公开(公告)号：US07643910B1

公开(公告)日：2010-01-05

申请号：US10622181

申请日：2003-07-16

申请人： William C. Gustafson ,  Bruce Smetana ,  Jeffery Weiler

发明人： William C. Gustafson ,  Bruce Smetana ,  Jeffery Weiler

IPC分类号： A01G27/00 ,  G05D7/00

CPC分类号： A01G9/24 ,  A01G9/246 ,  G05D7/0688 ,  Y02A40/268

摘要： A spray chamber valve control system for ensuring that coolant is sufficiently available at the intakes of pumps in a spray cooled environment regardless of the attitude, acceleration or deceleration of a spray chassis. The spray chamber valve control system includes a spray chassis with an interior portion for spray cooling electronic devices, a plurality of valves positioned within the inner corners of the spray chassis, and a control unit in communication with the valves for controlling the operation thereof. The control unit ensures that at least one valve is open at all times. The control unit also provides a recovery routine for when only one valve is open during a valve state change.

摘要翻译： 一种喷雾室阀门控制系统，用于确保在喷雾冷却环境中泵的入口处的冷却剂足够可用，而不管喷雾底盘的姿态，加速或减速。 喷雾室阀控制系统包括具有用于喷射冷却电子装置的内部部分的喷雾底盘，以及位于喷雾底盘的内角内的多个阀，以及与阀连通以控制其操作的控制单元。 控制单元确保至少一个阀门始终打开。 控制单元还提供了在阀状态改变期间仅一个阀打开时的恢复程序。

公开(公告)号：US20050230746A1

公开(公告)日：2005-10-20

申请号：US11088551

申请日：2005-03-24

申请人： Richard Eden ,  Bruce Smetana

发明人： Richard Eden ,  Bruce Smetana

IPC分类号： H01L23/482 ,  H01L23/498 ,  H01L23/50 ,  H01L23/64 ,  H01L27/088 ,  H01L29/417 ,  H01L29/423 ,  H01L29/76 ,  H01L29/78 ,  H02M3/335

CPC分类号： H01L24/17 ,  H01L23/4824 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/50 ,  H01L23/642 ,  H01L27/088 ,  H01L29/41725 ,  H01L29/4238 ,  H01L29/78 ,  H01L29/7802 ,  H01L2224/13099 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/0101 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01025 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01037 ,  H01L2924/01038 ,  H01L2924/01039 ,  H01L2924/01041 ,  H01L2924/01042 ,  H01L2924/01043 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01051 ,  H01L2924/01052 ,  H01L2924/01056 ,  H01L2924/01057 ,  H01L2924/01061 ,  H01L2924/01068 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01076 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/01094 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/12032 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15151 ,  H01L2924/15311 ,  H01L2924/15747 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H02M3/33507 ,  H02M3/33576 ,  H02M3/33592 ,  Y02B70/1475 ,  H01L2924/00 ,  H01L2224/0401

摘要： Power semiconductor switching devices, power converters, integrated circuit assemblies, integrated circuitry, power current switching methods, methods of forming a power semiconductor switching device, power conversion methods, power semiconductor switching device packaging methods, and methods of forming a power transistor are described. One exemplary aspect provides a power semiconductor device including a semiconductive substrate having a surface; and a power transistor having a planar configuration and comprising a plurality of electrically coupled sources and a plurality of electrically coupled drains formed using the semiconductive substrate and adjacent the surface.

摘要翻译： 描述了功率半导体开关器件，功率转换器，集成电路组件，集成电路，功率电流切换方法，形成功率半导体开关器件的方法，功率转换方法，功率半导体开关器件封装方法和形成功率晶体管的方法。 一个示例性方面提供一种功率半导体器件，其包括具有表面的半导体衬底; 以及功率晶体管，其具有平面构造并且包括多个电耦合源和使用所述半导体衬底并且邻近所述表面形成的多个电耦合漏极。