Backlight assembly for collimated illumination
    2.
    发明授权
    Backlight assembly for collimated illumination 有权
    用于准直照明的背光组件

    公开(公告)号:US06697042B1

    公开(公告)日:2004-02-24

    申请号:US09721819

    申请日:2000-11-27

    IPC分类号: G09G336

    摘要: A large, efficient, high power collimated backlight assembly has a highly reflective, substantially closed, thin rectangular light cavity containing highly reflective surfaces and one or more light sources. One of the large faces of the cavity is a light exit plate which contains a transmissive, light collimating structure. The cavity side of the collimating structure includes a highly reflective white planar structure containing an array of circular apertures with minimal sidewall absorption. The apertures are centered on the optical axis and located near the focal distance of a closely packed array of hemispherical or spherical lenses located on the outer surface of the collimating structure. Light rays are trapped between the highly reflective surfaces of the cavity, light sources, and aperture walls, until they enter the lenses, which output the majority of rays that enter in a collimated beam. The backlight assembly is advantageously used for transmissive type electro-optical displays, especially those whose performance is enhanced by efficient collimated light, such as seamless tiled liquid crystal displays.

    摘要翻译: 大型高效率的高功率准直背光组件具有高反射性,基本封闭的薄矩形光腔,其包含高反射面和一个或多个光源。 空腔的一个大面是含有透射的光准直结构的光出射板。 准直结构的空腔侧包括高反射性白色平面结构,其包含具有最小侧壁吸收的圆形孔阵列。 这些孔以光轴为中心,位于靠近准直结构外表面的半球形或球面透镜阵列的焦距附近。 光线被捕获在空腔,光源和孔壁的高反射表面之间,直到它们进入透镜,其输出进入准直光束的大部分光线。 背光组件有利地用于透射型电光显示器,特别是那些通过有效的准直光增强其性能的电光显示器,例如无缝拼接液晶显示器。

    Fiber optic transmitter modification for improved extinction ratio
    3.
    发明授权
    Fiber optic transmitter modification for improved extinction ratio 失效
    光纤发射机修改提高了消光比

    公开(公告)号:US5309542A

    公开(公告)日:1994-05-03

    申请号:US764569

    申请日:1991-09-18

    摘要: A fiber optic data transmission system and method are provided comprising a laser diode, an attenuating and focusing lens, and an optical fiber. The method of operating the system attenuates laser diode radiation outputted during operation. The system operates by application of the input driving current to the laser diode in a manner which increases the laser diode extinction ratio. The increased laser diode power output associated with operation at a higher extinction ratio is attenuated by the lens to a safe operating level. Increasing the laser diode extinction ratio significantly increases the system's signal-to-noise ratio and thereby reduces the bit error rate associated with the data transmitted over the optical fiber, while the attenuation of the laser diode output radiation allows operation within prescribed safety limits.

    摘要翻译: 提供了包括激光二极管,衰减和聚焦透镜以及光纤的光纤数据传输系统和方法。 操作该系统的方法会衰减运行期间输出的激光二极管辐射。 该系统通过以增加激光二极管消光比的方式将输入驱动电流施加到激光二极管来操作。 与较高消光比操作相关联的增加的激光二极管功率输出被透镜衰减到安全的操作水平。 增加激光二极管消光比显着增加了系统的信噪比,从而降低了与通过光纤传输的数据相关的误码率,而激光二极管输出辐射的衰减允许在规定的安全限度内运行。

    Method for monitoring deposition rate using an eddy current detector
    4.
    发明授权
    Method for monitoring deposition rate using an eddy current detector 失效
    使用涡流检测器监测沉积速率的方法

    公开(公告)号:US4556845A

    公开(公告)日:1985-12-03

    申请号:US378697

    申请日:1982-05-17

    CPC分类号: G01B7/105

    摘要: A conductive film deposition rate monitoring method for measuring the real time deposition rate of a metallic deposition process particularly an electroless plating bath, including the steps of positioning an eddy current detector within a predetermined distance of a test surface where the deposition is to be deposited, and the step of monitoring the output of the detector. The apparatus comprises an eddy current sensor and a non-metallic housing for the sensor, having a non-conductive wall of predetermined thickness between the sensor and the surface of the wall distant from the sensor, the distant wall being immersed in the deposition environment, such as a plating bath, so that a deposit takes place on the distant surface, and measuring means connected to the output of the sensor for measuring the amplitude and rate of change of the output of the sensor.

    摘要翻译: 一种用于测量金属沉积工艺,特别是化学镀浴的实时沉积速率的导电膜沉积速率监测方法,包括以下步骤:将涡流检测器定位在沉积物沉积的测试表面的预定距离内, 以及监视检测器的输出的步骤。 该装置包括涡流传感器和用于传感器的非金属壳体,其具有在传感器与远离传感器的壁的表面之间具有预定厚度的非导电壁,远壁浸没在沉积环境中, 例如电镀槽,使得在远处的表面上进行沉积,以及连接到传感器的输出的测量装置,用于测量传感器的输出的幅度和变化率。

    Displacement compensating module
    5.
    发明授权
    Displacement compensating module 失效
    位移补偿模块

    公开(公告)号:US4514752A

    公开(公告)日:1985-04-30

    申请号:US598631

    申请日:1984-04-10

    摘要: A displacement compensating module is disclosed wherein a blocking article, such as a polyimide tape, is disposed between an epoxy composition and the back surface of a substrate and between the epoxy composition and the inner surface of a cap for blocking the movement of the epoxy composition into a gap area during the manufacture of the module. An electronic module comprises a substrate, an integrated circuit chip disposed on the substrate, a cap disposed over and enclosing the chip and the substrate, a heat dissipator disposed between the cap and the chip for carrying away the heat dissipated by the chip, and an epoxy composition secured to the back surface of the substrate for sealing the module, and specifically, the chip within the module from harmful external influences. The boundary of a gap is defined by the edge of the substrate and the inner surface of the cap. A blocking article, such as a polyimide tape, is disposed between the epoxy composition on one side and the back side of the substrate coupled with the inner surface of the cap on the other side for holding the epoxy composition external to the gap and preventing the epoxy composition from being disposed within the gap during the manufacture of the module. As a result, the cap is relatively free to move with respect to the substrate. Unnecessary distortion of the cap is minimized and resultant damage to the chips within the cap is avoided.

    摘要翻译: 公开了一种位移补偿模块,其中诸如聚酰亚胺胶带的阻挡制品设置在环氧组合物和基底的背面之间以及在环氧组合物和盖的内表面之间,用于阻止环氧组合物的运动 在模块的制造期间进入间隙区域。 电子模块包括基板,设置在基板上的集成电路芯片,设置在芯片和基板上并封装的盖子,设置在盖子和芯片之间的散热器,用于带走由芯片散热的热量,以及 环氧树脂组合物固定在基板的背面,用于密封模块,特别是模块内的芯片受到有害的外部影响。 间隙的边界由衬底的边缘和盖的内表面限定。 诸如聚酰亚胺带的封闭制品设置在与另一侧的盖子的内表面相耦合的一侧的环氧组合物和背面之间,用于将环氧组合物保持在间隙外部,并防止 环氧组合物在模块的制造期间设置在间隙内。 结果,帽相对于基底相对自由移动。 盖的不必要的变形被最小化并且避免了对盖内的芯片造成的损坏。