摘要:
Epoxy resin mixtures for producing prepregs and composites that are available at low cost and can be processed well yield flame-retardant molding materials even without the addition of flame retardants, and these molding materials have a high glass transition temperature and also have an improved interlaminar adhesion and adhesion to copper when they contain the following components:a phosphorus-modified epoxy resin with an epoxy value of 0.02 to 1 mol/100 g, composed of structural units derived from(A) polyepoxy compounds with at least two epoxy groups per molecule and(B) phosphinic acid anhydrides and/or phosphonic acid anhydrides, andan aromatic polyamine as the hardener.
摘要:
The present invention relates to phosphorus-modified epoxy resins having an epoxy number from 0 to 1 mol/100 g, comprising structural units which are derived from (A) polyepoxy compounds having at least two epoxy groups per molecule, and (B) phosphinic and/or phosphonic anhydrides. The invention further provides a process for preparing these phosphorus-modified epoxy resins and provides for the use of the resins in producing moldings, coatings or laminates.
摘要:
Epoxy resin mixtures for producing prepregs and composites that are available at low cost and can be processed well yield flame-retardant molding materials even without the addition of flame retardants, and these molding materials have a high glass transition temperature and also have an improved interlaminar adhesion and adhesion to copper when they contain the following components:a phosphorus-modified epoxy resin with an epoxy value of 0.02 to 1 mol/100 g, composed of structural units derived from(A) polyepoxy compounds with at least two epoxy groups per molecule and(B) at least one compound from the group consisting of phosphinic acids, phosphonic acids, pyrophosphonic acids and phosphonic acid half-esters, andan aromatic polyamine as the hardener.
摘要:
Epoxy resin mixtures for the production of prepregs and composites contain the following components: a phosphorus-modified epoxy resin with an epoxy value of 0.02 to 1 mol/100 g, made up of structural units derived from (a) polyepoxy compounds with at least two epoxy groups per molecule, and (b) phosphinic acid anhydrides, phosphonic acid anhydrides, or phosphonic acid half-esters; an amine-substituted aromatic sulfonic acid amide or hydrazide as a hardener; an amino hardening accelerator.
摘要:
Epoxy resin mixtures for prepregs and composites Epoxy resin mixtures for preparing prepregs and composites contain the following components: a phosphorus-modified epoxy resin with an epoxy value of 0.02 to 1 mol/100 g, made up of structural units derived from (a) polyepoxy compounds with at least two epoxy groups per molecule and (b) phosphinic acid anhydrides, phosphonic acid anhydrides, or phosphonic acid half-esters; a glycidyl group-free compound with phenolic OH groups in the form of bisphenol-A, bisphenol-F, or a high-molecular phenoxy resin obtained through the condensation of bisphenol-A or bisphenol-F with epichlorohydrin; an aromatic polyamine used as a hardening agent.
摘要:
The invention provides epoxide resin molding compositions for protectively covering semiconductor components, which are accessible in a cost-effective manner and have good processibility. The epoxide resin molding compositions provide virtually inflammable molded materials with a high glass transition temperature and a low thermal expansion coefficient without the addition of flameproofing agents, when they contain the following constituents:(A) an aromatic and/or heterocyclic polyepoxide resin which is free of phosphorous, optionally in combination with an aliphatic epoxide resin;(B) an epoxide-group-containing phosphorous compound;(c) an aromatic polyamine as a curing agent; and(D) filler material.
摘要:
The invention provides epoxy resin compounds for manufacturing prepregs and composite materials, which can be obtained inexpensively and have good processibility, and provide--without having to add flameproofing agents--virtually inflammable molded materials with a high glass transition temperature. The epoxy resin compounds contain the following constituents:(A) an aromatic and/or heterocyclic polyepoxide resin that is free of phosphorous, optionally in a mixture with an aliphatic epoxy resin;(B) an epoxy-group-containing phosphorous compound and(C) an aromatic polyamine as a curing agent.
摘要:
Reaction resin mixtures which can be economically processed provide inflammable molded materials with excellent mechanical properties and high dimensional stability under heat when they contain the following constituents: (A) a phosphorus-free polyfunctional epoxide; (B) an epoxy-group-containing phosphorus compound; (C) a polyfunctional isocyanate; (D) a curing catalyst; and, if required, (E) filler material.
摘要:
Biochemical substances, such as enzymes, are immobilized using an olefinic-unsaturated, epoxyfunctional polysiloxane. The polysiloxane is applied to a carrier material. The polysiloxane on the carrier is cross-linked by using high-energy radiation or a peroxide to form a polymer matrix. The polymer matrix is treated with an aqueous solution of a biochemical substance that reacts with epoxy groups and becomes immobilized. The polymer matrix is stabilized by the reaction of non-reacted epoxy groups with a compound containing an amino group, a carboxyl group or an amino group and a carboxyl group. The crosslinked polysiloxane can be hydrophilized after cross-linking and prior to immobilization of the biochemical substance by the reaction of a portion of the epoxy groups with a hydrophilic compound.
摘要:
A biosensor is prepared having a selective detection system containing a biochemical substance such as an enzyme immobilized by reaction with epoxy groups of an olefinic-unsaturated, epoxyfunctional polyether. Prior to immobilization, the polyether is applied to a carrier and crosslinked by treatment with high-energy radiation or peroxide to form a layer. After reacting the biochemical substance with epoxy groups, non-reacted epoxy groups are reacted with a compound containing an amino group and/or a carboxyl group such as an amino acid. Before immobilizing of the biochemical substance and after crosslinking, the polyether may be hydrophilized by reacting some of the epoxy groups with a hydrophilic compound such as an amino acid.