MAGNETIC RANDOM ACCESS MEMORY DEVICES AND METHODS OF MANUFACTURING THE SAME
    3.
    发明申请
    MAGNETIC RANDOM ACCESS MEMORY DEVICES AND METHODS OF MANUFACTURING THE SAME 有权
    磁性随机访问存储器件及其制造方法

    公开(公告)号:US20160155934A1

    公开(公告)日:2016-06-02

    申请号:US14887506

    申请日:2015-10-20

    IPC分类号: H01L43/08 H01L43/02 H01L43/12

    CPC分类号: H01L43/08 H01L43/12

    摘要: Magnetic random access memory (MRAM) devices, and methods of manufacturing the same, include at least one first magnetic material pattern on a substrate, at least one second magnetic material pattern on the at least one first magnetic material pattern, and at least one tunnel barrier layer pattern between the at least one first magnetic material pattern and the at least one second magnetic material pattern. A width of a top surface of the at least one first magnetic material pattern may be less than a width of a bottom surface of the at least one second magnetic material pattern.

    摘要翻译: 磁性随机存取存储器(MRAM)器件及其制造方法包括在衬底上的至少一个第一磁性材料图案,至少一个第一磁性材料图案上的至少一个第二磁性材料图案,以及至少一个隧道 所述至少一个第一磁性材料图案和所述至少一个第二磁性材料图案之间的阻挡层图案。 所述至少一个第一磁性材料图案的顶表面的宽度可以小于所述至少一个第二磁性材料图案的底表面的宽度。

    MAGNETIC MEMORY DEVICE AND METHOD OF FABRICATING THE SAME
    4.
    发明申请
    MAGNETIC MEMORY DEVICE AND METHOD OF FABRICATING THE SAME 有权
    磁记忆体装置及其制造方法

    公开(公告)号:US20070041243A1

    公开(公告)日:2007-02-22

    申请号:US11465075

    申请日:2006-08-16

    IPC分类号: G11C11/00

    摘要: There is provided a magnetic memory device and a method of forming the same. The magnetic memory device includes an invariable pinning pattern and a variable pinning pattern on a substrate. A tunnel barrier pattern is interposed between the invariable pinning pattern and the variable pinning pattern, and the pinned pattern is interposed between the invariable pinning pattern and the tunnel barrier pattern. A storage free pattern is interposed between the tunnel barrier pattern and the variable pinning pattern, and a guide free pattern is interposed between the storage free pattern and the variable pinning pattern. A free reversing pattern is interposed between the storage and guide free patterns. The free reversing pattern reverses a magnetization direction of the storage free pattern and a magnetization direction of the guide free pattern in the opposite directions.

    摘要翻译: 提供了一种磁存储器件及其形成方法。 磁存储器件在衬底上包括不变的钉扎图案和可变的钉扎图案。 在不变的钉扎图案和可变钉扎图案之间插入隧道势垒图案,并且钉扎图案介于不变钉扎图案和隧道屏障图案之间。 在隧道势垒图案和可变钉扎图案之间插入无存储图案,并且在存储空闲图案和可变钉扎图案之间插入无引导图案。 在存储和无引导模式之间插入一个自由的反转模式。 自由反转图案反转无存储图案的磁化方向和反向自由图案的磁化方向。

    MAGNETIC TUNNEL JUNCTION STRUCTURE HAVING AN OXIDIZED BUFFER LAYER AND METHOD OF FABRICATING THE SAME
    5.
    发明申请
    MAGNETIC TUNNEL JUNCTION STRUCTURE HAVING AN OXIDIZED BUFFER LAYER AND METHOD OF FABRICATING THE SAME 审中-公开
    具有氧化缓冲层的磁性隧道结结构及其制造方法

    公开(公告)号:US20070041125A1

    公开(公告)日:2007-02-22

    申请号:US11552085

    申请日:2006-10-23

    IPC分类号: G11B5/17

    CPC分类号: H01L43/12 H01L43/08

    摘要: There are provided a magnetic tunnel junction structure and a method of fabricating the same. The magnetic tunnel junction structure includes a lower electrode, a lower magnetic layer pattern and a tunnel layer pattern, which are sequentially formed on the lower electrode. The magnetic tunnel junction structure further includes an upper magnetic layer pattern, a buffer layer pattern, and an upper electrode, which are sequentially formed on a portion of the tunnel layer pattern. The sidewall of the upper magnetic layer pattern is surrounded by an oxidized upper magnetic layer, and the sidewall of the buffer layer pattern is surrounded by an oxidized buffer layer. The depletion of the upper magnetic layer pattern and the lower magnetic layer pattern in the magnetic tunnel junction region can be prevented by the oxidized buffer layer.

    摘要翻译: 提供了一种磁性隧道结结构及其制造方法。 磁性隧道结结构包括依次形成在下电极上的下电极,下磁层图案和隧道层图案。 磁隧道结结构还包括依次形成在隧道层图案的一部分上的上磁层图案,缓冲层图案和上电极。 上部磁性层图案的侧壁由氧化的上部磁性层包围,缓冲层图案的侧壁由氧化的缓冲层包围。 可以通过氧化缓冲层来防止磁性隧道结区域中上部磁性层图案和下部磁性层图案的消耗。

    PHASE CHANGE MEMORY DEVICES AND METHODS OF MANUFACTURING THE SAME
    6.
    发明申请
    PHASE CHANGE MEMORY DEVICES AND METHODS OF MANUFACTURING THE SAME 有权
    相变存储器件及其制造方法

    公开(公告)号:US20120273741A1

    公开(公告)日:2012-11-01

    申请号:US13443132

    申请日:2012-04-10

    IPC分类号: H01L47/00 H01L21/02

    摘要: A method of manufacturing a phase change memory device includes forming a lower electrode layer pattern and an insulating interlayer covering the lower electrode layer pattern, forming a first opening in the insulating interlayer to expose the lower electrode layer pattern, forming an oxide layer pattern on the sidewall of the first opening and a lower electrode under the oxide layer pattern by partially removing the oxide layer and the lower electrode layer pattern, forming an insulation layer filling a remaining portion of the first opening, removing the oxide layer pattern by a wet etching process to form a second opening, and forming a phase change material pattern on the lower electrode such that the phase change material pattern fills the second opening.

    摘要翻译: 一种制造相变存储器件的方法包括:形成下电极层图案和覆盖下电极层图案的绝缘夹层,在绝缘中间层中形成第一开口以露出下电极层图案,在其上形成氧化层图案 通过部分地除去氧化物层和下部电极层图案,形成绝缘层,在第一开口的侧壁和下部电极的下方形成氧化物层图案,形成绝缘层,填充第一开口的剩余部分,通过湿蚀刻工艺去除氧化物层图案 以形成第二开口,并且在下电极上形成相变材料图案,使得相变材料图案填充第二开口。

    Phase change memory device and method of fabricating the same
    7.
    发明申请
    Phase change memory device and method of fabricating the same 有权
    相变存储器件及其制造方法

    公开(公告)号:US20080237566A1

    公开(公告)日:2008-10-02

    申请号:US11905244

    申请日:2007-09-28

    IPC分类号: H01L47/00

    摘要: A phase change memory device and method of manufacturing the same is provided. A first electrode having a first surface is provided on a substrate. A second electrode having a second surface at a different level from the first surface is on the substrate. The second electrode may be spaced apart from the first electrode. A third electrode may be formed corresponding to the first electrode. A fourth electrode may be formed corresponding to the second electrode. A first phase change pattern may be interposed between the first surface and the third electrode. A second phase change pattern may be interposed between the second surface and the fourth electrode. Upper surfaces of the first and second phase change patterns may be on the same plane

    摘要翻译: 提供了一种相变存储器件及其制造方法。 具有第一表面的第一电极设置在基板上。 具有与第一表面不同的第二表面的第二电极在基板上。 第二电极可以与第一电极间隔开。 可以对应于第一电极形成第三电极。 可以对应于第二电极形成第四电极。 可以在第一表面和第三电极之间插入第一相变图案。 可以在第二表面和第四电极之间插入第二相变图案。 第一和第二相变图案的上表面可以在同一平面上

    Magnetic random access memory device and method of forming the same

    公开(公告)号:US20080153179A1

    公开(公告)日:2008-06-26

    申请号:US12073098

    申请日:2008-02-29

    IPC分类号: H01L21/00

    摘要: Example embodiments of the present invention disclose a semiconductor memory device and a method of forming a memory device. A semiconductor memory device may include a digit line disposed on a substrate, an intermediate insulating layer covering the digit line, a magnetic tunnel junction (MTJ) pattern disposed on the intermediate insulating layer and over the digit line, the MTJ pattern including a sequentially stacked lower magnetic pattern, upper magnetic pattern, and capping pattern, wherein the capping pattern does not react with the upper magnetic pattern at a temperature above about 280° C., and a bit line connected to the capping pattern and disposed to intersect the digit line. A method of forming a semiconductor memory device may include forming a digit line on a substrate, forming an intermediate insulating layer covering the digit line, forming a magnetic tunnel junction (MTJ) pattern on the intermediate insulating layer, the MTJ pattern including a sequentially stacked lower magnetic pattern, upper magnetic pattern, and capping pattern, wherein the capping pattern does not react with the upper magnetic pattern at a temperature above about 280° C., performing an annealing operation at a temperature of about 350° C. or higher, and forming a bit line connected to the capping pattern and disposed to intersect the digit line.

    METHOD OF FORMING A PHASE-CHANGEABLE STRUCTURE
    9.
    发明申请
    METHOD OF FORMING A PHASE-CHANGEABLE STRUCTURE 审中-公开
    形成相变结构的方法

    公开(公告)号:US20070166870A1

    公开(公告)日:2007-07-19

    申请号:US11623890

    申请日:2007-01-17

    IPC分类号: H01L21/00

    摘要: In one embodiment, a phase-changeable structure can be formed by forming a phase-changeable layer on the lower electrode, forming a conductive layer on the phase-changeable layer, etching the conductive layer using a first etching material to form an upper electrode and etching the phase-changeable layer using a second etching material to form a phase-changeable pattern. The first etching material can include a first component containing fluorine. The second etching material does not contain chlorine.

    摘要翻译: 在一个实施例中,可以通过在下电极上形成相变层,在相变层上形成导电层,使用第一蚀刻材料蚀刻导电层以形成上电极和 使用第二蚀刻材料蚀刻相变层以形成相变图案。 第一蚀刻材料可以包括含氟的第一成分。 第二蚀刻材料不含氯。

    METHOD FABRICATING SEMICONDUCTOR DEVICE USING MULTIPLE POLISHING PROCESSES
    10.
    发明申请
    METHOD FABRICATING SEMICONDUCTOR DEVICE USING MULTIPLE POLISHING PROCESSES 有权
    使用多个抛光工艺制作半导体器件的方法

    公开(公告)号:US20110306173A1

    公开(公告)日:2011-12-15

    申请号:US13084657

    申请日:2011-04-12

    IPC分类号: H01L21/02

    摘要: A method of fabricating a phase change memory device includes the use of first, second and third polishing processes. The first polishing process forms a first contact portion using a first sacrificial layer and the second polishing process forms a phase change material pattern using a second sacrificial layer. After removing the first and second sacrificial layers to expose resultant protruding structures of the first contact portion and the phase change material pattern, a third polishing process is used to polish the resultant protruding structures using an insulation layer as a polishing stopper layer.

    摘要翻译: 制造相变存储器件的方法包括使用第一,第二和第三抛光工艺。 第一抛光工艺使用第一牺牲层形成第一接触部分,并且第二抛光工艺使用第二牺牲层形成相变材料图案。 在去除第一和第二牺牲层以暴露第一接触部分的相应突出结构和相变材料图案之后,使用第三抛光工艺来使用绝缘层作为抛光停止层来抛光所得的突出结构。