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    Method of forming dielectric layer with a dielectric composition
    2.
    发明授权
    Method of forming dielectric layer with a dielectric composition 有权
    用电介质组合物形成电介质层的方法

    公开(公告)号：US08821962B2

    公开(公告)日：2014-09-02

    申请号：US12957461

    申请日：2010-12-01

    申请人： Yiliang Wu ,  Yulin Wang ,  Ping Liu ,  Nan-Xing Hu ,  Anthony James Wigglesworth

    发明人： Yiliang Wu ,  Yulin Wang ,  Ping Liu ,  Nan-Xing Hu ,  Anthony James Wigglesworth

    IPC分类号： B05D5/12 ,  B05D3/02 ,  H01L51/05 ,  H01L51/00

    CPC分类号： H01L51/052 ,  H01L51/0036 ,  H01L51/0097 ,  H01L51/0537 ,  H01L51/0541 ,  H01L51/0545

    摘要： An electronic device, such as a thin-film transistor, includes a substrate and a dielectric layer formed from a dielectric composition. The dielectric composition comprises a dielectric material and a low surface tension additive. The low surface tension additive allows for the formation of a thin, smooth dielectric layer with fewer pinholes and enhanced device yield. In particular embodiments, the dielectric material comprises a lower-k dielectric material and a higher-k dielectric material. When deposited, the lower-k dielectric material and the higher-k dielectric material form separate phases.

    摘要翻译： 诸如薄膜晶体管的电子器件包括由电介质组合物形成的衬底和电介质层。 电介质组合物包括介电材料和低表面张力添加剂。 低表面张力添加剂允许形成具有更少针孔和增强的器件产量的薄的平滑介电层。 在特定实施例中，介电材料包括较低介电常数材料和较高介电常数材料。 当沉积时，较低k电介质材料和较高介电材料形成分离相。

    Semiconductor composition
    4.
    发明授权
    Semiconductor composition 有权
    半导体组成

    公开(公告)号：US08643001B2

    公开(公告)日：2014-02-04

    申请号：US12977464

    申请日：2010-12-23

    申请人： Yiliang Wu ,  Anthony James Wigglesworth ,  Ping Liu ,  Nan-Xing Hu

    发明人： Yiliang Wu ,  Anthony James Wigglesworth ,  Ping Liu ,  Nan-Xing Hu

    IPC分类号： H01L51/30

    CPC分类号： C07D495/04 ,  H01L51/0074 ,  H01L51/0541 ,  H01L51/0545

    摘要： An electronic device, such as a thin-film transistor, includes a semiconducting layer formed from a semiconductor composition. The semiconductor composition comprises a polymer binder and a small molecule semiconductor of Formula (I): wherein R1, m, n, a, b, c, and X are as described herein. Devices formed from the composition exhibit high mobility and excellent stability.

    摘要翻译： 诸如薄膜晶体管的电子器件包括由半导体组合物形成的半导体层。 半导体组合物包含聚合物粘合剂和式（I）的小分子半导体：其中R 1，m，n，a，b，c和X如本文所述。 由该组合物形成的装置显示出高移动性和优异的稳定性。

    DRY COATING PROCESSES FOR SUBSTRATES
    5.
    发明申请
    DRY COATING PROCESSES FOR SUBSTRATES 有权
    干燥基材涂层工艺

    公开(公告)号：US20130260136A1

    公开(公告)日：2013-10-03

    申请号：US13438088

    申请日：2012-04-03

    申请人： Yiliang Wu ,  Sandra J. Gardner ,  Ping Liu ,  Nan-Xing Hu

    发明人： Yiliang Wu ,  Sandra J. Gardner ,  Ping Liu ,  Nan-Xing Hu

    IPC分类号： B05D5/12 ,  B32B5/16 ,  B82Y40/00

    CPC分类号： B82Y40/00 ,  B82Y30/00 ,  C01B32/184 ,  C01P2004/20 ,  C09C1/44 ,  C09C1/46 ,  C09C1/62 ,  C09C3/041 ,  Y10T428/25

    摘要： Disclosed herein are solvent free, dry coating processes for applying a layered material such as graphene, nanoplate graphite, etc., to a substrate. The applied layered material is devoid of any dispersant and substantially uniform in thickness. Generally, a layered material precursor composition is mixed with a milling medium so that the milling medium is coated with the layered material. The substrate is then contacted with the coated milling medium. The layered material on the milling medium transfers to the substrate to form a coating on the substrate. Such processes may be especially useful for applying conductive films onto a polymeric substrate without the need for additives such as a surfactant or a polymeric binder.

    摘要翻译： 本文公开了用于将诸如石墨烯，纳米板石墨等层状材料施加到基底上的无溶剂的干法涂布方法。 所施加的层状材料没有任何分散剂并且厚度基本均匀。 通常，将层状材料前体组合物与研磨介质混合，使得研磨介质涂覆有分层材料。 然后将基底与涂覆的研磨介质接触。 研磨介质上的层状材料转移到基底上以在基底上形成涂层。 这种方法对于将导电膜施加到聚合物基材上而不需要添加剂如表面活性剂或聚合物粘合剂可能是特别有用的。

    ELECTRONIC DEVICE
    7.
    发明申请
    ELECTRONIC DEVICE 有权
    电子设备

    公开(公告)号：US20110084252A1

    公开(公告)日：2011-04-14

    申请号：US12575739

    申请日：2009-10-08

    申请人： Yiliang Wu ,  Nan-Xing Hu ,  Ping Liu ,  Hadi K. Mahabadi ,  Paul Smith ,  Giuseppa Baranyi

    发明人： Yiliang Wu ,  Nan-Xing Hu ,  Ping Liu ,  Hadi K. Mahabadi ,  Paul Smith ,  Giuseppa Baranyi

    IPC分类号： H01L51/30 ,  H01L51/40

    CPC分类号： H01L51/0562 ,  B82Y30/00 ,  B82Y40/00 ,  C01B32/192 ,  C01B32/23 ,  H01L51/0036 ,  H01L51/0541 ,  H01L51/0545

    摘要： Electronic devices, such as organic thin film transistors, with improved mobility are disclosed. The semiconducting layer comprises layers or striations of an organic semiconductor and graphene, including alternating layers/striations of such materials. The organic semiconductor and graphene layers interact well together because both materials form lamellar sheets. The presence of graphene enhances mobility by correcting molecular packing defects in the organic semiconductor layers, and the conductivity of graphene can be controlled. Finally, both materials are flexible, allowing for flexible semiconductor layers and transistors.

    摘要翻译： 公开了具有改进的移动性的电子器件，例如有机薄膜晶体管。 半导体层包括有机半导体和石墨烯的层或条纹，包括这些材料的交替层/条纹。 有机半导体和石墨烯层相互作用良好，因为两种材料都形成层状片。 石墨烯的存在通过校正有机半导体层中的分子填充缺陷来增强迁移率，并且可以控制石墨烯的导电性。 最后，这两种材料都是灵活的，允许灵活的半导体层和晶体管。

    Dry coating processes for substrates
    8.
    发明授权
    Dry coating processes for substrates 有权
    基材干涂工艺

    公开(公告)号：US08691324B2

    公开(公告)日：2014-04-08

    申请号：US13438088

    申请日：2012-04-03

    申请人： Yiliang Wu ,  Sandra J. Gardner ,  Ping Liu ,  Nan-Xing Hu

    发明人： Yiliang Wu ,  Sandra J. Gardner ,  Ping Liu ,  Nan-Xing Hu

    IPC分类号： C23C26/00 ,  B05D7/00

    CPC分类号： B82Y40/00 ,  B82Y30/00 ,  C01B32/184 ,  C01P2004/20 ,  C09C1/44 ,  C09C1/46 ,  C09C1/62 ,  C09C3/041 ,  Y10T428/25

    摘要： Disclosed herein are solvent free, dry coating processes for applying a layered material such as graphene, nanoplate graphite, etc., to a substrate. The applied layered material is devoid of any dispersant and substantially uniform in thickness. Generally, a layered material precursor composition is mixed with a milling medium so that the milling medium is coated with the layered material. The substrate is then contacted with the coated milling medium. The layered material on the milling medium transfers to the substrate to form a coating on the substrate. Such processes may be especially useful for applying conductive films onto a polymeric substrate without the need for additives such as a surfactant or a polymeric binder.

    摘要翻译： 本文公开了用于将诸如石墨烯，纳米板石墨等层状材料施加到基底上的无溶剂的干法涂布方法。 所施加的层状材料没有任何分散剂并且厚度基本均匀。 通常，将层状材料前体组合物与研磨介质混合，使得研磨介质涂覆有分层材料。 然后将基材与涂覆的研磨介质接触。 研磨介质上的层状材料转移到基底上以在基底上形成涂层。 这种方法对于将导电膜施加到聚合物基材上而不需要添加剂如表面活性剂或聚合物粘合剂可能是特别有用的。