公开(公告)号：US20160168351A1

公开(公告)日：2016-06-16

申请号：US15047866

申请日：2016-02-19

申请人： Intel Corporation

发明人： Yonghao Xiu ,  Nisha Ananthakrishnan ,  Yiqun Bai ,  Arjun Krishnan

IPC分类号： C08K3/00 ,  H01L23/29 ,  H01L21/56

CPC分类号： C08K3/013 ,  H01L21/563 ,  H01L23/295 ,  H01L24/17 ,  H01L24/29 ,  H01L24/81 ,  H01L24/83 ,  H01L24/91 ,  H01L2224/131 ,  H01L2224/16057 ,  H01L2224/16225 ,  H01L2224/16237 ,  H01L2224/2929 ,  H01L2224/29386 ,  H01L2224/29499 ,  H01L2224/73204 ,  H01L2224/81801 ,  H01L2224/83102 ,  H01L2924/01006 ,  H01L2924/04642 ,  H01L2924/0493 ,  H01L2924/053 ,  H01L2924/0533 ,  H01L2924/05341 ,  H01L2924/05432 ,  H01L2924/05442 ,  H01L2924/186 ,  H01L2924/0665 ,  H01L2924/05032 ,  H01L2924/014

摘要： An underfill composition comprises a curable resin, a plurality of filler particles loaded within the resin, the filler particles comprising at least 50 weight % of the underfill composition. The filler particles comprise first filler particles having a particle size of from 0.1 micrometers to 15 micrometers and second filler particles having a particle size of less than 100 nanometers. A viscosity of the underfill composition is less than a viscosity of a corresponding composition not including the second filler particles.

公开(公告)号：US09331033B1

公开(公告)日：2016-05-03

申请号：US14580960

申请日：2014-12-23

申请人： SunASIC Technologies, Inc.

发明人： Chi-Chou Lin ,  Zheng-Ping He

IPC分类号： H01L23/00 ,  H01L21/3213 ,  H01L23/04

CPC分类号： H01L24/03 ,  H01L21/32134 ,  H01L23/04 ,  H01L23/3192 ,  H01L24/05 ,  H01L24/27 ,  H01L2224/03916 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/0103 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/0493 ,  H01L2924/04953

摘要： A method for forming a stacked metal contact in electrical communication with aluminum wiring in a semiconductor wafer of an integrated circuit is disclosed. The method includes the steps of: forming at least one passivation layer on a surface of the semiconductor wafer of the integrated circuit, where an aluminum wiring is embedded; forming a patterned terminal via opening through the passivation layer to expose the aluminum wiring; removing a portion of the aluminum wiring from the patterned terminal via opening by chemical etching and forming a thin zinc film on an etched surface at the same time; forming a nickel film stacked on the zinc film; and; and forming a metal stack in the patterned terminal via opening and/or at least a portion of the passivation layer by chemical plating or metal plating.

摘要翻译： 公开了一种在集成电路的半导体晶片中形成与铝布线电连通的层叠金属触点的方法。 该方法包括以下步骤：在嵌入铝布线的集成电路的半导体晶片的表面上形成至少一个钝化层; 通过所述钝化层的开口形成图案化的端子以暴露所述铝布线; 通过化学蚀刻通过开口从图案化端子去除一部分铝布线，同时在蚀刻表面上形成薄锌膜; 形成层叠在所述锌膜上的镍膜; 和; 以及通过化学电镀或金属电镀通过开孔和/或至少一部分钝化层在图案化的端子中形成金属堆叠。

公开(公告)号：US20150252217A1

公开(公告)日：2015-09-10

申请号：US14196581

申请日：2014-03-04

申请人： NAMICS CORPORATION

发明人： Pawel CZUBAROW ,  Toshiyuki SATO ,  Tsutomu MASUKO

IPC分类号： C09D163/00 ,  H01L23/00 ,  H01L21/56 ,  H01L23/29 ,  C08K3/28 ,  C08K3/04

CPC分类号： C09D163/00 ,  C08G59/5033 ,  C08K3/04 ,  C08K3/22 ,  C08K3/28 ,  C08K3/34 ,  C08K3/38 ,  C08K2003/282 ,  C08K2201/003 ,  C08L63/00 ,  H01L21/563 ,  H01L23/295 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L25/0652 ,  H01L2224/131 ,  H01L2224/16227 ,  H01L2224/2732 ,  H01L2224/2929 ,  H01L2224/29291 ,  H01L2224/29294 ,  H01L2224/29387 ,  H01L2224/29391 ,  H01L2224/29499 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/83101 ,  H01L2224/83102 ,  H01L2224/83862 ,  H01L2224/92125 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/182 ,  H01L2924/00 ,  H01L2924/05432 ,  H01L2924/0542 ,  H01L2924/0103 ,  H01L2924/0532 ,  H01L2924/01004 ,  H01L2924/05342 ,  H01L2924/01012 ,  H01L2924/0665 ,  H01L2924/0493 ,  H01L2924/01005 ,  H01L2924/05042 ,  H01L2924/05032 ,  H01L2924/014 ,  H01L2924/00014

摘要： An underfill composition for encapsulating a bond line and a method of using the underfill composition are described. Advantageously, the disclosed underfill composition in an uncured state has a fluidity value of less than about ten minutes over about a two centimeter distance at a temperature of about 90 degrees C. and at a bond line thickness of about 50 microns or less and still have a bulk thermal conductivity that is greater than about 0.8 W/mK in the cured state.

摘要翻译： 描述了用于封装粘合线的底部填充组合物和使用该底部填充剂组合物的方法。 有利地，所公开的处于未固化状态的底层填料组合物在约90℃的温度和粘合线厚度约为50微米或更小的温度下，在约2厘米的距离内具有小于约10分钟的流动性值，并且仍然具有 在固化状态下大体积热导率大于约0.8W / mK。

公开(公告)号：US09611372B2

公开(公告)日：2017-04-04

申请号：US15047866

申请日：2016-02-19

申请人： Intel Corporation

发明人： Yonghao Xiu ,  Nisha Ananthakrishnan ,  Yiqun Bai ,  Arjun Krishnan

IPC分类号： H01L21/50 ,  C08K3/00 ,  H01L21/56 ,  H01L23/00 ,  H01L23/29

CPC分类号： C08K3/013 ,  H01L21/563 ,  H01L23/295 ,  H01L24/17 ,  H01L24/29 ,  H01L24/81 ,  H01L24/83 ,  H01L24/91 ,  H01L2224/131 ,  H01L2224/16057 ,  H01L2224/16225 ,  H01L2224/16237 ,  H01L2224/2929 ,  H01L2224/29386 ,  H01L2224/29499 ,  H01L2224/73204 ,  H01L2224/81801 ,  H01L2224/83102 ,  H01L2924/01006 ,  H01L2924/04642 ,  H01L2924/0493 ,  H01L2924/053 ,  H01L2924/0533 ,  H01L2924/05341 ,  H01L2924/05432 ,  H01L2924/05442 ,  H01L2924/186 ,  H01L2924/0665 ,  H01L2924/05032 ,  H01L2924/014

摘要： An underfill composition comprises a curable resin, a plurality of filler particles loaded within the resin, the filler particles comprising at least 50 weight % of the underfill composition. The filler particles comprise first filler particles having a particle size of from 0.1 micrometers to 15 micrometers and second filler particles having a particle size of less than 100 nanometers. A viscosity of the underfill composition is less than a viscosity of a corresponding composition not including the second filler particles.

公开(公告)号：US20170033073A1

公开(公告)日：2017-02-02

申请号：US15302827

申请日：2015-04-10

申请人： Alpha Metals, Inc.

发明人： Shamik GHOSHAL ,  Nirmalya Kumar CHAKI ,  Poulami Sengupta ROY ,  Siuli SARKAR ,  Anubhav RUSTOGI

IPC分类号： H01L23/00 ,  B23K35/02 ,  B22F1/00 ,  B23K35/36 ,  B23K35/365 ,  B22F1/02 ,  B23K1/00 ,  B23K35/30

CPC分类号： H01L24/29 ,  B22F1/0003 ,  B22F1/0014 ,  B22F1/0074 ,  B22F1/025 ,  B22F7/04 ,  B22F2007/047 ,  B22F2301/255 ,  B22F2302/45 ,  B23K1/0016 ,  B23K35/025 ,  B23K35/3006 ,  B23K35/3601 ,  B23K35/3613 ,  B23K35/3618 ,  B23K35/365 ,  B23K2101/40 ,  B23K2103/56 ,  H01B1/22 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/27 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L25/50 ,  H01L51/5246 ,  H01L2224/0401 ,  H01L2224/04026 ,  H01L2224/05155 ,  H01L2224/05644 ,  H01L2224/11003 ,  H01L2224/1132 ,  H01L2224/11334 ,  H01L2224/131 ,  H01L2224/13339 ,  H01L2224/13347 ,  H01L2224/13355 ,  H01L2224/13387 ,  H01L2224/1339 ,  H01L2224/13439 ,  H01L2224/1349 ,  H01L2224/13499 ,  H01L2224/16227 ,  H01L2224/27003 ,  H01L2224/271 ,  H01L2224/27332 ,  H01L2224/27436 ,  H01L2224/27505 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29387 ,  H01L2224/2939 ,  H01L2224/29439 ,  H01L2224/2949 ,  H01L2224/29499 ,  H01L2224/32145 ,  H01L2224/32146 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/81075 ,  H01L2224/81192 ,  H01L2224/81203 ,  H01L2224/8121 ,  H01L2224/8184 ,  H01L2224/81948 ,  H01L2224/83075 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83203 ,  H01L2224/8321 ,  H01L2224/83439 ,  H01L2224/83447 ,  H01L2224/8384 ,  H01L2224/83948 ,  H01L2224/92247 ,  H01L2224/94 ,  H01L2924/00014 ,  H01L2924/0665 ,  H01L2924/12041 ,  H01L2924/12044 ,  H01L2924/1461 ,  H01L2924/20102 ,  H01L2924/20103 ,  H01L2924/20104 ,  H01L2924/20105 ,  H01L2924/20106 ,  H01L2924/20107 ,  H01L2924/20108 ,  H01L2924/20109 ,  H01L2924/2011 ,  H01L2924/206 ,  H01L2924/2064 ,  H05K3/321 ,  H01L2924/00012 ,  H01L2224/83 ,  H01L2924/0105 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01029 ,  H01L2924/01028 ,  H01L2924/0103 ,  H01L2924/0493 ,  H01L2924/01004 ,  H01L2224/27 ,  H01L2924/01074 ,  H01L2224/81 ,  H01L2224/11436 ,  H01L2224/11 ,  H01L2224/45099 ,  H01L2924/00

摘要： A sintering powder comprising: a first type of metal particles having a mean longest dimension of from 100 nm to 50 μm.

摘要翻译： 一种烧结粉末，其特征在于，包括：平均最长尺寸为100nm〜50μm的第一种金属粒子。

公开(公告)号：US20240355717A1

公开(公告)日：2024-10-24

申请号：US18636035

申请日：2024-04-15

申请人： Navitas Semiconductor Limited

发明人： Alfred Hesener ,  Daniel M. Kinzer ,  Vincent Dessard ,  Marco Giandalia

IPC分类号： H01L23/495 ,  H01L23/00 ,  H01L25/065 ,  H03K17/687

CPC分类号： H01L23/49575 ,  H01L23/49562 ,  H01L24/08 ,  H01L24/48 ,  H01L25/0652 ,  H03K17/6871 ,  H01L2224/08145 ,  H01L2224/08245 ,  H01L2224/48138 ,  H01L2224/48175 ,  H01L2924/01029 ,  H01L2924/0493 ,  H01L2924/1205 ,  H01L2924/13091 ,  H01L2924/182 ,  H03K2217/0063 ,  H03K2217/0072

摘要： An electronic system is disclosed. The electronic system includes an electronic package having a base with a plurality of external terminals, and further having an electrically insulative material at least partially encapsulating the base, a controller circuit disposed within the electronic package and referenced to a first ground, a first and second driver circuits disposed within the electronic package and referenced to a second ground and arranged to receive isolated control signals from the controller circuit, and a bidirectional switch disposed within the electronic package and referenced to the second ground and arranged to receive drive signals from the first and second driver circuits. In one aspect, the first and second driver circuits are isolated from the controller circuit via capacitors, or magnetics, or optocouplers, or magneto resistors.

公开(公告)号：US12113039B2

公开(公告)日：2024-10-08

申请号：US17245397

申请日：2021-04-30

申请人： ALPHA ASSEMBLY SOLUTIONS INC.

发明人： Shamik Ghoshal ,  Nirmalya Kumar Chaki ,  Poulami Sengupta Roy ,  Siuli Sarkar ,  Anubhav Rustogi

IPC分类号： H01L23/00 ,  B22F1/052 ,  B22F1/102 ,  B22F1/107 ,  B22F1/17 ,  B22F7/04 ,  B23K1/00 ,  B23K35/02 ,  B23K35/30 ,  B23K35/36 ,  B23K35/365 ,  B23K101/40 ,  B23K103/00 ,  H01B1/22 ,  H01L25/00 ,  H05K3/32 ,  H10K50/842

CPC分类号： H01L24/29 ,  B22F1/052 ,  B22F1/102 ,  B22F1/107 ,  B22F1/17 ,  B22F7/04 ,  B23K1/0016 ,  B23K35/025 ,  B23K35/3006 ,  B23K35/3601 ,  B23K35/3613 ,  B23K35/3618 ,  B23K35/365 ,  H01B1/22 ,  H01L24/11 ,  H01L24/13 ,  H01L24/27 ,  H01L24/32 ,  H01L24/81 ,  H01L24/83 ,  B22F2007/047 ,  B22F2301/255 ,  B22F2302/45 ,  B23K2101/40 ,  B23K2103/56 ,  H01L24/16 ,  H01L24/48 ,  H01L24/73 ,  H01L24/92 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/04026 ,  H01L2224/05155 ,  H01L2224/05644 ,  H01L2224/11003 ,  H01L2224/1132 ,  H01L2224/11334 ,  H01L2224/131 ,  H01L2224/13339 ,  H01L2224/13347 ,  H01L2224/13355 ,  H01L2224/13387 ,  H01L2224/1339 ,  H01L2224/13439 ,  H01L2224/1349 ,  H01L2224/13499 ,  H01L2224/16227 ,  H01L2224/27003 ,  H01L2224/271 ,  H01L2224/27332 ,  H01L2224/27436 ,  H01L2224/27505 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29387 ,  H01L2224/2939 ,  H01L2224/29439 ,  H01L2224/2949 ,  H01L2224/29499 ,  H01L2224/32145 ,  H01L2224/32146 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/81075 ,  H01L2224/81192 ,  H01L2224/81203 ,  H01L2224/8121 ,  H01L2224/8184 ,  H01L2224/81948 ,  H01L2224/83075 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83203 ,  H01L2224/8321 ,  H01L2224/83439 ,  H01L2224/83447 ,  H01L2224/8384 ,  H01L2224/83948 ,  H01L2224/92247 ,  H01L2224/94 ,  H01L2924/00014 ,  H01L2924/0665 ,  H01L2924/12041 ,  H01L2924/12044 ,  H01L2924/1461 ,  H01L2924/20102 ,  H01L2924/20103 ,  H01L2924/20104 ,  H01L2924/20105 ,  H01L2924/20106 ,  H01L2924/20107 ,  H01L2924/20108 ,  H01L2924/20109 ,  H01L2924/2011 ,  H01L2924/206 ,  H01L2924/2064 ,  H05K3/321 ,  H10K50/8426 ,  H01L2224/83203 ,  H01L2924/00012 ,  H01L2224/94 ,  H01L2224/83 ,  H01L2224/29339 ,  H01L2924/0105 ,  H01L2224/29339 ,  H01L2924/01046 ,  H01L2224/29339 ,  H01L2924/01047 ,  H01L2224/29339 ,  H01L2924/01029 ,  H01L2224/29339 ,  H01L2924/01028 ,  H01L2224/29439 ,  H01L2924/00014 ,  H01L2224/29355 ,  H01L2924/00014 ,  H01L2224/29347 ,  H01L2924/01028 ,  H01L2224/29347 ,  H01L2924/01028 ,  H01L2924/0103 ,  H01L2224/29387 ,  H01L2924/0493 ,  H01L2924/01004 ,  H01L2224/2949 ,  H01L2924/00012 ,  H01L2224/2939 ,  H01L2924/0665 ,  H01L2224/271 ,  H01L2924/00014 ,  H01L2224/27436 ,  H01L2924/00014 ,  H01L2224/94 ,  H01L2224/27 ,  H01L2224/05155 ,  H01L2924/00014 ,  H01L2224/05644 ,  H01L2924/00014 ,  H01L2224/83439 ,  H01L2924/00014 ,  H01L2224/83447 ,  H01L2924/01074 ,  H01L2224/8321 ,  H01L2924/00014 ,  H01L2224/81203 ,  H01L2924/00012 ,  H01L2224/94 ,  H01L2224/81 ,  H01L2224/13339 ,  H01L2924/0105 ,  H01L2224/13339 ,  H01L2924/01046 ,  H01L2224/13339 ,  H01L2924/01047 ,  H01L2224/13339 ,  H01L2924/01029 ,  H01L2224/13339 ,  H01L2924/01028 ,  H01L2224/13439 ,  H01L2924/00014 ,  H01L2224/13355 ,  H01L2924/00014 ,  H01L2224/13347 ,  H01L2924/01028 ,  H01L2224/13347 ,  H01L2924/01028 ,  H01L2924/0103 ,  H01L2224/13387 ,  H01L2924/0493 ,  H01L2924/01004 ,  H01L2224/1349 ,  H01L2924/00012 ,  H01L2224/1339 ,  H01L2924/0665 ,  H01L2224/131 ,  H01L2924/00014 ,  H01L2224/11436 ,  H01L2924/00014 ,  H01L2224/94 ,  H01L2224/11 ,  H01L2224/8121 ,  H01L2924/00014 ,  H01L2924/00014 ,  H01L2224/45099 ,  H01L2224/1132 ,  H01L2924/00014 ,  H01L2224/73265 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2924/00012 ,  H01L2224/73265 ,  H01L2224/32245 ,  H01L2224/48247 ,  H01L2924/00012 ,  H01L2224/73265 ,  H01L2224/32145 ,  H01L2224/48247 ,  H01L2924/00 ,  H01L2224/73265 ,  H01L2224/32145 ,  H01L2224/48227 ,  H01L2924/00 ,  H01L2224/92247 ,  H01L2224/73265 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2924/00 ,  H01L2224/92247 ,  H01L2224/73265 ,  H01L2224/32245 ,  H01L2224/48247 ,  H01L2924/00

摘要： A sintering powder comprising:



a first type of metal particles having a mean longest dimension of from 100 nm to 50 μm.

公开(公告)号：US09670377B2

公开(公告)日：2017-06-06

申请号：US14196581

申请日：2014-03-04

申请人： NAMICS CORPORATION

发明人： Pawel Czubarow ,  Toshiyuki Sato ,  Tsutomu Masuko

IPC分类号： C08K3/04 ,  C08K3/28 ,  C08L63/00 ,  C09D163/00 ,  H01L21/56 ,  H01L23/00 ,  H01L23/29 ,  C08K3/22 ,  C08K3/38 ,  H01L25/065 ,  C08K3/34 ,  C08G59/50

CPC分类号： C09D163/00 ,  C08G59/5033 ,  C08K3/04 ,  C08K3/22 ,  C08K3/28 ,  C08K3/34 ,  C08K3/38 ,  C08K2003/282 ,  C08K2201/003 ,  C08L63/00 ,  H01L21/563 ,  H01L23/295 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L25/0652 ,  H01L2224/131 ,  H01L2224/16227 ,  H01L2224/2732 ,  H01L2224/2929 ,  H01L2224/29291 ,  H01L2224/29294 ,  H01L2224/29387 ,  H01L2224/29391 ,  H01L2224/29499 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/83101 ,  H01L2224/83102 ,  H01L2224/83862 ,  H01L2224/92125 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/182 ,  H01L2924/00 ,  H01L2924/05432 ,  H01L2924/0542 ,  H01L2924/0103 ,  H01L2924/0532 ,  H01L2924/01004 ,  H01L2924/05342 ,  H01L2924/01012 ,  H01L2924/0665 ,  H01L2924/0493 ,  H01L2924/01005 ,  H01L2924/05042 ,  H01L2924/05032 ,  H01L2924/014 ,  H01L2924/00014

摘要： An underfill composition for encapsulating a bond line and a method of using the underfill composition are described. Advantageously, the disclosed underfill composition in an uncured state has a fluidity value of less than about ten minutes over about a two centimeter distance at a temperature of about 90 degrees C. and at a bond line thickness of about 50 microns or less and still have a bulk thermal conductivity that is greater than about 0.8 W/mK in the cured state.

公开(公告)号：US09269596B2

公开(公告)日：2016-02-23

申请号：US14135236

申请日：2013-12-19

申请人： Intel Corporation

发明人： Yonghao Xiu ,  Nisha Ananthakrishnan ,  Yiqun Bai ,  Arjun Krishnan

IPC分类号： H01L23/29 ,  H01L21/56 ,  H01L23/00

CPC分类号： C08K3/013 ,  H01L21/563 ,  H01L23/295 ,  H01L24/17 ,  H01L24/29 ,  H01L24/81 ,  H01L24/83 ,  H01L24/91 ,  H01L2224/131 ,  H01L2224/16057 ,  H01L2224/16225 ,  H01L2224/16237 ,  H01L2224/2929 ,  H01L2224/29386 ,  H01L2224/29499 ,  H01L2224/73204 ,  H01L2224/81801 ,  H01L2224/83102 ,  H01L2924/01006 ,  H01L2924/04642 ,  H01L2924/0493 ,  H01L2924/053 ,  H01L2924/0533 ,  H01L2924/05341 ,  H01L2924/05432 ,  H01L2924/05442 ,  H01L2924/186 ,  H01L2924/0665 ,  H01L2924/05032 ,  H01L2924/014

摘要： An underfill composition comprises a curable resin, a plurality of filler particles loaded within the resin, the filler particles comprising at least 50 weight % of the underfill composition. The filler particles comprise first filler particles having a particle size of from 0.1 micrometers to 15 micrometers and second filler particles having a particle size of less than 100 nanometers. A viscosity of the underfill composition is less than a viscosity of a corresponding composition not including the second filler particles.

摘要翻译： 底部填充组合物包含可固化树脂，负载在树脂内的多个填料颗粒，填料颗粒包含至少50重量％的底部填充组合物。 填料颗粒包含粒度为0.1微米至15微米的第一填料颗粒和粒径小于100纳米的第二填料颗粒。 底部填充剂组合物的粘度小于不包括第二填料颗粒的相应组合物的粘度。

公开(公告)号：US20150179478A1

公开(公告)日：2015-06-25

申请号：US14135236

申请日：2013-12-19

申请人： Yonghao Xiu ,  Nisha Ananthakrishnan ,  Yiqun Bai ,  Arjun Krishnan

发明人： Yonghao Xiu ,  Nisha Ananthakrishnan ,  Yiqun Bai ,  Arjun Krishnan

IPC分类号： H01L21/56 ,  H01L23/29 ,  H01L23/00

CPC分类号： C08K3/013 ,  H01L21/563 ,  H01L23/295 ,  H01L24/17 ,  H01L24/29 ,  H01L24/81 ,  H01L24/83 ,  H01L24/91 ,  H01L2224/131 ,  H01L2224/16057 ,  H01L2224/16225 ,  H01L2224/16237 ,  H01L2224/2929 ,  H01L2224/29386 ,  H01L2224/29499 ,  H01L2224/73204 ,  H01L2224/81801 ,  H01L2224/83102 ,  H01L2924/01006 ,  H01L2924/04642 ,  H01L2924/0493 ,  H01L2924/053 ,  H01L2924/0533 ,  H01L2924/05341 ,  H01L2924/05432 ,  H01L2924/05442 ,  H01L2924/186 ,  H01L2924/0665 ,  H01L2924/05032 ,  H01L2924/014

摘要： An underfill composition comprises a curable resin, a plurality of filler particles loaded within the resin, the filler particles comprising at least 50 weight % of the underfill composition. The filler particles comprise first filler particles having a particle size of from 0.1 micrometers to 15 micrometers and second filler particles having a particle size of less than 100 nanometers. A viscosity of the underfill composition is less than a viscosity of a corresponding composition not including the second filler particles.

摘要翻译： 底部填充组合物包含可固化树脂，负载在树脂内的多个填料颗粒，填料颗粒包含至少50重量％的底部填充组合物。 填料颗粒包含粒度为0.1微米至15微米的第一填料颗粒和粒径小于100纳米的第二填料颗粒。 底部填充剂组合物的粘度小于不包括第二填料颗粒的相应组合物的粘度。