公开(公告)号：US08916981B2

公开(公告)日：2014-12-23

申请号：US13891475

申请日：2013-05-10

申请人： Yonghao Xiu ,  Yiqun Bai ,  Nisha Ananthakrishnan ,  Nachiket R. Raravikar

发明人： Yonghao Xiu ,  Yiqun Bai ,  Nisha Ananthakrishnan ,  Nachiket R. Raravikar

IPC分类号： H01L23/29 ,  H01L25/00

CPC分类号： H01L23/293 ,  C09J163/00 ,  H01L21/563 ,  H01L25/00 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/1703 ,  H01L2224/17051 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/1461 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/00

摘要： Epoxy-amine underfill materials for semiconductor packages and semiconductor packages having an epoxy-amine underfill material are described. In an example, a semiconductor apparatus includes a semiconductor die having a surface with an integrated circuit thereon. A semiconductor package substrate has a surface with a plurality of contact pads thereon. A plurality of conductive contacts couples the surface of the semiconductor die to the surface of the semiconductor package substrate. An epoxy-amine underfill material is disposed between the surface of the semiconductor die and the surface of the semiconductor package substrate and surrounds the plurality of conductive contacts. The epoxy-amine underfill has high adhesion and is based on a low volatility multi-functional amine species.

摘要翻译： 描述了具有环氧 - 胺底部填充材料的半导体封装和半导体封装的环氧胺底部填充材料。 在一个示例中，半导体装置包括其上具有集成电路的表面的半导体管芯。 半导体封装衬底具有其上具有多个接触焊盘的表面。 多个导电触头将半导体管芯的表面耦合到半导体封装衬底的表面。 环氧胺底部填充材料设置在半导体管芯的表面和半导体封装衬底的表面之间并且围绕多个导电触点。 环氧胺底部填充剂具有高粘合性，并且基于低挥发性多官能胺物质。

公开(公告)号：US20140332966A1

公开(公告)日：2014-11-13

申请号：US13891475

申请日：2013-05-10

申请人： Yonghao Xiu ,  Yiqun Bai ,  Nisha Ananthakrishnan ,  Nachiket R. Raravikar

发明人： Yonghao Xiu ,  Yiqun Bai ,  Nisha Ananthakrishnan ,  Nachiket R. Raravikar

IPC分类号： H01L23/29 ,  H01L25/00

CPC分类号： H01L23/293 ,  C09J163/00 ,  H01L21/563 ,  H01L25/00 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/1703 ,  H01L2224/17051 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/1461 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/00

摘要： Epoxy-amine underfill materials for semiconductor packages and semiconductor packages having an epoxy-amine underfill material are described. In an example, a semiconductor apparatus includes a semiconductor die having a surface with an integrated circuit thereon. A semiconductor package substrate has a surface with a plurality of contact pads thereon. A plurality of conductive contacts couples the surface of the semiconductor die to the surface of the semiconductor package substrate. An epoxy-amine underfill material is disposed between the surface of the semiconductor die and the surface of the semiconductor package substrate and surrounds the plurality of conductive contacts. The epoxy-amine underfill has high adhesion and is based on a low volatility multi-functional amine species.

摘要翻译： 描述了具有环氧 - 胺底部填充材料的半导体封装和半导体封装的环氧胺底部填充材料。 在一个示例中，半导体装置包括其上具有集成电路的表面的半导体管芯。 半导体封装衬底具有其上具有多个接触焊盘的表面。 多个导电触点将半导体管芯的表面耦合到半导体封装衬底的表面。 环氧胺底部填充材料设置在半导体管芯的表面和半导体封装衬底的表面之间并且围绕多个导电触点。 环氧胺底部填充剂具有高粘合性，并且基于低挥发性多官能胺物质。

公开(公告)号：US09330993B2

公开(公告)日：2016-05-03

申请号：US13721266

申请日：2012-12-20

申请人： Yiqun Bai ,  Yuying Wei ,  Arjun Krishnan ,  Suriyakala Ramalingam ,  Yonghao Xiu ,  Beverly J. Canham ,  Sivakumar Nagarajan ,  Saikumar Jayaraman ,  Nisha Ananthakrishnan

发明人： Yiqun Bai ,  Yuying Wei ,  Arjun Krishnan ,  Suriyakala Ramalingam ,  Yonghao Xiu ,  Beverly J. Canham ,  Sivakumar Nagarajan ,  Saikumar Jayaraman ,  Nisha Ananthakrishnan

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L23/29 ,  H01L21/56

CPC分类号： H01L21/563 ,  H01L23/293 ,  H01L23/295 ,  H01L23/296 ,  H01L24/13 ,  H01L2224/16225 ,  H01L2224/29647 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/00

摘要： Methods of forming a microelectronic packaging structure and associated structures formed thereby are described. Those methods and structures may include modifying an underfill material with one of a thiol adhesion promoter, an azole coupling agent, surface modified filler, and peroxide based cross-linking polymer chemistries to greatly enhance adhesion in package structures utilizing the embodiments herein.

摘要翻译： 描述了形成微电子封装结构的方法及由此形成的相关结构。 这些方法和结构可以包括用硫醇粘合促进剂，唑偶合剂，表面改性填料和基于过氧化物的交联聚合物化学物质之一改性底部填充材料，以便利用本文的实施方案极大地增强包装结构中的粘合性。

公开(公告)号：US20140175634A1

公开(公告)日：2014-06-26

申请号：US13721266

申请日：2012-12-20

申请人： Yiqun Bai ,  Yuying Wei ,  Arjun Krishnan ,  Suriyakala Ramalingam ,  Yonghao Xiu ,  Beverly J. Canham ,  Sivakumar Nagarajan ,  Saikumar Jayaraman ,  Nisha Ananthakrishnan

发明人： Yiqun Bai ,  Yuying Wei ,  Arjun Krishnan ,  Suriyakala Ramalingam ,  Yonghao Xiu ,  Beverly J. Canham ,  Sivakumar Nagarajan ,  Saikumar Jayaraman ,  Nisha Ananthakrishnan

IPC分类号： H01L23/29 ,  H01L21/56

CPC分类号： H01L21/563 ,  H01L23/293 ,  H01L23/295 ,  H01L23/296 ,  H01L24/13 ,  H01L2224/16225 ,  H01L2224/29647 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/00

摘要： Methods of forming a microelectronic packaging structure and associated structures formed thereby are described. Those methods and structures may include modifying an underfill material with one of a thiol adhesion promoter, an azole coupling agent, surface modified filler, and peroxide based cross-linking polymer chemistries to greatly enhance adhesion in package structures utilizing the embodiments herein.

摘要翻译： 描述了形成微电子封装结构的方法及由此形成的相关结构。 这些方法和结构可以包括用硫醇粘合促进剂，唑偶合剂，表面改性填料和基于过氧化物的交联聚合物化学物质之一改性底部填充材料，以便利用本文的实施方案极大地增强包装结构中的粘合性。

公开(公告)号：US20150179478A1

公开(公告)日：2015-06-25

申请号：US14135236

申请日：2013-12-19

申请人： Yonghao Xiu ,  Nisha Ananthakrishnan ,  Yiqun Bai ,  Arjun Krishnan

发明人： Yonghao Xiu ,  Nisha Ananthakrishnan ,  Yiqun Bai ,  Arjun Krishnan

IPC分类号： H01L21/56 ,  H01L23/29 ,  H01L23/00

CPC分类号： C08K3/013 ,  H01L21/563 ,  H01L23/295 ,  H01L24/17 ,  H01L24/29 ,  H01L24/81 ,  H01L24/83 ,  H01L24/91 ,  H01L2224/131 ,  H01L2224/16057 ,  H01L2224/16225 ,  H01L2224/16237 ,  H01L2224/2929 ,  H01L2224/29386 ,  H01L2224/29499 ,  H01L2224/73204 ,  H01L2224/81801 ,  H01L2224/83102 ,  H01L2924/01006 ,  H01L2924/04642 ,  H01L2924/0493 ,  H01L2924/053 ,  H01L2924/0533 ,  H01L2924/05341 ,  H01L2924/05432 ,  H01L2924/05442 ,  H01L2924/186 ,  H01L2924/0665 ,  H01L2924/05032 ,  H01L2924/014

摘要： An underfill composition comprises a curable resin, a plurality of filler particles loaded within the resin, the filler particles comprising at least 50 weight % of the underfill composition. The filler particles comprise first filler particles having a particle size of from 0.1 micrometers to 15 micrometers and second filler particles having a particle size of less than 100 nanometers. A viscosity of the underfill composition is less than a viscosity of a corresponding composition not including the second filler particles.

摘要翻译： 底部填充组合物包含可固化树脂，负载在树脂内的多个填料颗粒，填料颗粒包含至少50重量％的底部填充组合物。 填料颗粒包含粒度为0.1微米至15微米的第一填料颗粒和粒径小于100纳米的第二填料颗粒。 底部填充剂组合物的粘度小于不包括第二填料颗粒的相应组合物的粘度。

公开(公告)号：US20140177149A1

公开(公告)日：2014-06-26

申请号：US13722886

申请日：2012-12-20

申请人： Suriyakala Ramalingam ,  Manish Dubey ,  Hsin-Yu Li ,  Michelle S. Phen ,  Hitesh Arora ,  Nisha Ananthakrishnan ,  Yiqun Bai ,  Yonghao Xiu ,  Rajendra C. Dias

发明人： Suriyakala Ramalingam ,  Manish Dubey ,  Hsin-Yu Li ,  Michelle S. Phen ,  Hitesh Arora ,  Nisha Ananthakrishnan ,  Yiqun Bai ,  Yonghao Xiu ,  Rajendra C. Dias

IPC分类号： H01L23/28 ,  G06F1/16 ,  H01L21/56

CPC分类号： H01L21/563 ,  H01L23/295 ,  H01L24/09 ,  H01L24/17 ,  H01L24/29 ,  H01L2224/0401 ,  H01L2224/16225 ,  H01L2224/29386 ,  H01L2224/29499 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00

摘要： Embodiments of the present disclosure are directed to techniques and configurations for an integrated circuit (IC) package having an underfill layer with filler particles arranged in a generally random distribution pattern. In some embodiments, a generally random distribution pattern of filler particles may be obtained by reducing an electrostatic charge on one or more components of the IC package assembly, by applying a surface treatment to filler to reduce filler electrical charge, by applying an electric force against the filler particles of the underfill material in a direction opposite to a direction of gravitational force, by using an underfill material with a relatively low maximum filler particle size, and/or by snap curing the underfill layer at a relatively low temperature. Other embodiments may be described and/or claimed.

摘要翻译： 本公开的实施例涉及用于具有以通常随机分布图案排列的填充颗粒的底部填充层的集成电路（IC）封装的技术和配置。 在一些实施例中，通过对IC封装组件的一个或多个部件上的静电电荷，通过对填料进行表面处理以减少填充剂电荷，可以通过施加电力来抵抗填料颗粒的大致随机分布图案 通过使用相对较低的最大填充剂粒度的底部填充材料和/或通过在相对低的温度下快速固化底部填充层，使底部填充材料的填料颗粒在与重力方向相反的方向上。 可以描述和/或要求保护其他实施例。

公开(公告)号：US20140377916A1

公开(公告)日：2014-12-25

申请号：US13925967

申请日：2013-06-25

申请人： Manish Dubey ,  Rajendra C. Dias ,  Yonghao Xiu ,  Arjun Krishnan ,  Yiqun Bai ,  Purushotham Kaushik Muthur Srinath

发明人： Manish Dubey ,  Rajendra C. Dias ,  Yonghao Xiu ,  Arjun Krishnan ,  Yiqun Bai ,  Purushotham Kaushik Muthur Srinath

IPC分类号： H01L21/56

CPC分类号： H01L21/563 ,  H01L23/00 ,  H01L2924/0002 ,  H01L2924/00

摘要： Embodiments of the present description include methods for attaching a microelectronic device to a microelectronic substrate with interconnection structures after disposing of an underfill material on the microelectronic device, wherein filler particles within the underfill material may be repelled away from the interconnection structures prior to connecting the microelectronic device to the microelectronic structure. These methods may include inducing a charge on the interconnection structures and may include placing the interconnection structures between opposing plates and producing a bias between the opposing plates after depositing the underfill material on the interconnection structures.

摘要翻译： 本说明书的实施例包括在微电子器件上处理底部填充材料之后，将微电子器件附着到具有互连结构的微电子衬底的方法，其中在将微电子器件连接到底部填充材料之前，底部填充材料内的填料颗粒可能被排除离开互连结构 器件到微电子结构。 这些方法可以包括在互连结构上引入电荷，并且可以包括将互连结构放置在相对的板之间，并且在将底部填充材料沉积在互连结构上之后在相对的板之间产生偏压。

公开(公告)号：US08278191B2

公开(公告)日：2012-10-02

申请号：US12751080

申请日：2010-03-31

申请人： Owen Hildreth ,  Ching Ping Wong ,  Yonghao Xiu

发明人： Owen Hildreth ,  Ching Ping Wong ,  Yonghao Xiu

IPC分类号： H01L21/00

CPC分类号： H01L21/30604 ,  B81C1/00071 ,  B81C1/00539 ,  B81C1/00904 ,  H01L21/78

摘要： Disclosed herein are various embodiments related to metal-assisted chemical etching of substrates on the micron, sub-micron and nano scales. In one embodiment, among others, a method for metal-assisted chemical etching includes providing a substrate; depositing a non-spherical metal catalyst on a surface of the substrate; etching the substrate by exposing the non-spherical metal catalyst and the substrate to an etchant solution including a composition of a fluoride etchant and an oxidizing agent; and removing the etched substrate from the etchant solution.

摘要翻译： 本文公开了与微米，亚微米和纳米尺度上的基底的金属辅助化学蚀刻相关的各种实施方案。 在一个实施方案中，除其他之外，金属辅助化学蚀刻的方法包括提供基材; 在基板的表面上沉积非球形金属催化剂; 通过将非球形金属催化剂和衬底暴露于包括氟化物蚀刻剂和氧化剂的组合物的蚀刻剂溶液来蚀刻该衬底; 并从蚀刻液中去除蚀刻的衬底。

公开(公告)号：US20100248449A1

公开(公告)日：2010-09-30

申请号：US12751080

申请日：2010-03-31

申请人： Owen Hildreth ,  C. P. Wong ,  Yonghao Xiu

发明人： Owen Hildreth ,  C. P. Wong ,  Yonghao Xiu

IPC分类号： H01L21/306

CPC分类号： H01L21/30604 ,  B81C1/00071 ,  B81C1/00539 ,  B81C1/00904 ,  H01L21/78

摘要： Disclosed herein are various embodiments related to metal-assisted chemical etching of substrates on the micron, sub-micron and nano scales. In one embodiment, among others, a method for metal-assisted chemical etching includes providing a substrate; depositing a non-spherical metal catalyst on a surface of the substrate; etching the substrate by exposing the non-spherical metal catalyst and the substrate to an etchant solution including a composition of a fluoride etchant and an oxidizing agent; and removing the etched substrate from the etchant solution.

摘要翻译： 本文公开了与微米，亚微米和纳米尺度上的基底的金属辅助化学蚀刻相关的各种实施方案。 在一个实施方案中，除其他之外，金属辅助化学蚀刻的方法包括提供基材; 在基板的表面上沉积非球形金属催化剂; 通过将非球形金属催化剂和衬底暴露于包括氟化物蚀刻剂和氧化剂的组合物的蚀刻剂溶液来蚀刻该衬底; 并从蚀刻液中去除蚀刻的衬底。

公开(公告)号：US20090011222A1

公开(公告)日：2009-01-08

申请号：US11610111

申请日：2006-12-13

申请人： Yonghao Xiu ,  Lingbo Zhu ,  Dennis W. Hess ,  Ching Ping Wong ,  Fei Xiao ,  Robert N. Hampton ,  Franklin C. Lambert

发明人： Yonghao Xiu ,  Lingbo Zhu ,  Dennis W. Hess ,  Ching Ping Wong ,  Fei Xiao ,  Robert N. Hampton ,  Franklin C. Lambert

IPC分类号： B05D3/12 ,  B05D3/00 ,  B05D3/02 ,  B05D1/02 ,  B05D1/18 ,  B32B1/00 ,  B32B33/00

CPC分类号： C23C24/00 ,  C23C18/00 ,  Y10T428/25 ,  Y10T428/31504

摘要： The present invention is a method of applying Lotus Effect materials as a (superhydrophobicity) protective coating for various system applications, as well as the method of fabricating/preparing Lotus Effect coatings.

摘要翻译： 本发明是将Lotus Effect材料应用于各种系统应用的（超疏水性）保护涂层的方法以及制备/制备莲花效应涂层的方法。