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    Process for preparation of extruded patterned frozen confectionery products
    1.
    发明授权
    Process for preparation of extruded patterned frozen confectionery products 失效
    挤出图案冷冻糖果制品的制备方法

    公开(公告)号：US6004606A

    公开(公告)日：1999-12-21

    申请号：US27575

    申请日：1998-02-23

    申请人： William French ,  Josephine E. Lometillo

    发明人： William French ,  Josephine E. Lometillo

    IPC分类号： A23G9/00 ,  A23G9/04 ,  A23G9/24 ,  A23G9/26 ,  A23G9/28 ,  A23G9/32 ,  A23G9/44 ,  A23G9/48 ,  A23G9/52 ,  A23L11/00 ,  A23L11/30 ,  A23P1/12

    CPC分类号： A23G9/48 ,  A23G9/26 ,  A23G9/282 ,  A23G9/285 ,  A23L11/07 ,  A23L11/35

    摘要： A composite ice confectionery product of the frozen type is prepared by pumping an ice composition into a former structure provided with an extrusion die so that the composition contained within the former passes through the former to the die for extrusion via the die and by pumping a material of texture different from that of the aerated ice confectionery through an assembly of a hollow spindle with nozzle(s) attached wherein the nozzle(s) is (are) provided with ports, particularly slots, for delivering the material into the ice confectionery composition stream in the former. The spindle is located and extends along and about an axis of the former within the ice confectionery stream and rotates about the axis and also translates axially in a reciprocating movement so that patterns of the material are formed in the ice confectionery to obtain a composite product having material inclusion zones and inclusion-free zones, and the composite product so-pumped is extruded via the die, to provide a strand which has a cross-section given by the die outlet opening, and then the strand is cut to provide slabs.

    摘要翻译： 通过将冰组合物泵送到设置有挤出模头的前一结构中，使得包含在前者中的组合物经由模头通过模具经由模具挤出并通过泵送材料来制备冷冻型复合冰糖食品 通过具有连接喷嘴的中空心轴的组装而与通风冰糕的纹理不同的纹理，其中喷嘴设置有端口，特别是槽，用于将材料输送到冰糖食组合物流中 在前者。 主轴位于并且围绕冰芯糖料流中的前者的轴线延伸并围绕轴线旋转并且在往复运动中轴向地平移，使得在冰糕中形成材料的图案以获得具有 材料夹带和不含夹杂物的区域，并且通过模具挤出所抽吸的复合产品，以提供具有由模具出口开口给出的横截面的股线，然后将该股线切割以提供板坯。

    Patterned frozen confectionery product
    2.
    发明授权
    Patterned frozen confectionery product 有权
    图案冷冻糖果产品

    公开(公告)号：US06284294B1

    公开(公告)日：2001-09-04

    申请号：US09444969

    申请日：1999-11-22

    申请人： William French ,  Josephine E. Lometillo

    发明人： William French ,  Josephine E. Lometillo

    IPC分类号： A23G904

    CPC分类号： A23G9/48 ,  A23G9/26 ,  A23G9/282 ,  A23G9/285 ,  A23L11/07 ,  A23L11/35

    摘要： A patterned composite food product has an ice confectionery composition component and an edible material component which is different from the ice confectionery composition, the edible material having a pattern form which is an inclusion pattern zone in the ice confectionery composition, and the pattern may have a layer form wherein a plurality of edible material layers are separated one from another and surrounded by the ice confectionery composition. The composite product is prepared by pumping an ice confectionery composition into a former structure provided with an extrusion die for product extrusion from the former structure and by pumping a the edible material component through an assembly of a hollow spindle with nozzle(s) attached wherein the nozzle(s) is (are) provided with ports, particularly slots, for delivering the edible material to within the ice confectionery composition pumped through the former structure. The spindle of the assembly is located and extends longitudinally towards the die about an axis of the former structure within the ice confectionery stream, and the assembly rotates about the axis and also translates axially in a reciprocating movement so that patterns of the edible material are formed in the ice confectionery composition to provide a composite product having edible material inclusion zones and inclusion-free zones. The composite product so-pumped is extruded via the die to provide a strand which has a cross-section given by the die outlet opening and then the strand is cut to provide composite product portions.

    摘要翻译： 图案化复合食品具有与糖果组合物不同的冰糖食组合物组分和可食用材料成分，所述可食用材料具有作为所述冰糕组合物中的包含图案区域的图案形式，并且所述图案可以具有 其中多个可食用材料层彼此分开并被冰糕组合物包围。 复合产品通过将冰糖食组合物泵送到具有用于从前一结构产品挤出的挤出模头的前一结构中，并通过泵送可食用材料部件通过具有附接的喷嘴的中空心轴的组件来制备，其中， 喷嘴具有端口，特别是槽，用于将可食用材料输送到泵送通过前一结构的冰糖果组合物内。 组件的主轴定位并且围绕冰糖果流中的前一结构的轴线纵向延伸，并且组件围绕轴旋转并且在往复运动中轴向平移，从而形成可食用材料的图案 在冰糖食组合物中提供具有可食用材料包含区和无夹杂区的复合产品。 通过模具挤出所抽吸的复合产品，以提供具有由模具出口开口给出的横截面的股线，然后切割股线以提供复合产品部分。

    Method of forming high lateral voltage isolation structure involving two separate trench fills
    3.
    发明授权
    Method of forming high lateral voltage isolation structure involving two separate trench fills 有权
    形成高横向电压隔离结构的方法，涉及两个单独的沟槽填充

    公开(公告)号：US08815700B2

    公开(公告)日：2014-08-26

    申请号：US12315934

    申请日：2008-12-08

    申请人： Peter J. Hopper ,  William French ,  Kyuwoon Hwang

    发明人： Peter J. Hopper ,  William French ,  Kyuwoon Hwang

    IPC分类号： H01L21/76

    CPC分类号： H01L21/76283

    摘要： In a SOI process, a high lateral voltage isolation structure is formed by providing at least two concentric dielectric filled trenches, removing the semiconductor material between the dielectric filled trenches and filling the resultant gap with dielectric material to define a single wide dielectric filled trench.

    摘要翻译： 在SOI工艺中，通过提供至少两个同心的电介质填充的沟槽来形成高横向电压隔离结构，去除介电填充的沟槽之间的半导体材料，并用电介质材料填充所得的间隙以限定单个宽的电介质填充的沟槽。

    THERMALLY CONDUCTIVE SUBSTRATE FOR GALVANIC ISOLATION
    6.
    发明申请
    THERMALLY CONDUCTIVE SUBSTRATE FOR GALVANIC ISOLATION 有权
    用于血液分离的导热基质

    公开(公告)号：US20130001735A1

    公开(公告)日：2013-01-03

    申请号：US13170451

    申请日：2011-06-28

    申请人： Peter J. Hopper ,  William French ,  Ann Gabrys

    发明人： Peter J. Hopper ,  William French ,  Ann Gabrys

    IPC分类号： H01L29/02 ,  H01L21/50

    CPC分类号： H01L23/3732 ,  H01L23/147 ,  H01L23/49894 ,  H01L25/0655 ,  H01L2224/16225 ,  H01L2224/48227 ,  H01L2924/10253 ,  H01L2924/19107 ,  H01L2924/00

    摘要： A galvanic isolation integrated circuit system includes a semiconductor substrate; a layer of thermally conductive material, e.g., CVD nano- or poly-diamond thin film or boron nitride CVD thin film, formed over the semiconductor substrate; a first integrated circuit structure formed over the layer of thermally conductive material; a second integrated circuit structure formed over the layer of thermally conductive material, the second integrated circuit structure being spaced apart from the first integrated circuit structure; and a galvanic isolation structure formed over the layer of thermally conductive material between the first and second integrated circuit structures and connected to the first integrated circuit structure and the second integrated circuit structure.

    摘要翻译： 电隔离集成电路系统包括半导体衬底; 形成在半导体衬底上的导热材料层，例如CVD纳米或多晶金刚石薄膜或氮化硼CVD薄膜; 形成在导热材料层上的第一集成电路结构; 形成在所述导热材料层上的第二集成电路结构，所述第二集成电路结构与所述第一集成电路结构间隔开; 以及在第一和第二集成电路结构之间形成在导热材料层上并连接到第一集成电路结构和第二集成电路结构的电流隔离结构。

    METHOD AND STRUCTURE FOR IMPROVING THE QUALILTY FACTOR OF RF INDUCTORS
    8.
    发明申请
    METHOD AND STRUCTURE FOR IMPROVING THE QUALILTY FACTOR OF RF INDUCTORS 审中-公开
    改进射频电感器质量因子的方法和结构

    公开(公告)号：US20110272780A1

    公开(公告)日：2011-11-10

    申请号：US12774532

    申请日：2010-05-05

    申请人： Peter Smeys ,  Kyuwoon Hwang ,  Peter J. Hopper ,  William French

    发明人： Peter Smeys ,  Kyuwoon Hwang ,  Peter J. Hopper ,  William French

    IPC分类号： H01L29/86 ,  H01L21/02

    CPC分类号： H01L23/5227 ,  H01L28/10 ,  H01L2924/0002 ,  H01L2924/00

    摘要： An on-chip inductor structure is formed as part of an integrated circuit structure. The integrate circuit structure includes a semiconductor substrate having a top side and a back side, integrated circuit elements formed on the top side of the substrate, a conductive interconnect structure formed in contact with the integrated circuit elements and a passivation layer formed over the integrated circuit elements. The inductor structure comprises a layer of photoimageable epoxy formed on the passivation layer, a conductive inductor coil formed on the layer of photoimageable epoxy and at least one conductive via that extends from the inductor coil to the interconnect layer to provide electrical connection therebetween. Additionally, a back side trench may be formed in the back side of the semiconductor substrate beneath the inductor coil.

    摘要翻译： 片上电感器结构形成为集成电路结构的一部分。 集成电路结构包括具有顶侧和背面的半导体衬底，形成在衬底的顶侧上的集成电路元件，与集成电路元件接触形成的导电互连结构和形成在集成电路上的钝化层 元素。 电感器结构包括形成在钝化层上的可光成像环氧树脂层，形成在可光成像环氧树脂层上的导电电感线圈和从电感线圈延伸到互连层的至少一个导电通孔，以在它们之间提供电连接。 此外，可以在电感线圈下方的半导体衬底的背面形成背面沟槽。

    METHOD OF FORMING A REGION OF GRADED DOPING CONCENTRATION IN A SEMICONDUCTOR DEVICE AND RELATED APPARATUS
    9.
    发明申请
    METHOD OF FORMING A REGION OF GRADED DOPING CONCENTRATION IN A SEMICONDUCTOR DEVICE AND RELATED APPARATUS 有权
    形成半导体器件中的分级掺杂浓度区域的方法及相关装置

    公开(公告)号：US20110233670A1

    公开(公告)日：2011-09-29

    申请号：US13156184

    申请日：2011-06-08

    申请人： William French ,  Erika Mazotti ,  Yuri Mirgorodski

    发明人： William French ,  Erika Mazotti ,  Yuri Mirgorodski

    IPC分类号： H01L29/78

    CPC分类号： H01L29/0847 ,  H01L21/2253 ,  H01L29/0653 ,  H01L29/1045 ,  H01L29/66659 ,  H01L29/7835

    摘要： A method for forming a doped region of a semiconductor device includes masking a portion of a substrate with a mask. The mask is configured to create a graded doping profile within the doped region. The method also includes performing an implant using the mask to create doped areas and undoped areas in the substrate. The method further includes diffusing the doped areas to create the graded doping profile in the doped region. The mask could include a first region having openings distributed throughout a photo-resist material, where the openings vary in size and spacing. The mask could also include a second region having blocks of photo-resist material distributed throughout an open region, where the photo-resist blocks vary in size and spacing. Diffusing the doped areas could include applying a high temperature anneal to smooth the doped and undoped areas to produce a linearly graded doping profile.

    摘要翻译： 用于形成半导体器件的掺杂区域的方法包括用掩模掩蔽衬底的一部分。 掩模被配置为在掺杂区域内产生渐变掺杂分布。 该方法还包括使用掩模执行植入物以在衬底中产生掺杂区域和未掺杂区域。 该方法还包括扩散掺杂区域以在掺杂区域中产生渐变掺杂分布。 掩模可以包括具有分布在整个光致抗蚀剂材料中的开口的第一区域，其中开口的尺寸和间隔变化。 掩模还可以包括具有分布在整个开放区域中的光致抗蚀剂材料块的第二区域，其中光刻胶块的尺寸和间距变化。 扩散掺杂区域可以包括施加高温退火以使掺杂和未掺杂区域平滑以产生线性渐变的掺杂分布。