公开(公告)号：US06194250B1

公开(公告)日：2001-02-27

申请号：US09152899

申请日：1998-09-14

申请人： Cynthia M. Melton ,  George N. Demet ,  Iwona Turlik

发明人： Cynthia M. Melton ,  George N. Demet ,  Iwona Turlik

IPC分类号： H01L2148

CPC分类号： H01L21/568 ,  H01L23/3128 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2224/85001 ,  H01L2224/854 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/18165 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00

摘要： A microelectronic package (10) is formed by placing a lead frame (22) onto an adhesive polyimide tape (38). The lead frame (22) includes a plurality of metallic leads (16) and an opening. An integrated circuit die (12) is positioned onto the molding support (38) within the opening such that a non-active face (32) of the integrated circuit die (12) rests against the molding support (38). Wire leads (18) connect an active face (28) of the integrated circuit die (12) to the metallic leads (16). A plurality of metallic bumps (20) are attached to the metallic leads (16), and a polymeric precursor is dispensed. The precursor embeds the active face (28) of the integrated circuit die (12), the inner surface (19) of the metallic leads (16), the wire leads (18), and the metallic bumps (20). The microelectronic package (10) is then heated to cure the polymeric precursor to form a polymeric body (14). The microelectronic package (10) is then capable of being tested and subsequently attached to printed circuit board (40) to form a low-profile microelectronic assembly (11).

摘要翻译： 通过将引线框架（22）放置在粘合聚酰亚胺胶带（38）上形成微电子封装（10）。 引线框架（22）包括多个金属引线（16）和开口。 集成电路模具（12）被定位在开口内的模制支撑件（38）上，使得集成电路模具（12）的非活动面（32）靠在模制支撑件（38）上。 导线（18）将集成电路管芯（12）的有源面（28）连接到金属引线（16）。 多个金属凸块（20）连接到金属引线（16）上，分配聚合物前体。 前体嵌入集成电路管芯（12）的有源面（28），金属引线（16）的内表面（19），引线引线（18）和金属凸块（20）。 然后加热微电子封装（10）以固化聚合物前体以形成聚合体（14）。 微电子封装（10）然后能够被测试并且随后连接到印刷电路板（40）以形成薄型微电子组件（11）。

公开(公告)号：US5895229A

公开(公告)日：1999-04-20

申请号：US858756

申请日：1997-05-19

申请人： Francis J. Carney ,  George Amos Carson ,  Phillip C. Celaya ,  Harry Fuerhaupter ,  Frank Tim Jones ,  Donald H. Klosterman ,  Cynthia M. Melton ,  James Howard Knapp ,  Keith E. Nelson

发明人： Francis J. Carney ,  George Amos Carson ,  Phillip C. Celaya ,  Harry Fuerhaupter ,  Frank Tim Jones ,  Donald H. Klosterman ,  Cynthia M. Melton ,  James Howard Knapp ,  Keith E. Nelson

IPC分类号： H01L21/56 ,  H01L23/31 ,  H01L21/44 ,  H01L21/48

CPC分类号： H01L21/565 ,  H01L21/561 ,  H01L23/3121 ,  H01L24/97 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311

摘要： A microelectronic package (10) is formed and includes an integrated circuit die (12) attached to a substrate (14) by a plurality of solder bump interconnections (16) to form a preassembly (18). The integrated circuit die (12) has an active face (20) that faces the substrate (14) and is spaced apart therefrom by a gap (22). The integrated circuit die (12) also includes a back face (24) opposite the active face (20). The substrate (14) includes a die attach region (26) and a surrounding region (28) about the integrated circuit die (12). The solder bump interconnections (16) extend across the gap (22) and connect the integrated circuit die (12) and the substrate (14). A mold (30) is disposed about the preassembly (18) such that the mold (30) cooperates with the substrate (14) to define a mold cavity (32) that encloses the integrated circuit die (12). The mold (30) has a molding surface (34) that includes the surrounding region (28) and a mold surface (34) that faces the back face (24) and is spaced apart therefrom. A polymeric precursor (36) is dispensed into the mold cavity (32) and is formed against the molding surface (34) and the back face (24). The polymeric precursor (36) is then cured to form a polymeric encapsulant (38) that encapsulates the integrated circuit die (12).

摘要翻译： 形成微电子封装（10）并且包括通过多个焊料凸块互连（16）附接到衬底（14）以形成预组件（18）的集成电路管芯（12）。 集成电路管芯（12）具有面向衬底（14）并与间隔开的间隙（22）的有效面（20）。 集成电路管芯（12）还包括与有源面（20）相对的背面（24）。 衬底（14）包括管芯附接区域（26）和围绕集成电路管芯（12）的周围区域（28）。 焊料凸点互连（16）跨越间隙（22）延伸并连接集成电路管芯（12）和衬底（14）。 模具（30）围绕预组件（18）设置，使得模具（30）与衬底（14）配合以限定围绕集成电路管芯（12）的模腔（32）。 模具（30）具有包括周围区域（28）的模制表面（34）和面向背面（24）并与其间隔开的模具表面（34）。 聚合物前体（36）被分配到模腔（32）中并且抵靠模制表面（34）和背面（24）形成。 聚合物前体（36）然后被固化以形成封装集成电路管芯（12）的聚合密封剂（38）。

公开(公告)号：US5154341A

公开(公告)日：1992-10-13

申请号：US622996

申请日：1990-12-06

申请人： Cynthia M. Melton ,  Carl J. Raleigh ,  Steven Scheifers

发明人： Cynthia M. Melton ,  Carl J. Raleigh ,  Steven Scheifers

IPC分类号： H01L23/498 ,  H05K3/34

CPC分类号： H01L23/49827 ,  H05K3/3436 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01014 ,  H01L2924/01078 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15311 ,  H05K2201/10734 ,  H05K2201/10992 ,  H05K2201/2036 ,  Y02P70/613

摘要： An improved electrical component package comprises a component attached to a substrate by a plurality of multisolder interconnections. Each interconnection comprises a preformed spacer bump composed of a first solder alloy, preferably a lead-base tin alloy containing greater than 90 weight percent lead. The spacer bump is bonded to a metallic electrical contact of the component and rests against a corresponding metallic electrical contact of the substrate, but is not directly metallurgically bonded thereto. Each interconnection further comprises a sheath portion formed of a second compositionally distinct solder alloy having a liquidus temperature less than the first alloy solidus temperature. A preferred second solder is a tin-lead alloy comprising between about 30 and 50 weight percent lead and the balance tin or indium. The sheath is bonded to the spacer bump and to the substrate contact to complete attachment of the component to the substrate and preferably extends to the component contact, encasing the bump, to produce an interconnection having an hour glass configuration to reduce thermal fatigue stresses at the solder bonds to the contacts. A method for forming the multisolder interconnection is presented wherein the sheath is derived from a solder microball situated on the substrate contact in juxtaposition to the spacer bump for reflow.

摘要翻译： 改进的电子部件封装包括通过多个多金属互连连接到基板的部件。 每个互连包括由第一焊料合金构成的预制间隔凸块，优选含有大于90重量％铅的铅基锡合金。 间隔凸块接合到部件的金属电接触件上，并抵靠基板的相应的金属电接触件，但不直接冶金结合到其上。 每个互连还包括由液态温度小于第一合金固相线温度的第二组成不同的焊料合金形成的护套部分。 优选的第二焊料是锡铅合金，其包含约30至50重量％的铅和余量的锡或铟。 护套结合到间隔件凸块和衬底接触件以完成组件到衬底的附接，并且优选地延伸到组件接触件，包住凸块，以产生具有小时玻璃构造的互连，以减少在 焊接到触点。 提出了一种用于形成多金属互连的方法，其中所述护套从位于所述衬底触点上的焊料微球导出并置到用于回流的间隔件凸块。

公开(公告)号：US5086966A

公开(公告)日：1992-02-11

申请号：US608872

申请日：1990-11-05

申请人： Cynthia M. Melton ,  Carl J. Raleigh ,  Steven Scheifers ,  William Beckenbaugh

发明人： Cynthia M. Melton ,  Carl J. Raleigh ,  Steven Scheifers ,  William Beckenbaugh

IPC分类号： B23K1/20 ,  B23K35/02 ,  H05K3/34

CPC分类号： B23K35/0244 ,  B23K1/20 ,  H05K3/3436 ,  H05K2203/041 ,  H05K2203/0435 ,  Y02P70/613 ,  Y10T428/12181 ,  Y10T428/12687 ,  Y10T428/12875

摘要： A body formed of a lead-tin solder alloy is pretreated to deposit palladium thereon prior to soldering to a metallic substrate. It is found that the palladium deposit enhances wetting of the substrate by the solder liquid during reflow and thereby, upon cooling, produces a strong metallurgical bond. In a preferred embodiment, lead-tin solder balls are pretreated by applying tin-palladium colloidal particles and dissociating the particles to form a discontinuous metallic palladium deposit.

摘要翻译： 在焊接到金属基底之前，预先处理由铅 - 锡焊料合金形成的本体以在其上沉积钯。 发现钯沉积物在回流期间通过焊料增强了衬底的润湿，从而在冷却时产生强烈的冶金结合。 在优选的实施方案中，铅锡焊球通过施加锡 - 钯胶体颗粒进行预处理，并使颗粒解离以形成不连续的金属钯沉积物。

公开(公告)号：US5814401A

公开(公告)日：1998-09-29

申请号：US794826

申请日：1997-02-04

申请人： Daniel R. Gamota ,  Robert W. Pennisi ,  Cynthia M. Melton

发明人： Daniel R. Gamota ,  Robert W. Pennisi ,  Cynthia M. Melton

IPC分类号： C09J7/00 ,  H01L21/56 ,  H01L21/58 ,  H05K3/30 ,  H05K3/34 ,  C09J7/02

CPC分类号： H01L24/83 ,  C09J7/00 ,  H01L21/563 ,  H01L24/29 ,  H05K3/305 ,  H05K3/3489 ,  C09J2201/61 ,  H01L2224/16225 ,  H01L2224/29076 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/8319 ,  H01L2224/83856 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01056 ,  H01L2924/01068 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/351 ,  H05K2201/0187 ,  H05K2201/0209 ,  H05K2201/068 ,  H05K2201/10674 ,  H05K2201/10734 ,  H05K2201/10977 ,  H05K3/3436 ,  Y02P70/613 ,  Y10T428/28 ,  Y10T428/2852 ,  Y10T428/287

摘要： A selectively filled thermally curable adhesive film (10) contains a fluxing agent for reflow soldering an electronic device to a substrate. The adhesive film has a central, region (12) and a boundary region (14) surrounding the central region. The central region consists of an adhesive that is filled with an inert filler to reduce the co-efficient of thermal expansion of the adhesive. The boundary region consists of an unfilled adhesive and a fluxing agent. The film may be used to adhesively bond a flip chip semiconductor die (20) to a substrate (21). When solder bumps (22) on the die are reflowed, the fluxing agent acts to remove any oxides present on the solderable surfaces of the substrate or the die.

摘要翻译： 选择填充的可热固化的粘合膜（10）包含用于将电子器件回流焊接到基底的助熔剂。 粘合膜具有围绕中心区域的中心区域（12）和边界区域（14）。 中心区域由填充有惰性填料的粘合剂组成，以降低粘合剂热膨胀的有效性。 边界区域由未填充的粘合剂和助熔剂组成。 膜可以用于将倒装芯片半导体管芯（20）粘合地结合到衬底（21）。 当芯片上的焊料凸点（22）被回流时，助熔剂用于除去存在于基板或模具的可焊接表面上的任何氧化物。

公开(公告)号：US5597110A

公开(公告)日：1997-01-28

申请号：US519439

申请日：1995-08-25

申请人： Cynthia M. Melton ,  Robert Pfahl

发明人： Cynthia M. Melton ,  Robert Pfahl

IPC分类号： B23K1/20 ,  H01L21/48 ,  H05K3/34 ,  B23K1/00

CPC分类号： H05K3/3457 ,  B23K1/20 ,  H01L21/4853 ,  B23K2201/36 ,  H05K2203/013 ,  H05K3/3463 ,  H05K3/3473

摘要： The present invention provides a method for forming a solder bump (24) on a substrate (20). The substrate (20) includes a bond pad (18) having a faying surface (19) composed of solder-wettable metal. The method includes coating the faying surface (19) with a plate (16) formed of a first metal having a first melting temperature, and projecting a discrete microdroplet (14) onto the plate (16). The microdroplet (14) is formed of a molten second metal and has a second melting temperature greater than the first melting temperature. The microdroplet (14) fuses to the plate (16) to form the solder bump (24).

摘要翻译： 本发明提供了一种在衬底（20）上形成焊料凸点（24）的方法。 基板（20）包括具有由可焊接润湿金属构成的引线表面（19）的接合焊盘（18）。 所述方法包括用由具有第一熔融温度的第一金属形成的板（16）涂覆所述引线表面（19），并将离散的微滴（14）投射到所述板（16）上。 微滴（14）由熔融的第二金属形成，并且具有大于第一熔融温度的第二熔融温度。 微滴（14）熔合到板（16）以形成焊料凸块（24）。

公开(公告)号：US5429292A

公开(公告)日：1995-07-04

申请号：US304025

申请日：1994-09-09

申请人： Cynthia M. Melton ,  William Beckenbaugh ,  Dennis Miller

发明人： Cynthia M. Melton ,  William Beckenbaugh ,  Dennis Miller

IPC分类号： B23K35/22 ,  B23K35/02 ,  B23K35/26 ,  H05K3/34 ,  B23K35/24

CPC分类号： H05K3/3484 ,  B23K35/025 ,  B23K35/264 ,  H05K2201/0272 ,  H05K3/3463

摘要： A solder paste of the type utilized in forming a solder onnectin for a microelectronic package comprises a mixture of compositionally distinct metal powders. The paste comprises a first metal powder formed of tin-bismuth solder alloy. The paste further comprises a second metal powder containing gold or silver. During reflow, the gold or silver alloys with the tin-bismuth solder to increase the melting part and enhance mechanical properties of the product connection.

公开(公告)号：US5389160A

公开(公告)日：1995-02-14

申请号：US69640

申请日：1993-06-01

申请人： Cynthia M. Melton ,  William Beckenbaugh ,  Dennis Miller

发明人： Cynthia M. Melton ,  William Beckenbaugh ,  Dennis Miller

IPC分类号： B23K35/22 ,  B23K35/02 ,  B23K35/26 ,  H05K3/34 ,  B23K35/34

CPC分类号： H05K3/3484 ,  B23K35/025 ,  B23K35/264 ,  H05K2201/0272 ,  H05K3/3463

摘要： A solder paste of the type utilized in forming a solder onnectin for a microelectronic package comprises a mixture of compositionally distinct metal powders. The paste comprises a first metal powder formed of tin-bismuth solder alloy. The paste further comprises a second metal powder containing gold or silver. During reflow, the gold or silver alloys with the tin-bismuth solder to increase the melting part and enhance mechanical properties of the product connection.

摘要翻译： 用于形成用于微电子封装的连接蛋白的焊料的类型的焊膏包括组成不同的金属粉末的混合物。 该糊料包括由锡 - 铋焊料合金形成的第一金属粉末。 该糊料还包含含有金或银的第二金属粉末。 在回流期间，金或银合金与锡 - 铋焊料增加熔化部分并增强产品连接的机械性能。

公开(公告)号：US5269453A

公开(公告)日：1993-12-14

申请号：US958398

申请日：1992-10-08

申请人： Cynthia M. Melton ,  Kenneth Cholewczynski ,  Kevin D. Moore ,  Carl Raleigh

发明人： Cynthia M. Melton ,  Kenneth Cholewczynski ,  Kevin D. Moore ,  Carl Raleigh

IPC分类号： H01L21/60 ,  H01L23/498 ,  H05K3/34

CPC分类号： H01L24/81 ,  H01L23/49866 ,  H05K3/3436 ,  H01L2224/81191 ,  H01L2224/81801 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  H05K2201/09781 ,  H05K3/3473 ,  Y02P70/613

摘要： An integrated circuit component is attached to a printed circuit board by solder bump interconnections that are formed between metal bumps on the component and a metal-plated terminal on the board. The metal plate overlies both a bond pad and an adjacent runner of each terminal and is formed of a first metal, which is preferably a tin-base alloy. The metal bumps on the component are formed of a second metal, which is preferably an indium-base alloy. The component and board are assembled and heated to a temperature less than the melting temperatures of the first and second metals. At the interface between the bumps and the plate, the first and second metals cooperate to form a liquid phase which, upon cooling and solidifying, completes the interconnection.

摘要翻译： 集成电路部件通过形成在部件上的金属凸块和板上的金属镀覆端子之间的焊料凸块互连而附接到印刷电路板。 金属板覆盖每个端子的接合焊盘和相邻的流道两者，并且由优选为锡基合金的第一金属形成。 元件上的金属凸块由优选为铟基合金的第二金属形成。 将组件和板组装并加热到低于第一和第二金属的熔融温度的温度。 在凸块和板之间的界面处，第一和第二金属配合形成液相，其在冷却和凝固时完成互连。

公开(公告)号：US5229070A

公开(公告)日：1993-07-20

申请号：US908109

申请日：1992-07-02

申请人： Cynthia M. Melton ,  Andrew Skipor ,  William M. Beckenbaugh

发明人： Cynthia M. Melton ,  Andrew Skipor ,  William M. Beckenbaugh

IPC分类号： B23K35/02 ,  B23K35/26 ,  H05K3/34

CPC分类号： B23K35/025 ,  B23K35/262 ,  H05K3/3484 ,  H05K2201/0272 ,  H05K3/3463

摘要： A low temperature-wetting solder paste for forming a tin-base solder connection comprises a mixture of compositionally distinct first and second solder powders. The first solder is formed predominantly of tin, preferably at least 90 weight percent. The second powder is formed of a tin alloy containing indium or bismuth and having a melting temperature less than the first powder. During soldering, the second powder melts during the early stages of the heating cycle to initiate wetting of the faying surfaces and promote dissolution of the first powder, thereby reducing the time and temperature required to form the solder connection.

摘要翻译： 用于形成锡基焊料连接的低温润湿焊膏包括组成上不同的第一和第二焊料粉末的混合物。 第一焊料主要由锡形成，优选至少为90重量％。 第二粉末由含有铟或铋的锡合金形成，并且具有小于第一粉末的熔化温度。 在焊接期间，第二粉末在加热循环的早期阶段熔化，引发熔融表面的润湿，促进第一粉末的溶解，从而减少形成焊料连接所需的时间和温度。