer in the first tier die. Through silicon vias in the first tier die are coupled to the wire bonds to provide communication. In another hybrid interconnect, a wire bond couples a redistribution layer on a first tier die to a packaging substrate on which the first tier die is mounted. The redistribution layer couples to a second tier die mounted on the first tier die to provide a power supply to the second tier die. Through silicon vias in the first tier die couple to the second tier die to provide communication from the packaging substrate to the second tier die.

摘要翻译： 混合互连包括直通硅通孔和引线接合。 混合互连通过结合互连技术的优势，实现了堆叠式IC的更好布局。 在一个混合互连中，引线接合将安装在第一层管芯上的第二层管芯连接到第一层管芯中的再分配层。 通过第一层芯片中的硅通孔耦合到引线键以提供通信。 在另一个混合互连中，引线接合将第一层管芯上的再分配层与其上安装有第一层管芯的封装衬底连接。 再分配层耦合到安装在第一层管芯上的第二层管芯，以向第二层管芯提供电源。 通过第一层管芯中的硅通孔耦合到第二层管芯以提供从封装衬底到第二层管芯的通信。

公开(公告)号：US07612449B2

公开(公告)日：2009-11-03

申请号：US11025486

申请日：2004-12-28

申请人： Justin Joseph Rosen Gagne ,  Mark Stephen Veatch ,  Ryan Lane

发明人： Justin Joseph Rosen Gagne ,  Mark Stephen Veatch ,  Ryan Lane

IPC分类号： H01L23/52

CPC分类号： H05K1/0231 ,  H01L23/49816 ,  H01L23/49838 ,  H01L23/50 ,  H01L23/552 ,  H01L23/642 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/48095 ,  H01L2224/48227 ,  H01L2224/49111 ,  H01L2224/49113 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01033 ,  H01L2924/0106 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/30107 ,  H01L2924/3025 ,  H05K1/112 ,  H05K2201/09627 ,  H05K2201/10522 ,  H05K2201/10734 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00012

摘要： A high-speed semiconductor device includes a substrate having an upper substrate surface, a lower substrate surface, and a periphery bounding the upper and the lower substrate surfaces, the substrate further having an upper substrate ground trace providing an electrical path to the lower substrate surface through a substrate ground via; an array of solder balls attached to the lower substrate surface, the array of solder balls including a plurality of ground solder balls disposed at the periphery and electrically connected to the substrate ground via.

摘要翻译： 高速半导体器件包括具有上基板表面，下基板表面和限定上基板表面和下基板表面的周边的基板，该基板还具有上基板接地迹线，该上基板接地迹线提供到下基板表面的电路径 通过衬底接地通孔; 连接到下基板表面的焊球的阵列，焊球阵列包括设置在外围并与电路连接到衬底接地通孔的多个接地焊球。