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公开(公告)号：US20100105154A1
公开(公告)日：2010-04-29
申请号：US12685820
申请日：2010-01-12
申请人： XINMING WANG , Daisuke Takagi , Akihiko Tashiro , Yukio Fukunaga , Akira Fukunaga , Akira Owatari , Yukiko Nishioka
发明人： XINMING WANG , Daisuke Takagi , Akihiko Tashiro , Yukio Fukunaga , Akira Fukunaga , Akira Owatari , Yukiko Nishioka
CPC分类号： H01L21/02068 , C23C18/1632 , C23C18/1689 , C23C18/1844 , H01L21/02074 , H01L21/288 , H01L21/67028 , H01L21/76849 , H01L21/76874 , H01L21/76883
摘要： A substrate processing method can securely form a metal film by electroless plating on an exposed surface of a base metal, such as interconnects, with increased throughput and without the formation of voids in the base metal. The substrate processing method includes: cleaning a surface of a substrate having a base metal formed in the surface with a cleaning solution comprising an aqueous solution of a carboxyl group-containing organic acid or its salt and a surfactant as an additive; bringing the surface of the substrate after the cleaning into contact with a processing solution comprising a mixture of the cleaning solution and a solution containing a catalyst metal ion, thereby applying the catalyst to the surface of the substrate; and forming a metal film by electroless plating on the catalyst-applied surface of the substrate.
摘要翻译： 基板处理方法可以通过在贱金属（例如互连）的暴露表面上通过无电解电镀牢固地形成金属膜，具有增加的生产量并且在母材中不形成空隙。 基板处理方法包括：用包含含羧基的有机酸或其盐和表面活性剂的水溶液作为添加剂的清洗溶液清洗在表面形成的基体金属的基材的表面; 使清洗后的基板的表面与包含清洗液和含有催化剂金属离子的溶液的混合物的处理溶液接触，从而将催化剂施加到基板的表面; 以及通过在基板的催化剂涂覆表面上通过无电镀形成金属膜。
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公开(公告)号：US20050245080A1
公开(公告)日：2005-11-03
申请号：US11039967
申请日：2005-01-24
申请人： Xinming Wang , Daisuke Takagi , Akihiko Tashiro , Yukio Fukunaga , Akira Fukunaga , Akira Owatari , Yukiko Nishioka , Tsuyoshi Sahoda
发明人： Xinming Wang , Daisuke Takagi , Akihiko Tashiro , Yukio Fukunaga , Akira Fukunaga , Akira Owatari , Yukiko Nishioka , Tsuyoshi Sahoda
IPC分类号： C23C18/16 , C23C18/18 , H01L21/00 , H01L21/02 , H01L21/288 , H01L21/306 , H01L21/321 , H01L21/768 , H01L21/4763 , H01L21/44
CPC分类号： H01L21/02068 , C23C18/1632 , C23C18/1689 , C23C18/1844 , H01L21/02074 , H01L21/288 , H01L21/67028 , H01L21/76849 , H01L21/76874 , H01L21/76883
摘要： A substrate processing method can securely form a metal film by electroless plating on an exposed surface of a base metal, such as interconnects, with increased throughput and without the formation of voids in the base metal. The substrate processing method includes: cleaning a surface of a substrate having a base metal formed in the surface with a cleaning solution comprising an aqueous solution of a carboxyl group-containing organic acid or its salt and a surfactant as an additive; bringing the surface of the substrate after the cleaning into contact with a processing solution comprising a mixture of the cleaning solution and a solution containing a catalyst metal ion, thereby applying the catalyst to the surface of the substrate; and forming a metal film by electroless plating on the catalyst-applied surface of the substrate.
摘要翻译： 基板处理方法可以通过在贱金属（例如互连）的暴露表面上通过无电解电镀牢固地形成金属膜，具有增加的生产量并且在母材中不形成空隙。 基板处理方法包括：用包含含羧基的有机酸或其盐和表面活性剂的水溶液作为添加剂的清洗溶液清洗在表面形成的基体金属的基材的表面; 使清洗后的基板的表面与包含清洗液和含有催化剂金属离子的溶液的混合物的处理溶液接触，从而将催化剂施加到基板的表面; 以及通过在基板的催化剂涂覆表面上通过无电镀形成金属膜。
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公开(公告)号：US20080000776A1
公开(公告)日：2008-01-03
申请号：US11896071
申请日：2007-08-29
申请人： Xinming Wang , Daisuke Takagi , Akihiko Tashiro , Yukio Fukunaga , Akira Fukunaga , Akira Owatari , Yukiko Nishioka
发明人： Xinming Wang , Daisuke Takagi , Akihiko Tashiro , Yukio Fukunaga , Akira Fukunaga , Akira Owatari , Yukiko Nishioka
CPC分类号： H01L21/02068 , C23C18/1632 , C23C18/1689 , C23C18/1844 , H01L21/02074 , H01L21/288 , H01L21/67028 , H01L21/76849 , H01L21/76874 , H01L21/76883
摘要： A substrate processing method can securely form a metal film by electroless plating on an exposed surface of a base metal, such as interconnects, with increased throughput and without the formation of voids in the base metal. The substrate processing method includes: cleaning a surface of a substrate having a base metal formed in the surface with a cleaning solution comprising an aqueous solution of a carboxyl group-containing organic acid or its salt and a surfactant as an additive; bringing the surface of the substrate after the cleaning into contact with a processing solution comprising a mixture of the cleaning solution and a solution containing a catalyst metal ion, thereby applying the catalyst to the surface of the substrate; and forming a metal film by electroless plating on the catalyst-applied surface of the substrate.
摘要翻译： 基板处理方法可以通过在贱金属（例如互连）的暴露表面上通过无电解电镀牢固地形成金属膜，具有增加的生产量并且在母材中不形成空隙。 基板处理方法包括：用包含含羧基的有机酸或其盐和表面活性剂的水溶液作为添加剂的清洗溶液清洗在表面形成的基体金属的基材的表面; 使清洗后的基板的表面与包含清洗液和含有催化剂金属离子的溶液的混合物的处理溶液接触，从而将催化剂施加到基板的表面; 以及通过在基板的催化剂涂覆表面上通过无电镀形成金属膜。
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公开(公告)号：US07285492B2
公开(公告)日：2007-10-23
申请号：US11039967
申请日：2005-01-24
申请人： Xinming Wang , Daisuke Takagi , Akihiko Tashiro , Yukio Fukunaga , Akira Fukunaga , Akira Owatari , Yukiko Nishioka , Tsuyoshi Sahoda
发明人： Xinming Wang , Daisuke Takagi , Akihiko Tashiro , Yukio Fukunaga , Akira Fukunaga , Akira Owatari , Yukiko Nishioka , Tsuyoshi Sahoda
IPC分类号： H01L21/44
CPC分类号： H01L21/02068 , C23C18/1632 , C23C18/1689 , C23C18/1844 , H01L21/02074 , H01L21/288 , H01L21/67028 , H01L21/76849 , H01L21/76874 , H01L21/76883
摘要： A substrate processing method can securely form a metal film by electroless plating on an exposed surface of a base metal, such as interconnects, with increased throughput and without the formation of voids in the base metal. The substrate processing method includes: cleaning a surface of a substrate having a base metal formed in the surface with a cleaning solution comprising an aqueous solution of a carboxyl group-containing organic acid or its salt and a surfactant as an additive; bringing the surface of the substrate after the cleaning into contact with a processing solution comprising a mixture of the cleaning solution and a solution containing a catalyst metal ion, thereby applying the catalyst to the surface of the substrate; and forming a metal film by electroless plating on the catalyst-applied surface of the substrate.
摘要翻译： 基板处理方法可以通过在贱金属（例如互连）的暴露表面上通过无电解电镀牢固地形成金属膜，具有增加的生产量并且在母材中不形成空隙。 基板处理方法包括：用包含含羧基的有机酸或其盐和表面活性剂的水溶液作为添加剂的清洗溶液清洗在表面形成的基体金属的基材的表面; 使清洗后的基板的表面与包含清洗液和含有催化剂金属离子的溶液的混合物的处理溶液接触，从而将催化剂施加到基板的表面; 以及通过在基板的催化剂涂覆表面上通过无电镀形成金属膜。
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公开(公告)号：US20050252535A1
公开(公告)日：2005-11-17
申请号：US10536961
申请日：2004-05-26
申请人： Yukiko Nishioka , Koji Ato , Ryosuke Yonekura , Yoshikazu Ariga
发明人： Yukiko Nishioka , Koji Ato , Ryosuke Yonekura , Yoshikazu Ariga
IPC分类号： H01L21/304 , B08B7/00 , H01L21/00
CPC分类号： H01L21/67028 , H01L21/67051
摘要： A substrate cleaning apparatus is used for cleaning and drying a substrate such as a semiconductor wafer used in a semiconductor fabricating process or the like. The substrate cleaning apparatus includes a substrate holding mechanism (10) configured to hold the substrate (W), and a rotating mechanism (20) configured to rotate the substrate holding mechanism (10). At least one of components of the substrate cleaning apparatus has a surface structure to which droplets are hardly attached.
摘要翻译： 基板清洗装置用于清洗和干燥半导体制造工艺等中使用的半导体晶片等基板。 基板清洗装置具备：保持基板（W）的基板保持机构（10）和旋转基板保持机构（10）的旋转机构（20）。 基板清洗装置的至少一个部件具有难以附着液滴的表面结构。
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公开(公告)号：US20080000509A1
公开(公告)日：2008-01-03
申请号：US11882565
申请日：2007-08-02
IPC分类号： B08B9/00
CPC分类号： H01L21/67051 , B08B3/02 , H01L21/67028
摘要： A cleaning apparatus in which cleaning and drying can be carried out without the risk of reverse contamination of the cleaned object after the drying process. The cleaning apparatus includes a supporting device for supporting an object to be cleaned, and a cleaning cup surrounding the supporting device to prevent splashing of a cleaning liquid. The cleaning apparatus includes a cleaning device for cleaning an inner wall of the cleaning cup with a cleaning liquid.
摘要翻译： 可以进行清洁和干燥的清洁装置，而不会在干燥过程之后被清洁物体反向污染的风险。 清洁装置包括用于支撑待清洁物体的支撑装置和围绕支撑装置的清洁杯，以防止清洗液体飞溅。 清洁装置包括用清洁液清洁清洁杯的内壁的清洁装置。
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公开(公告)号：US06932946B2
公开(公告)日：2005-08-23
申请号：US09885102
申请日：2001-06-21
申请人： Ryoichi Shinjo , Minoru Harada , Yukiko Nishioka
发明人： Ryoichi Shinjo , Minoru Harada , Yukiko Nishioka
CPC分类号： C01B13/11 , C01B2201/12 , C01B2201/22
摘要： An ozone generator comprises a pair of spaced opposing electrodes, electrically conductive members connecting the pair of electrodes to a high-voltage alternating-current power source to generate an electric discharge between the electrodes, and a dielectric provided between the opposing electrodes. A gas flow passage for allowing flow of a material gas therethrough is defined by the surfaces of the electrodes. At least one of the surfaces of the pair of electrodes has a plurality of parallel grooves. The material gas flows in a space between the plurality of grooves and the dielectric, in a direction transverse to the grooves.
摘要翻译： 臭氧发生器包括一对间隔的相对电极，将该对电极连接到高压交流电源的导电构件，以在电极之间产生放电，以及设置在相对电极之间的电介质。 用于允许材料气体流过其中的气体流动通道由电极的表面限定。 该对电极的至少一个表面具有多个平行的凹槽。 材料气体在横向于槽的方向上在多个槽和电介质之间的空间中流动。
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公开(公告)号：US20050050946A1
公开(公告)日：2005-03-10
申请号：US10932083
申请日：2004-09-02
申请人： Yukiko Nishioka , Yoshikazu Ariga
发明人： Yukiko Nishioka , Yoshikazu Ariga
IPC分类号： H01L21/304 , B08B13/00 , G01M99/00 , H01L23/544 , H01L21/66 , G01M19/00
CPC分类号： B08B13/00 , H01L22/34 , H01L2924/0002 , H01L2924/00
摘要： The present invention relates to a cleaning evaluation method for evaluating a surface cleanliness of a substrate which has been cleaned after being polished. This method includes, preparing a dummy substrate having a metal film formed on a surface thereof and a monitor substrate on which a cleaning evaluation is performed, polishing the dummy substrate, after polishing the dummy substrate, polishing the monitor substrate without dressing a polishing surface of a polishing table, cleaning the monitor substrate, and evaluating the surface cleanliness of the monitor substrate which has been cleaned.
摘要翻译： 本发明涉及一种用于评价在抛光后被清洗的基板的表面清洁度的清洁评估方法。 该方法包括：准备在其表面上形成有金属膜的虚设基板和进行清洁评估的监视基板，对该虚设基板进行研磨后对该虚设基板进行研磨，对该监视基板进行研磨， 抛光台，清洁监视器基板，以及评估已清洁的监视器基板的表面清洁度。
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公开(公告)号：US07155963B2
公开(公告)日：2007-01-02
申请号：US10932083
申请日：2004-09-02
申请人： Yukiko Nishioka , Yoshikazu Ariga
发明人： Yukiko Nishioka , Yoshikazu Ariga
CPC分类号： B08B13/00 , H01L22/34 , H01L2924/0002 , H01L2924/00
摘要： The present invention relates to a cleaning evaluation method for evaluating a surface cleanliness of a substrate which has been cleaned after being polished. This method includes preparing a dummy substrate having a metal film formed on a surface thereof and a monitor substrate on which a cleaning evaluation is performed, and polishing the dummy substrate. After polishing the dummy substrate, the monitor substrate is polished without dressing a polishing surface of a polishing table, the monitor substrate is cleaned, and the surface cleanliness of the monitor substrate which has been cleaned is evaluated.
摘要翻译： 本发明涉及一种用于评价在抛光后被清洗的基板的表面清洁度的清洁评估方法。 该方法包括制备在其表面上形成有金属膜的虚拟基板和在其上执行清洁评估的监视器基板，以及抛光该虚设基板。 在抛光虚拟基板之后，在不修整抛光台的研磨面的情况下对监视器基板进行抛光，对显示器基板进行清洁，并对已经清洗的显示器基板的表面清洁度进行评价。
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公开(公告)号：US20050020194A1
公开(公告)日：2005-01-27
申请号：US10883772
申请日：2004-07-06
申请人： Tatsuya Kohama , Yukiko Nishioka , Yoshikazu Ariga
发明人： Tatsuya Kohama , Yukiko Nishioka , Yoshikazu Ariga
IPC分类号： B24B1/00 , B24B53/017 , B24B57/02 , H01L21/304
摘要： A method and apparatus for polishing a workpiece are set forth which can polish the workpiece at a constant rate at a stable condition even when plural workpieces are continually polished. The method comprises dressing a polishing surface of a polishing table while supplying a dressing solution. After the dressing, the dressing solution remaining on the polishing surface is removed by rotating the polishing table at a dewatering rotation speed while stopping the supply of the dressing solution. Then, the workpiece is polished by making the workpiece slidingly contact with the polishing surface while supplying a polishing solution to the polishing surface.
摘要翻译： 阐述了一种用于抛光工件的方法和装置，即使当多个工件被连续抛光时，其可以以稳定的状态以恒定的速度抛光工件。 该方法包括在提供敷料溶液的同时修整抛光台的抛光表面。 修整后，通过在停止供给敷料溶液的同时以脱水转速旋转研磨台，除去留在研磨面上的敷料液。 然后，通过使工件与研磨面滑动接触，同时向研磨面供给研磨液，抛光工件。
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