公开(公告)号：US20140177149A1

公开(公告)日：2014-06-26

申请号：US13722886

申请日：2012-12-20

申请人： Suriyakala Ramalingam ,  Manish Dubey ,  Hsin-Yu Li ,  Michelle S. Phen ,  Hitesh Arora ,  Nisha Ananthakrishnan ,  Yiqun Bai ,  Yonghao Xiu ,  Rajendra C. Dias

发明人： Suriyakala Ramalingam ,  Manish Dubey ,  Hsin-Yu Li ,  Michelle S. Phen ,  Hitesh Arora ,  Nisha Ananthakrishnan ,  Yiqun Bai ,  Yonghao Xiu ,  Rajendra C. Dias

IPC分类号： H01L23/28 ,  G06F1/16 ,  H01L21/56

CPC分类号： H01L21/563 ,  H01L23/295 ,  H01L24/09 ,  H01L24/17 ,  H01L24/29 ,  H01L2224/0401 ,  H01L2224/16225 ,  H01L2224/29386 ,  H01L2224/29499 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00

摘要： Embodiments of the present disclosure are directed to techniques and configurations for an integrated circuit (IC) package having an underfill layer with filler particles arranged in a generally random distribution pattern. In some embodiments, a generally random distribution pattern of filler particles may be obtained by reducing an electrostatic charge on one or more components of the IC package assembly, by applying a surface treatment to filler to reduce filler electrical charge, by applying an electric force against the filler particles of the underfill material in a direction opposite to a direction of gravitational force, by using an underfill material with a relatively low maximum filler particle size, and/or by snap curing the underfill layer at a relatively low temperature. Other embodiments may be described and/or claimed.

摘要翻译： 本公开的实施例涉及用于具有以通常随机分布图案排列的填充颗粒的底部填充层的集成电路（IC）封装的技术和配置。 在一些实施例中，通过对IC封装组件的一个或多个部件上的静电电荷，通过对填料进行表面处理以减少填充剂电荷，可以通过施加电力来抵抗填料颗粒的大致随机分布图案 通过使用相对较低的最大填充剂粒度的底部填充材料和/或通过在相对低的温度下快速固化底部填充层，使底部填充材料的填料颗粒在与重力方向相反的方向上。 可以描述和/或要求保护其他实施例。

公开(公告)号：US20140264957A1

公开(公告)日：2014-09-18

申请号：US13801059

申请日：2013-03-13

申请人： Randall D. Lowe, JR. ,  Suriyakala Suriya Ramalingam ,  Nisha Ananthakrishnan ,  James C. Matayabas, JR. ,  Arjun Krishnan ,  Hitesh Arora

发明人： Randall D. Lowe, JR. ,  Suriyakala Suriya Ramalingam ,  Nisha Ananthakrishnan ,  James C. Matayabas, JR. ,  Arjun Krishnan ,  Hitesh Arora

IPC分类号： C09D11/10 ,  H01L23/28

CPC分类号： H01L21/56 ,  C09D11/101 ,  C09D11/20 ,  H01L23/296 ,  H01L23/544 ,  H01L2924/0002 ,  H01L2924/00

摘要： Methods for covalently and indelibly anchoring a polyacrylate polymer using a UV-induced polymerization process in the presence of a photoinitiator to an oxide surface are disclosed herein. The methods and compositions prepared by the methods can be used as indelible marking materials for use on microelectronic packages and as solder and sealant barriers to prevent overspreading of liquids on the oxide surfaces of microelectronic packages.The polyacrylate polymers are covalently linked to the oxide surface by use during the printing and UV-curing process of an adhesion promoter having as a first domain an oxide-reactive silyl group, bonded via a linker to an acrylate-reactive group.

摘要翻译： 本文公开了在光引发剂存在下使用UV诱导的聚合方法将聚丙烯酸酯聚合物共价且不可分割地锚定到氧化物表面的方法。 通过该方法制备的方法和组合物可用作用于微电子封装的不可擦除的标记材料，以及用作焊料和密封剂屏障以防止液体在微电子封装的氧化物表面上的过度扩散。 在通过连接剂与丙烯酸酯反应性基团键合的作为第一结构域的氧化物反应性甲硅烷基的粘合促进剂的印刷和UV固化过程中，聚丙烯酸酯聚合物共价连接到氧化物表面。

公开(公告)号：US20140354314A1

公开(公告)日：2014-12-04

申请号：US13907454

申请日：2013-05-31

申请人： Hitesh Arora ,  Lawrence D. Decesare, JR. ,  Kelly P. Lofgreen ,  Andrew C. Lyman ,  Michael A. Schroeder

发明人： Hitesh Arora ,  Lawrence D. Decesare, JR. ,  Kelly P. Lofgreen ,  Andrew C. Lyman ,  Michael A. Schroeder

IPC分类号： G01R31/28 ,  B23P15/26 ,  F28F3/12

CPC分类号： G01R31/2877 ,  F28F13/00 ,  F28F2013/006 ,  G01R31/2874 ,  G01R31/2896 ,  Y10T29/4935

摘要： Embodiments of the present disclosure describe thermal interface techniques and configurations. In some embodiments, a thermal interface apparatus may include a flexible container, a plurality of thermally conductive objects disposed within the flexible container, and an attachment member coupled to the flexible container for attaching the thermal interface apparatus to a heat sink. The thermally conductive objects may be movable to rearrange their packing within the flexible container in response to deformation of the flexible container. Other embodiments may be described and/or claimed.

摘要翻译： 本公开的实施例描述了热接口技术和配置。 在一些实施例中，热接口设备可以包括柔性容器，设置在柔性容器内的多个导热物体，以及耦合到柔性容器的附接构件，用于将热界面装置附接到散热器。 导热物体可以是可移动的，以便响应于柔性容器的变形而在柔性容器内重新布置其包装。 可以描述和/或要求保护其他实施例。

公开(公告)号：US10472229B2

公开(公告)日：2019-11-12

申请号：US13582525

申请日：2011-03-04

申请人： Ulrich Wiesner ,  Michael Thompson ,  Hitesh Arora

发明人： Ulrich Wiesner ,  Michael Thompson ,  Hitesh Arora

IPC分类号： B81C1/00 ,  C30B1/02 ,  C30B29/08 ,  C30B29/60 ,  H01L21/02 ,  H01L21/285

摘要： A method for fabricating a nanostructure utilizes a templated monocrystalline substrate. The templated monocrystalline substrate is energetically (i.e., preferably thermally) treated, with an optional precleaning and an optional amorphous material layer located thereupon, to form a template structured monocrystalline substrate that includes the monocrystalline substrate with a plurality of epitaxially aligned contiguous monocrystalline pillars extending therefrom. The monocrystalline substrate and the plurality of epitaxially aligned contiguous monocrystalline pillars may comprise the same or different monocrystalline materials. The method provides the nanostructure where when the monocrystalline substrate and the plurality of epitaxial aligned contiguous monocrystalline pillars comprise different monocrystalline materials having a bulk crystal structure mismatch of up to about 10 percent, lattice mismatch induced crystal structure defects may be avoided interposed between the monocrystalline substrate and the plurality of epitaxially aligned contiguous monocrystalline pillars, which may have an irregular sidewall shape.

公开(公告)号：US08920919B2

公开(公告)日：2014-12-30

申请号：US13625612

申请日：2012-09-24

申请人： Hitesh Arora ,  James C. Matayabas, Jr.

发明人： Hitesh Arora ,  James C. Matayabas, Jr.

IPC分类号： B32B27/32

CPC分类号： C08L25/06 ,  B82Y30/00 ,  C08K3/04 ,  C08K3/041 ,  C08K3/042 ,  C08K7/24 ,  C08K2201/011 ,  C08L23/02 ,  C08L23/20 ,  C08L53/00 ,  Y10T428/25 ,  Y10T428/31938 ,  C08L9/00 ,  C08L53/025

摘要： Certain embodiments relate to compositions that may be used as thermal interface materials in electronic assemblies. One such composition includes a block copolymer matrix comprising polystyrene and polybutene. The composition also includes a filler positioned in the copolymer matrix, the filler comprising carbon. The filler may in certain embodiments be a material selected from the group consisting of graphite, graphene, and carbon nanotubes. composition may include routing structures and their formation. Assemblies may include the composition positioned between a die and a heat spreader. Other embodiments are described and claimed.

摘要翻译： 某些实施方案涉及可用作电子组件中的热界面材料的组合物。 一种这样的组合物包括包含聚苯乙烯和聚丁烯的嵌段共聚物基体。 组合物还包括位于共聚物基质中的填料，填料包含碳。 在某些实施方案中，填料可以是选自石墨，石墨烯和碳纳米管的材料。 组成可以包括路由结构及其形成。 组件可以包括定位在模具和散热器之间的组合物。 描述和要求保护其他实施例。

公开(公告)号：US20130052421A1

公开(公告)日：2013-02-28

申请号：US13582525

申请日：2011-03-04

申请人： Ulrich Wiesner ,  Michael Thompson ,  Hitesh Arora

发明人： Ulrich Wiesner ,  Michael Thompson ,  Hitesh Arora

IPC分类号： C30B25/04 ,  B32B9/04 ,  B32B3/08 ,  C30B23/04 ,  C30B19/00

CPC分类号： B81C1/00031 ,  B81C2201/0149 ,  B81C2201/0169 ,  C30B1/023 ,  C30B29/08 ,  C30B29/605 ,  H01L21/02381 ,  H01L21/02532 ,  H01L21/02603 ,  H01L21/02642 ,  H01L21/28518 ,  Y10T428/24372 ,  Y10T428/24413

摘要： A method for fabricating a nanostructure utilizes a templated monocrystalline substrate. The templated monocrystalline substrate is energetically (i.e., preferably thermally) treated, with an optional precleaning and an optional amorphous material layer located thereupon, to form a template structured monocrystalline substrate that includes the monocrystalline substrate with a plurality of epitaxially aligned contiguous monocrystalline pillars extending therefrom. The monocrystalline substrate and the plurality of epitaxially aligned contiguous monocrystalline pillars may comprise the same or different monocrystalline materials. The method provides the nanostructure where when the monocrystalline substrate and the plurality of epitaxial aligned contiguous monocrystalline pillars comprise different monocrystalline materials having a bulk crystal structure mismatch of up to about 10 percent, lattice mismatch induced crystal structure defects may be avoided interposed between the monocrystalline substrate and the plurality of epitaxially aligned contiguous monocrystalline pillars, which may have an irregular sidewall shape.

摘要翻译： 制造纳米结构的方法使用模板化单晶衬底。 模板化的单晶衬底在能量上（即，优选热处理），具有可选的预清洗和位于其上的任选的非晶材料层，以形成模板结构的单晶衬底，其包括具有从其延伸的多个外延比对的邻接单晶柱的单晶衬底 。 单晶衬底和多个外延排列的邻接单晶柱可以包括相同或不同的单晶材料。 该方法提供纳米结构，其中当单晶衬底和多个外延对准的邻接单晶柱包含具有高达约10％的体晶结构失配的不同单晶材料时，晶格失配诱发的晶体结构缺陷可以避免插入在单晶衬底 以及可能具有不规则侧壁形状的多个外延排列的邻接单晶柱。

公开(公告)号：US09530718B2

公开(公告)日：2016-12-27

申请号：US13727409

申请日：2012-12-26

申请人： Hitesh Arora ,  Mihir A. Oka ,  Chandra M. Jha

发明人： Hitesh Arora ,  Mihir A. Oka ,  Chandra M. Jha

IPC分类号： H01L23/373 ,  H01L23/31 ,  H01L23/00

CPC分类号： H01L23/3737 ,  H01L23/3142 ,  H01L23/3157 ,  H01L23/562 ,  H01L2224/16225 ,  H01L2924/15311

摘要： A die backside film including a matrix material; and an amount of filler particles to render the die backside film thermally conductive, wherein a thermal conductivity of the amount of filler particles is greater than a thermal conductivity of silica particles. A method including introducing a die backside film on a backside surface of a die, the die backside film including a matrix material including an elastomer an amount of filler particles to render the die backside film thermally conductive, wherein a thermal conductivity of the amount of filler particles is greater than a thermal conductivity of silica particles; and disposing the die in a package.

摘要翻译： 包含基质材料的模具背面薄膜; 以及一定量的填料颗粒使模具背面膜导热，其中填料颗粒的热导率大于二氧化硅颗粒的热导率。 一种包括在模具的背面上引入模具背面薄膜的方法，所述模具背面薄膜包括具有弹性体的基体材料，所述基体材料具有使所述模具背面薄膜导热的填充剂颗粒的量，其中所述填充剂的热导率 颗粒大于二氧化硅颗粒的热导率; 并将模具设置在包装中。

公开(公告)号：US20140177194A1

公开(公告)日：2014-06-26

申请号：US13727409

申请日：2012-12-26

申请人： Hitesh Arora ,  Mihir A. Oka ,  Chandra M. Jha

发明人： Hitesh Arora ,  Mihir A. Oka ,  Chandra M. Jha

IPC分类号： H05K1/18 ,  H01L21/50

CPC分类号： H01L23/3737 ,  H01L23/3142 ,  H01L23/3157 ,  H01L23/562 ,  H01L2224/16225 ,  H01L2924/15311

摘要： A die backside film including a matrix material; and an amount of filler particles to render the die backside film thermally conductive, wherein a thermal conductivity of the amount of filler particles is greater than a thermal conductivity of silica particles. A method including introducing a die backside film on a backside surface of a die, the die backside film including a matrix material including an elastomer an amount of filler particles to render the die backside film thermally conductive, wherein a thermal conductivity of the amount of filler particles is greater than a thermal conductivity of silica particles; and disposing the die in a package.

摘要翻译： 包含基质材料的模具背面薄膜; 以及一定量的填料颗粒使模具背面膜导热，其中填料颗粒的热导率大于二氧化硅颗粒的热导率。 一种包括在模具的背面上引入模具背面薄膜的方法，所述模具背面薄膜包括具有弹性体的基体材料，所述基体材料具有使所述模具背面薄膜导热的填充剂颗粒的量，其中所述填充剂的热导率 颗粒大于二氧化硅颗粒的热导率; 并将模具设置在包装中。

公开(公告)号：US20140138854A1

公开(公告)日：2014-05-22

申请号：US13684123

申请日：2012-11-21

申请人： Hitesh Arora

发明人： Hitesh Arora

IPC分类号： H01L23/373

CPC分类号： H01L23/3737 ,  H01L23/42 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2924/15311

摘要： Embodiments of the present disclosure are directed towards a thermal interface material for integrated circuit package assembly and associated techniques and configurations. In one embodiment, an apparatus includes a die and a layer of thermal interface material (TIM) thermally coupled with the die, the TIM including a polymer matrix and carbon filler having anisotropic thermal conductivity disposed in the polymer matrix, the polymer matrix being configured for deposition on the die in liquid form. Other embodiments may be described and/or claimed.

摘要翻译： 本公开的实施例涉及用于集成电路封装组件和相关联的技术和配置的热界面材料。 在一个实施例中，一种装置包括一个管芯和一个与管芯热耦合的热界面材料层（TIM），该TIM包括一个聚合物基体和具有各向异性热导率的碳填料，该填料位于该聚合物基质中， 以液体形式沉积在模具上。 可以描述和/或要求保护其他实施例。