摘要:
Disclosed is a method for making a pure aluminum nitride substrate. At first, aluminum nitride is mixed with a water-resistant material and an adhesive material. The mixture is made into grains in a granulation process. The grains are molded into a nugget in a steel mode by hydraulic pressure. The nugget is subjected to a cold isostatic pressing process. At a low temperature, the water-resistant material and the adhesive material are removed from the nugget. Then, the nugget, boron nitride and nitrogen are introduced into and sintered in an oven, thus providing a pure aluminum nitride substrate. The purity and quality of the aluminum nitride substrate are high. The aluminum nitride substrate can be used in a light-emitting diode. The method is simple, the yield is high, and the heat radiation of the aluminum nitride substrate is excellent.
摘要:
Disclosed is a method for removing oxygen from aluminum nitride by carbon. At first, an oven is provided. An aluminum nitride substrate is located in the oven. Nitrogen is introduced into the oven to form an atmosphere of nitrogen. The temperature is increased to the transformation point of the aluminum nitride substrate in the oven. Then, the heating is stopped and quenching is conducted in the oven. Carbon is introduced into the oven in the quenching. Thus, oxygen included in the aluminum nitride substrate reacts with the carbon to produce carbon monoxide or carbon dioxide. The carbon monoxide or carbon is released from the oven as well as the nitrogen. Thus, the aluminum nitride substrate is purified.
摘要:
Disclosed is a method for making a pure aluminum nitride substrate. At first, aluminum nitride is mixed with a water-resistant material and an adhesive material. The mixture is made into grains in a granulation process. The grains are molded into a nugget in a steel mode by hydraulic pressure. The nugget is subjected to a cold isostatic pressing process. At a low temperature, the water-resistant material and the adhesive material are removed from the nugget. Then, the nugget, boron nitride and nitrogen are introduced into and sintered in an oven, thus providing a pure aluminum nitride substrate. The purity and quality of the aluminum nitride substrate are high. The aluminum nitride substrate can be used in a light-emitting diode. The method is simple, the yield is high, and the heat radiation of the aluminum nitride substrate is excellent.
摘要:
Disclosed is a substrate-molding apparatus. The substrate-molding apparatus includes a shell, a mold movably located in the shell, an upper pressing disc movably located in the mold, and a lower pressing disc movably located in the mold. The shell includes an internal space defined therein and two open ends in communication with the internal space. The mold includes an internal space defined therein. The upper pressing disc includes at least one cutout defined in the edge thereof. Powder is filled in the internal space of the mold. The powder is pressed and molded by the upper pressing disc driven by hydraulic pressure. The molded product is removed from the mold by hydraulic pressure. Thus, the removal of the molded product from the mold is easy and fast. The yield is high. Moreover, the substrate-molding apparatus can be used repeatedly.
摘要:
Disclosed is a method for removing oxygen from aluminum nitride by carbon. At first, an oven is provided. An aluminum nitride substrate is located in the oven. Nitrogen is introduced into the oven to form an atmosphere of nitrogen. The temperature is increased to the transformation point of the aluminum nitride substrate in the oven. Then, the heating is stopped and quenching is conducted in the oven. Carbon is introduced into the oven in the quenching. Thus, oxygen included in the aluminum nitride substrate reacts with the carbon to produce carbon monoxide or carbon dioxide. The carbon monoxide or carbon is released from the oven as well as the nitrogen. Thus, the aluminum nitride substrate is purified.
摘要:
Disclosed is a method for hot isostatic pressing a substrate. At first, a metal container is provided. Powder is filled in the metal container before the metal container is located in an oven. The metal container is subjected to isostatic pressing that includes heating and pressing. Thus, the metal container shrinks and presses on the powder evenly and turns the powder into a nugget. The metal container is moved out of the oven and broken to release the nugget. A substrate is cut from the nugget. With the hot isostatic pressing, the substrate exhibits only a few flaws and is large, fine, homogenous and strong so that the substrate is not vulnerable to deformation in a high-pressure environment.
摘要:
Disclosed is a method for hot isostatic pressing a substrate. At first, a metal container is provided. Powder is filled in the metal container before the metal container is located in an oven. The metal container is subjected to isostatic pressing that includes heating and pressing. Thus, the metal container shrinks and presses on the powder evenly and turns the powder into a nugget. The metal container is moved out of the oven and broken to release the nugget. A substrate is cut from the nugget. With the hot isostatic pressing, the substrate exhibits only a few flaws and is large, fine, homogenous and strong so that the substrate is not vulnerable to deformation in a high-pressure environment.
摘要:
Disclosed is a fluorescent coating and a method for making the same. At first, fluorescent powder is mixed with an anti-electrostatic solution. The mixture is cleared of impurities before it is dried and sintered. Thus, the fluorescent powder is coated with the anti-electrostatic material. The fluorescent powder coated with the anti-electrostatic material is plated on a side of a light-emitting diode (“LED”) chip by electrophoresis, thus forming a mixing zone on the side of the LED chip. Hence, the mixing zone is not vulnerable to deterioration or itiolation when it is subjected to heat in use. Accordingly, the life of the LED chip is long, and the illumination of the LED chip is high.
摘要:
Disclosed is an integrated apparatus including an isolative substrate, a plurality of driver chips provided on a side of the isolative substrate, a power supply provided on the side of the isolative substrate and electrically connected to the driver chips, and LED chips provided on another side of the isolative substrate and electrically connected to the driver chips. Thus, the driver chips, the power supply and the LED chips are integrated on the isolative substrate. The production is easy. The integrated apparatus is not vulnerable to surges and lightning strikes. Electromagnetic interferences are reduced. Heat radiation of the integrated apparatus is excellent so that the LED chips are protected from thermal effect.
摘要:
A reticle thermal detector for measuring a thermal condition and distortion of a reticle prior to photolithography is disclosed. The reticle thermal detector includes a mechanism for determining a degree of distortion of the reticle. An alarm is connected to the mechanism for activation by the mechanism when the reticle is distorted. The invention further includes a novel method of enhancing the quality of circuit pattern images formed on a wafer during photolithography.