利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

175 条记录 (耗时 0.026 秒)

    SPHERICAL ASSEMBLY PARTICLE COMPOSITION OF CUPROUS OXIDE AND PREPARATION METHOD THEREOF
    1.
    发明申请
    SPHERICAL ASSEMBLY PARTICLE COMPOSITION OF CUPROUS OXIDE AND PREPARATION METHOD THEREOF 有权
    氧化丙烯的球形组装颗粒组合物及其制备方法

    公开(公告)号：US20100119828A1

    公开(公告)日：2010-05-13

    申请号：US12452794

    申请日：2008-06-25

    申请人： Woo-Ram Lee ,  Sang-Ho Kim ,  Sung-Ho Yoon

    发明人： Woo-Ram Lee ,  Sang-Ho Kim ,  Sung-Ho Yoon

    IPC分类号： C01G3/02 ,  B32B5/00

    CPC分类号： C01G3/02 ,  B01J23/72 ,  B01J35/0013 ,  B01J35/08 ,  B01J37/16 ,  B82Y30/00 ,  C01P2002/72 ,  C01P2004/03 ,  C01P2004/04 ,  C01P2004/32 ,  C01P2004/50 ,  C01P2004/52 ,  C01P2004/61 ,  C01P2004/62 ,  H01L31/0328 ,  H01L31/035281 ,  Y02E10/50 ,  Y10T428/2991 ,  Y10T428/2998

    摘要： A Cu2O spherical assembly particle composition is composed of Cu2O spherical assembly particles, each of which is formed by agglomerating a plurality of Cu2O ultrafine particles that have an average diameter in the range from 1 to 100 nm and a standard deviation on the diameter in the range from 0 to 10%. The Cu2O spherical assembly particles have an average diameter in the range from 0.1 to 10 μm and a standard deviation on the diameter in the range from 0 to 40%. This Cu2O spherical assembly particle composition is composed of Cu2O assembly particles with excellent uniformity, so it shows excellent properties such as realizing a good electric conductivity during a curing process for wiring. Accordingly, the spherical Cu2O assembly particle composition may be usefully used as precursors for solar energy conversion, magnetic storage medium, catalyst, gas sensor, and copper wire formation.

    摘要翻译： Cu2O球形组件颗粒组合物由Cu2O球形组件颗粒组成，每个颗粒通过使平均直径在1至100nm范围内的多个Cu 2 O超细颗粒聚集而形成，并且在该范围内的直径的标准偏差 从0到10％。 Cu2O球形组件颗粒的平均直径在0.1至10μm的范围内，直径的标准偏差在0至40％的范围内。 该Cu 2 O球形组合物颗粒组合物由均匀性良好的Cu 2 O组合颗粒组成，因此在布线固化过程中实现良好的导电性。 因此，球形Cu 2 O组合粒子组合物可以有用地用作太阳能转换，磁存储介质，催化剂，气体传感器和铜线形成的前体。

    Spherical assembly particle composition of cuprous oxide and preparation method thereof
    2.
    发明授权
    Spherical assembly particle composition of cuprous oxide and preparation method thereof 有权
    氧化亚铜的球形组装颗粒组成及其制备方法

    公开(公告)号：US08343454B2

    公开(公告)日：2013-01-01

    申请号：US12452794

    申请日：2008-06-25

    申请人： Woo-Ram Lee ,  Sang-Ho Kim ,  Sung-Ho Yoon

    发明人： Woo-Ram Lee ,  Sang-Ho Kim ,  Sung-Ho Yoon

    IPC分类号： C01G3/00

    CPC分类号： C01G3/02 ,  B01J23/72 ,  B01J35/0013 ,  B01J35/08 ,  B01J37/16 ,  B82Y30/00 ,  C01P2002/72 ,  C01P2004/03 ,  C01P2004/04 ,  C01P2004/32 ,  C01P2004/50 ,  C01P2004/52 ,  C01P2004/61 ,  C01P2004/62 ,  H01L31/0328 ,  H01L31/035281 ,  Y02E10/50 ,  Y10T428/2991 ,  Y10T428/2998

    摘要： A Cu2O spherical assembly particle composition is composed of Cu2O spherical assembly particles, each of which is formed by agglomerating a plurality of Cu2O ultrafine particles that have an average diameter in the range from 1 to 100 nm and a standard deviation on the diameter in the range from 0 to 10%. The Cu2O spherical assembly particles have an average diameter in the range from 0.1 to 10 μm and a standard deviation on the diameter in the range from 0 to 40%. This Cu2O spherical assembly particle composition is composed of Cu2O assembly particles with excellent uniformity, so it shows excellent properties such as realizing a good electric conductivity during a curing process for wiring. Accordingly, the spherical Cu2O assembly particle composition may be usefully used as precursors for solar energy conversion, magnetic storage medium, catalyst, gas sensor, and copper wire formation.

    摘要翻译： Cu2O球形组件颗粒组合物由Cu2O球形组件颗粒组成，每个颗粒通过使平均直径在1至100nm范围内的多个Cu 2 O超细颗粒聚集而形成，并且在该范围内的直径的标准偏差 从0到10％。 Cu2O球形组件颗粒的平均直径在0.1至10μm的范围内，直径的标准偏差在0至40％的范围内。 该Cu 2 O球形组合物颗粒组合物由均匀性良好的Cu 2 O组合颗粒组成，因此在布线固化过程中实现良好的导电性。 因此，球形Cu 2 O组合粒子组合物可以有用地用作太阳能转换，磁存储介质，催化剂，气体传感器和铜线形成的前体。

    Preparation method of copper particle composition
    3.
    发明授权
    Preparation method of copper particle composition 有权
    铜粒子组成的制备方法

    公开(公告)号：US08236089B2

    公开(公告)日：2012-08-07

    申请号：US12452751

    申请日：2008-07-24

    申请人： Woo-Ram Lee ,  Sang-Ho Kim ,  Sung-Ho Yoon

    发明人： Woo-Ram Lee ,  Sang-Ho Kim ,  Sung-Ho Yoon

    IPC分类号： B22F9/24

    CPC分类号： C01G3/02 ,  B22F9/24 ,  B22F2998/00 ,  B82Y30/00 ,  C01P2002/72 ,  C01P2004/03 ,  C01P2004/04 ,  C01P2004/32 ,  C01P2004/51 ,  C01P2004/54 ,  C01P2004/61 ,  C01P2004/62 ,  C01P2004/64 ,  B22F1/0018

    摘要： A preparation method of a copper particle composition includes dissolving a copper carboxyl compound, or a carboxyl group-containing compound and a copper salt, in a solvent to prepare a copper(II) precursor solution; putting a weak reducing agent with a standard reduction potential of −0.2 to −0.05V to the prepared copper(II) precursor solution to assemble a plurality of Cu2O fine particles having an average diameter of 1 to 100 nm with a standard deviation of 0 to 10%, thereby forming spherical Cu2O assembly particles having an average diameter of 0.1 to 10 μm with a standard deviation of 0 to 40%; reducing the spherical Cu2O assembly particles into copper particles by using a reducing agent; and separating the copper particles from the result product. Thus, copper particles can be produced fast, economically, and the obtained copper particles have good crystallinity and good resistance against oxidation.

    摘要翻译： 铜颗粒组合物的制备方法包括将铜羧基化合物或含羧基化合物和铜盐溶解在溶剂中以制备前体铜（II）溶液; 将具有-0.2〜-0.05V的标准还原电位的弱还原剂加入到所制备的铜（II）前体溶液中，以将标准偏差为0的平均直径为1〜100nm的多个Cu 2 O微粒组装成 10％，由此形成平均直径为0.1至10μm的球形Cu2O组装颗粒，标准偏差为0至40％; 通过使用还原剂将球形Cu2O组装颗粒还原成铜颗粒; 并从结果产物中分离出铜颗粒。 因此，可以快速，经济地制造铜粒子，所得到的铜粒子具有良好的结晶性和良好的抗氧化性。

    PREPARATION METHOD OF COPPER PARTICLE COMPOSITION
    4.
    发明申请
    PREPARATION METHOD OF COPPER PARTICLE COMPOSITION 有权
    铜颗粒组合物的制备方法

    公开(公告)号：US20100116089A1

    公开(公告)日：2010-05-13

    申请号：US12452751

    申请日：2008-07-24

    申请人： Woo-Ram Lee ,  Sang-Ho Kim ,  Sung-Ho Yoon

    发明人： Woo-Ram Lee ,  Sang-Ho Kim ,  Sung-Ho Yoon

    IPC分类号： B22F9/18

    CPC分类号： C01G3/02 ,  B22F9/24 ,  B22F2998/00 ,  B82Y30/00 ,  C01P2002/72 ,  C01P2004/03 ,  C01P2004/04 ,  C01P2004/32 ,  C01P2004/51 ,  C01P2004/54 ,  C01P2004/61 ,  C01P2004/62 ,  C01P2004/64 ,  B22F1/0018

    摘要： A preparation method of a copper particle composition includes dissolving a copper carboxyl compound, or a carboxyl group-containing compound and a copper salt, in a solvent to prepare a copper(II) precursor solution; putting a weak reducing agent with a standard reduction potential of −0.2 to −0.05V to the prepared copper(II) precursor solution to assemble a plurality of Cu2O fine particles having an average diameter of 1 to 100 nm with a standard deviation of 0 to 10%, thereby forming spherical Cu2O assembly particles having an average diameter of 0.1 to 10 μm with a standard deviation of 0 to 40%; reducing the spherical Cu2O assembly particles into copper particles by using a reducing agent; and separating the copper particles from the result product. Thus, copper particles can be produced fast, economically, and the obtained copper particles have good crystallinity and good resistance against oxidation.

    摘要翻译： 铜颗粒组合物的制备方法包括将铜羧基化合物或含羧基化合物和铜盐溶解在溶剂中以制备前体铜（II）溶液; 将具有-0.2〜-0.05V的标准还原电位的弱还原剂加入到所制备的铜（II）前体溶液中，以将标准偏差为0的平均直径为1〜100nm的多个Cu 2 O微粒组装成 10％，由此形成平均直径为0.1至10μm的球形Cu2O组装颗粒，标准偏差为0至40％; 通过使用还原剂将球形Cu2O组装颗粒还原成铜颗粒; 并从结果产物中分离出铜颗粒。 因此，可以快速，经济地制造铜粒子，所得到的铜粒子具有良好的结晶性和良好的抗氧化性。

    Preparation method of electroconductive copper patterning layer by laser irradiation
    6.
    发明授权
    Preparation method of electroconductive copper patterning layer by laser irradiation 有权
    通过激光照射制备导电铜图案层的方法

    公开(公告)号：US08394465B2

    公开(公告)日：2013-03-12

    申请号：US12452812

    申请日：2008-07-24

    申请人： Woo-Ram Lee ,  Sang-Ho Kim ,  Tae-Su Kim ,  So-Won Kim

    发明人： Woo-Ram Lee ,  Sang-Ho Kim ,  Tae-Su Kim ,  So-Won Kim

    IPC分类号： B05D3/00 ,  B05D3/06

    CPC分类号： H01L21/288 ,  H01L21/268 ,  H05K1/092 ,  H05K1/097 ,  H05K3/102 ,  H05K3/105 ,  H05K3/1283 ,  H05K2201/0209 ,  H05K2203/107 ,  H05K2203/1131

    摘要： A preparation method of an electroconductive copper patterning layer includes (Step 1) preparing a dispersion solution of copper-based particles selected from the group consisting of copper particles, copper oxide particles, and their mixtures; (Step 2) forming a copper-based particle patterning layer by printing or filling the dispersion solution of copper-based particles to a substrate into a predetermined shape; and (Step 3) irradiating laser to the copper-based particle patterning layer to burn and interconnect the copper-based particles contained in the copper-based particle patterning layer. This preparation method burns a copper-based particle patterning layer with a strong energy within a short time by using laser. Thus, it is possible to obtain a copper patterning layer that is hardly oxidized even in the atmosphere, so a copper patterning layer with excellent electric conductivity is formed.

    摘要翻译： 导电铜图案形成层的制备方法包括（步骤1）制备选自铜颗粒，氧化铜颗粒及其混合物的铜基颗粒的分散溶液; （步骤2）通过将铜基颗粒的分散溶液印刷或填充到基板上形成预定形状来形成铜基颗粒图案形成层; 和（步骤3）将激光照射到铜基颗粒图案形成层以烧结和互连铜基颗粒图案形成层中所含的铜基颗粒。 该制备方法通过使用激光在短时间内燃烧具有强能量的铜基颗粒图案形成层。 因此，可以获得即使在大气中也几乎不氧化的铜图案层，因此形成具有优异导电性的铜图案层。

    PREPARATION METHOD OF ELECTROCONDUCTIVE COPPER PATTERNING LAYER BY LASER IRRADIATION
    7.
    发明申请
    PREPARATION METHOD OF ELECTROCONDUCTIVE COPPER PATTERNING LAYER BY LASER IRRADIATION 有权
    通过激光辐射制备电极铜层的制备方法

    公开(公告)号：US20100129566A1

    公开(公告)日：2010-05-27

    申请号：US12452812

    申请日：2008-07-24

    申请人： Woo-Ram Lee ,  Sang-Ho Kim ,  Tae-Su Kim ,  So-Won Kim

    发明人： Woo-Ram Lee ,  Sang-Ho Kim ,  Tae-Su Kim ,  So-Won Kim

    IPC分类号： B05D3/06

    CPC分类号： H01L21/288 ,  H01L21/268 ,  H05K1/092 ,  H05K1/097 ,  H05K3/102 ,  H05K3/105 ,  H05K3/1283 ,  H05K2201/0209 ,  H05K2203/107 ,  H05K2203/1131

    摘要： A preparation method of an electroconductive copper patterning layer includes (Step 1) preparing a dispersion solution of copper-based particles selected from the group consisting of copper particles, copper oxide particles, and their mixtures; (Step 2) forming a copper-based particle patterning layer by printing or filling the dispersion solution of copper-based particles to a substrate into a predetermined shape; and (Step 3) irradiating laser to the copper-based particle patterning layer to burn and interconnect the copper-based particles contained in the copper-based particle patterning layer. This preparation method burns a copper-based particle patterning layer with a strong energy within a short time by using laser. Thus, it is possible to obtain a copper patterning layer that is hardly oxidized even in the atmosphere, so a copper patterning layer with excellent electric conductivity is formed.

    摘要翻译： 导电铜图案形成层的制备方法包括（步骤1）制备选自铜颗粒，氧化铜颗粒及其混合物的铜基颗粒的分散溶液; （步骤2）通过将铜基颗粒的分散溶液印刷或填充到基板上形成预定形状来形成铜基颗粒图案形成层; 和（步骤3）将激光照射到铜基颗粒图案形成层以烧结和互连铜基颗粒图案形成层中所含的铜基颗粒。 该制备方法通过使用激光在短时间内燃烧具有强能量的铜基颗粒图案形成层。 因此，可以获得即使在大气中也几乎不氧化的铜图案层，因此形成具有优异导电性的铜图案层。