Network Device, Network Packet Processing Method and Computer Readable Storage Medium for Storing Thereof
    1.
    发明申请
    Network Device, Network Packet Processing Method and Computer Readable Storage Medium for Storing Thereof 审中-公开
    网络设备,网络分组处理方法和存储的计算机可读存储介质

    公开(公告)号:US20120151579A1

    公开(公告)日:2012-06-14

    申请号:US12978857

    申请日:2010-12-27

    IPC分类号: G06F12/14 H04L12/56

    CPC分类号: H04L63/0227 H04L69/12

    摘要: A network device builds connection with a network through a Network Interface Card (NIC). The network device includes a processor and a storage unit. The processor includes at least one transmission processing core, at least one security core, and a main core. The storage unit stores a packet receiving module and a packet output module. The main core loads the packet receiving module to receive several packets from the network, makes the at least one transmission processing core process the packets for a network transmission and makes the at least one security core check the packets for security. The main core loads the packet output module to output the packets after the at least one transmission processing core processes the packets for network transmission and the at least one security core checks the packets for security.

    摘要翻译: 网络设备通过网络接口卡(NIC)与网络建立连接。 网络设备包括处理器和存储单元。 处理器包括至少一个传输处理核心,至少一个安全核心和主核心。 存储单元存储分组接收模块和分组输出模块。 主核心加载分组接收模块以从网络接收多个分组,使得至少一个传输处理核心处理用于网络传输的分组,并使至少一个安全核心检查分组的安全性。 主核心在至少一个传输处理核心处理用于网络传输的分组之后,加载分组输出模块以输出分组,并且至少一个安全核心检查分组的安全性。

    Light emitting chip package module and light emitting chip package structure and manufacturing method thereof
    3.
    发明授权
    Light emitting chip package module and light emitting chip package structure and manufacturing method thereof 有权
    发光芯片封装模块及其发光芯片封装结构及其制造方法

    公开(公告)号:US08698166B2

    公开(公告)日:2014-04-15

    申请号:US12837513

    申请日:2010-07-16

    IPC分类号: H01L33/00

    摘要: A light emitting chip package module includes a substrate, a light emitting chip package structure, and a magnetic device. The substrate has a surface. The light emitting chip package structure is disposed on the surface of the substrate. The light emitting chip package structure includes a carrier, a light emitting chip, and a sealant. The light emitting chip is disposed on and electrically connected to the carrier. The sealant is disposed on the carrier and covers the light emitting chip. The magnetic device is disposed next to the light emitting chip package structure to apply a magnetic field to the light emitting chip.

    摘要翻译: 发光芯片封装模块包括衬底,发光芯片封装结构和磁性器件。 基板具有表面。 发光芯片封装结构设置在基板的表面上。 发光芯片封装结构包括载体,发光芯片和密封剂。 发光芯片设置在载体上并与其电连接。 密封剂设置在载体上并覆盖发光芯片。 磁性装置设置在发光芯片封装结构的旁边,以向发光芯片施加磁场。

    Event detection and method and system
    4.
    发明授权
    Event detection and method and system 有权
    事件检测及方法与系统

    公开(公告)号:US07899773B2

    公开(公告)日:2011-03-01

    申请号:US12005355

    申请日:2007-12-27

    IPC分类号: G06F17/00

    CPC分类号: G06N99/005

    摘要: An event detection method is disclosed. At least one most adaptable life cycle model is generated according to at least one historical event data, at least one nutrition growing function, and at least one firing point rule. Event data is received and a strength value thereof is calculated according to a life cycle model corresponding to the event data. It is determined whether an event firing point is achieved according to the strength value variation. If the event firing point is achieved, an event corresponding to the event data is sent. The event detection method enhances the ability of event tracking and development so event firing is more accurate to fit real event occurring situations, realize event evolution, and filter false alarms.

    摘要翻译: 公开了一种事件检测方法。 根据至少一个历史事件数据,至少一个营养生长功能和至少一个点火点规则来生成至少一个最适应的生命周期模型。 接收事件数据,并根据对应于事件数据的生命周期模型计算其强度值。 确定是否根据强度值变化实现事件触发点。 如果实现了事件触发点,则发送与事件数据相对应的事件。 事件检测方法增强了事件跟踪和开发的能力,因此事件触发更准确以适应实际事件发生的情况,实现事件演进和过滤虚警。

    Light-emitting device with magnetic field
    6.
    发明授权
    Light-emitting device with magnetic field 有权
    具有磁场的发光装置

    公开(公告)号:US07767996B2

    公开(公告)日:2010-08-03

    申请号:US12146418

    申请日:2008-06-25

    IPC分类号: H01L31/00

    摘要: A light-emitting device with magnetic-source includes a light emitting stack structure. The light emitting stack structure has a first electrode and a second electrode distributed at a light output side of the light emitting stack structure. A magnetic-source layer is engaged with the light emitting stack structure to provide a magnetic field to the light emitting stack structure in a substantially perpendicular direction to the light emitting stack structure. Alternatively, a method for improving light emitting performance of a light-emitting device includes applying a magnetic field to the light-emitting device at a direction substantially perpendicular to a light emitting area of the light-emitting device.

    摘要翻译: 具有磁源的发光器件包括发光堆叠结构。 发光堆叠结构具有分布在发光堆叠结构的光输出侧的第一电极和第二电极。 磁源层与发光堆叠结构接合,以在与发光堆叠结构基本垂直的方向上向发光堆叠结构提供磁场。 或者,用于提高发光器件的发光性能的方法包括在基本上垂直于发光器件的发光区域的方向上向发光器件施加磁场。

    Receiver optical subassembly
    8.
    发明申请
    Receiver optical subassembly 审中-公开
    接收器光学组件

    公开(公告)号:US20050121736A1

    公开(公告)日:2005-06-09

    申请号:US10854243

    申请日:2004-05-27

    IPC分类号: H01L29/267 H01L33/00

    摘要: A receiver optical subassembly for transforming received optical signal into electrical signal includes at least a ceramic substrate, a photo receiver and a transimpedance amplifier. There are high-speed traces formed on the substrate. The positive and negative pads of the photo receiver are coplanar and connected to the traces without wire bonding so as to reduce the parasitic impedance effect and improve the high-speed performance of the optical subassembly. The transimpedance amplifier is electrically connected to the traces via flip chip, wire bonding or other methods. The photo receiver and the transimpedance amplifier are connected via the high-speed traces formed on the substrate.

    摘要翻译: 用于将接收的光信号变换为电信号的接收器光学子组件至少包括陶瓷衬底,光接收器和跨阻放大器。 在基板上形成高速迹线。 光接收器的正极和负极焊盘共面并且连接到迹线而不引线接合,从而减小寄生阻抗效应并提高光学组件的高速性能。 跨阻放大器通过倒装芯片,引线接合或其他方法电连接到迹线。 光接收器和跨阻放大器经由形成在基板上的高速迹线连接。