摘要:
Epoxy resin mixtures for producing prepregs and composites that are available at low cost and can be processed well yield flame-retardant molding materials even without the addition of flame retardants, and these molding materials have a high glass transition temperature and also have an improved interlaminar adhesion and adhesion to copper when they contain the following components:a phosphorus-modified epoxy resin with an epoxy value of 0.02 to 1 mol/100 g, composed of structural units derived from(A) polyepoxy compounds with at least two epoxy groups per molecule and(B) phosphinic acid anhydrides and/or phosphonic acid anhydrides, andan aromatic polyamine as the hardener.
摘要:
The present invention relates to phosphorus-modified epoxy resins having an epoxy number from 0 to 1 mol/100 g, comprising structural units which are derived from (A) polyepoxy compounds having at least two epoxy groups per molecule, and (B) phosphinic and/or phosphonic anhydrides. The invention further provides a process for preparing these phosphorus-modified epoxy resins and provides for the use of the resins in producing moldings, coatings or laminates.
摘要:
Epoxy resin mixtures for producing prepregs and composites that are available at low cost and can be processed well yield flame-retardant molding materials even without the addition of flame retardants, and these molding materials have a high glass transition temperature and also have an improved interlaminar adhesion and adhesion to copper when they contain the following components:a phosphorus-modified epoxy resin with an epoxy value of 0.02 to 1 mol/100 g, composed of structural units derived from(A) polyepoxy compounds with at least two epoxy groups per molecule and(B) at least one compound from the group consisting of phosphinic acids, phosphonic acids, pyrophosphonic acids and phosphonic acid half-esters, andan aromatic polyamine as the hardener.
摘要:
Epoxy resin mixtures for the production of prepregs and composites contain the following components: a phosphorus-modified epoxy resin with an epoxy value of 0.02 to 1 mol/100 g, made up of structural units derived from (a) polyepoxy compounds with at least two epoxy groups per molecule, and (b) phosphinic acid anhydrides, phosphonic acid anhydrides, or phosphonic acid half-esters; an amine-substituted aromatic sulfonic acid amide or hydrazide as a hardener; an amino hardening accelerator.
摘要:
Epoxy resin mixtures for prepregs and composites Epoxy resin mixtures for preparing prepregs and composites contain the following components: a phosphorus-modified epoxy resin with an epoxy value of 0.02 to 1 mol/100 g, made up of structural units derived from (a) polyepoxy compounds with at least two epoxy groups per molecule and (b) phosphinic acid anhydrides, phosphonic acid anhydrides, or phosphonic acid half-esters; a glycidyl group-free compound with phenolic OH groups in the form of bisphenol-A, bisphenol-F, or a high-molecular phenoxy resin obtained through the condensation of bisphenol-A or bisphenol-F with epichlorohydrin; an aromatic polyamine used as a hardening agent.
摘要:
The present invention relates to phosphorus-modified epoxy resins of the formulae (I) and/or (II) ##STR1## The invention furthermore relates to a process for the preparation of these phosphorus-modified epoxy resins and to their use for the production of shaped articles, coatings or laminates.
摘要:
Epoxy resin mixtures suitable for producing halogen-free flame-retardant composites by the injection process comprise the following components: (A) a phosphorus-free aliphatic and/or aromatic and/or heterocyclic epoxy resin; (B) an epoxide group-containing phosphorus compound; (C) a phosphorus-modified epoxy resin with an epoxide value of from 0.02 to 1 mol/100 g, obtained by reacting polyepoxy compounds having at least two epoxide groups per molecule with phosphinic anhydrides and/or phosphonic anhydrides or with phosphonic monoesters, followed by thermal elimination of alcohol; and (D) as hardener, at least one primary or secondary aliphatic polyamine with NH and/or NH2 groups.
摘要:
A hydrophobic surface coating, in particular for electronic and electrotechnical components, can be produced easily and inexpensively. For this purpose, particles and micro powders, hydrophobic particles in particular, are incorporated into the protective lacquer.