公开(公告)号：US20150228536A1

公开(公告)日：2015-08-13

申请号：US14618413

申请日：2015-02-10

Applicant: XINTEC INC.

Inventor： Yen-Shih HO ,  Tsang-Yu LIU ,  Chia-Sheng LIN ,  Chia-Ming CHENG ,  Shu-Ming CHANG ,  Tzu-Wen TSENG

IPC: H01L21/768 ,  H01L21/302 ,  H01L23/50

CPC classification number: H01L24/94 ,  H01L23/3114 ,  H01L23/3178 ,  H01L23/525 ,  H01L24/03 ,  H01L24/05 ,  H01L24/06 ,  H01L29/0657 ,  H01L2224/0224 ,  H01L2224/02245 ,  H01L2224/02255 ,  H01L2224/0226 ,  H01L2224/02375 ,  H01L2224/02379 ,  H01L2224/0345 ,  H01L2224/03462 ,  H01L2224/03464 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05548 ,  H01L2224/05571 ,  H01L2224/05611 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05669 ,  H01L2224/06165 ,  H01L2224/10135 ,  H01L2224/10145 ,  H01L2224/94 ,  H01L2924/3512 ,  H01L2224/03 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/0665

Abstract: A chip package including a semiconductor substrate is provided. A recess is in the semiconductor substrate and adjoins a side edge of the semiconductor substrate, wherein the semiconductor substrate has at least one spacer protruding from the bottom of the recess. A conducting layer is disposed on the semiconductor substrate and extends into the recess.

Abstract translation: 提供了包括半导体衬底的芯片封装。 凹部位于半导体衬底中并与半导体衬底的侧边相邻，其中半导体衬底具有从凹部的底部突出的至少一个间隔件。 导电层设置在半导体衬底上并延伸到凹槽中。