利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

13 条记录 (耗时 0.044 秒)

    Method and apparatus for reduced wear polishing pad conditioning
    1.
    发明申请
    Method and apparatus for reduced wear polishing pad conditioning 失效
    降低磨损抛光垫调理的方法和装置

    公开(公告)号：US20060046623A1

    公开(公告)日：2006-03-02

    申请号：US11209167

    申请日：2005-08-22

    申请人： Yan Wang ,  Stan Tsai ,  Yongqi Hu ,  Feng Liu ,  Liang-Yuh Chen ,  Daxin Mao ,  Huyen Tran ,  Martin Wohlert ,  Renhe Jia ,  Yuan Tian

    发明人： Yan Wang ,  Stan Tsai ,  Yongqi Hu ,  Feng Liu ,  Liang-Yuh Chen ,  Daxin Mao ,  Huyen Tran ,  Martin Wohlert ,  Renhe Jia ,  Yuan Tian

    IPC分类号： B24B1/00

    CPC分类号： B24B53/017 ,  B23H5/08

    摘要： Embodiments of a conditioning head for in-situ conditioning and/or cleaning a processing pad of a CMP, ECMP, or other processing system are provided. In one embodiment, the conditioning head includes a brush disposed in a central cavity. A cleaning fluid is provided through the central cavity of the conditioning head to a processing pad. The brush spins and moves laterally across the surface of the processing pad. The cleaning solution dispensed through the conditioning head dissolves by-products of the processing operation while the brush gently wipes the processing pad. A lip of the conditioning head retains the cleaning fluid and cleaning waste, thereby minimizing contamination of the area outside of the conditioning head. The cleaning waste is removed from the processing pad via passages formed near the outer periphery of the conditioning head.

    摘要翻译： 提供了用于原位调理和/或清洁CMP，ECMP或其它处理系统的处理垫的调节头的实施例。 在一个实施例中，调节头包括设置在中心腔中的刷子。 清洁流体通过调节头的中心空腔设置到处理垫。 刷子旋转并横向移动到处理垫的表面上。 通过调节头分配的清洁溶液溶解处理操作的副产物，同时刷子轻轻地擦拭处理垫。 调节头的唇缘保持清洁流体和清洁废物，从而最小化调节头外部区域的污染。 清洁废物通过在调节头的外周附近形成的通道从处理垫移除。

    Endpoint for electrochemical processing
    4.
    发明申请
    Endpoint for electrochemical processing 审中-公开
    电化学处理终点

    公开(公告)号：US20050077188A1

    公开(公告)日：2005-04-14

    申请号：US10940603

    申请日：2004-09-14

    申请人： Daxin Mao ,  Renhe Jia ,  Zhihong Wang ,  Yuan Tian ,  Feng Liu ,  Vladimir Galburt ,  Sen Ko ,  Stan Tsai ,  Liang-Yuh Chen

    发明人： Daxin Mao ,  Renhe Jia ,  Zhihong Wang ,  Yuan Tian ,  Feng Liu ,  Vladimir Galburt ,  Sen Ko ,  Stan Tsai ,  Liang-Yuh Chen

    IPC分类号： B23H5/08 ,  B24B37/013 ,  B24B49/04 ,  B24B49/10 ,  C25F7/00 ,  H01L21/304 ,  H01L21/3063 ,  C25F3/00

    CPC分类号： B24B37/013 ,  B23H5/08 ,  B24B49/04 ,  B24B49/10

    摘要： A method and apparatus for electrochemically processing a substrate is provided. In one embodiment, a method for electrochemically processing a substrate includes the steps of establishing an electrically-conductive path through an electrolyte between an exposed layer of barrier material on the substrate and an electrode, electrochemically removing a portion of the exposed layer during a first electrochemical processing step in a barrier processing station, detecting an endpoint of the first electrochemical processing step at or just prior to breakthrough of the exposed layer of barrier material, electrochemically processing the exposed layer of barrier material in a second electrochemical processing step in the barrier processing station, and detecting an endpoint of the second electrochemical processing step.

    摘要翻译： 提供了一种用于电化学处理衬底的方法和设备。 在一个实施例中，用于电化学处理衬底的方法包括以下步骤：在基底上的暴露的阻挡材料层与电极之间建立通过电解质的导电路径，在第一次电化学过程中电化学去除暴露层的一部分 在屏障处理站中的处理步骤，在暴露的阻挡材料层的穿透之前或之前检测第一电化学处理步骤的端点，在屏障处理站中的第二电化学处理步骤中电化学处理阻挡材料的暴露层 并且检测第二电化学处理步骤的端点。

    Method and apparatus for reduced wear polishing pad conditioning
    5.
    发明授权
    Method and apparatus for reduced wear polishing pad conditioning 失效
    降低磨损抛光垫调理的方法和装置

    公开(公告)号：US07210988B2

    公开(公告)日：2007-05-01

    申请号：US11209167

    申请日：2005-08-22

    申请人： Yan Wang ,  Stan D. Tsai ,  Yongqi Hu ,  Feng Q. Liu ,  Liang-Yuh Chen ,  Daxin Mao ,  Huyen Karen Tran ,  Martin S. Wohlert ,  Renhe Jia ,  Yuan A. Tian

    发明人： Yan Wang ,  Stan D. Tsai ,  Yongqi Hu ,  Feng Q. Liu ,  Liang-Yuh Chen ,  Daxin Mao ,  Huyen Karen Tran ,  Martin S. Wohlert ,  Renhe Jia ,  Yuan A. Tian

    IPC分类号： B24B53/00

    CPC分类号： B24B53/017 ,  B23H5/08

    摘要： Embodiments of a conditioning head for in-situ conditioning and/or cleaning a processing pad of a CMP, ECMP, or other processing system are provided. In one embodiment, the conditioning head includes a brush disposed in a central cavity. A cleaning fluid is provided through the central cavity of the conditioning head to a processing pad. The brush spins and moves laterally across the surface of the processing pad. The cleaning solution dispensed through the conditioning head dissolves by-products of the processing operation while the brush gently wipes the processing pad. A lip of the conditioning head retains the cleaning fluid and cleaning waste, thereby minimizing contamination of the area outside of the conditioning head. The cleaning waste is removed from the processing pad via passages formed near the outer periphery of the conditioning head.

    摘要翻译： 提供了用于原位调理和/或清洁CMP，ECMP或其它处理系统的处理垫的调节头的实施例。 在一个实施例中，调节头包括设置在中心腔中的刷子。 清洁流体通过调节头的中心空腔设置到处理垫。 刷子旋转并横向移动到处理垫的表面上。 通过调节头分配的清洁溶液溶解处理操作的副产物，同时刷子轻轻擦拭处理垫。 调节头的唇缘保持清洁流体和清洁废物，从而最小化调节头外部区域的污染。 清洁废物通过在调节头的外周附近形成的通道从处理垫移除。

    Process and composition for conductive material removal by electrochemical mechanical polishing
    6.
    发明授权
    Process and composition for conductive material removal by electrochemical mechanical polishing 失效
    通过电化学机械抛光去除导电材料的工艺和组成

    公开(公告)号：US07582564B2

    公开(公告)日：2009-09-01

    申请号：US11123274

    申请日：2005-05-05

    申请人： Zhihong Wang ,  You Wang ,  Daxin Mao ,  Renhe Jia ,  Stan D. Tsai ,  Yongqi Hu ,  Yuan A. Tian ,  Liang-Yuh Chen

    发明人： Zhihong Wang ,  You Wang ,  Daxin Mao ,  Renhe Jia ,  Stan D. Tsai ,  Yongqi Hu ,  Yuan A. Tian ,  Liang-Yuh Chen

    IPC分类号： H01L21/302

    CPC分类号： C25F3/02 ,  B23H5/08 ,  C09G1/02 ,  H01L21/32125 ,  H01L21/7684

    摘要： Compositions and methods for processing a substrate having a conductive material layer disposed thereon are provided. In one embodiment, a composition for processing a substrate having a conductive material layer disposed thereon is provided which composition includes an acid based electrolyte, a chelating agent, a corrosion inhibitor, a passivating polymeric material, a pH adjusting agent, a solvent, and a pH between about 3 and about 10. The composition is used in a method to form a passivation layer on the conductive material layer, abrading the passivation layer to expose a portion of the conductive material layer, applying a bias to the substrate, and removing the conductive material layer.

    摘要翻译： 提供了用于处理其上设置有导电材料层的基板的组合物和方法。 在一个实施方案中，提供了一种用于处理其上设置导电材料层的基材的组合物，其组成包括酸性电解质，螯合剂，缓蚀剂，钝化聚合物材料，pH调节剂，溶剂和 pH为约3至约10.该组合物用于在导电材料层上形成钝化层的方法，研磨钝化层以暴露导电材料层的一部分，向衬底施加偏压，以及去除 导电材料层。

    Method and composition for polishing a substrate
    7.
    发明申请
    Method and composition for polishing a substrate 审中-公开
    抛光基材的方法和组合物

    公开(公告)号：US20060169674A1

    公开(公告)日：2006-08-03

    申请号：US11340831

    申请日：2006-01-26

    申请人： Daxin Mao ,  Renhe Jia ,  Stan Tsai ,  Junzi Zhao ,  Laksh Karuppiah ,  Liang-Yuh Chen

    发明人： Daxin Mao ,  Renhe Jia ,  Stan Tsai ,  Junzi Zhao ,  Laksh Karuppiah ,  Liang-Yuh Chen

    IPC分类号： C09K13/00 ,  C09K13/02 ,  H01L21/461 ,  B44C1/22 ,  C03C25/68

    CPC分类号： C09G1/04 ,  C25F3/08 ,  H01L21/32125

    摘要： Polishing compositions and methods for removing conductive materials from a substrate surface are provided. In one aspect, a composition is provided for removing at least a conductive material from a substrate surface including one or more inorganic acids, a pH adjusting agent, a chelating agent, a passivating polymeric material, a pH between about 5 and about 10, and a solvent. The composition may be used in a single step or two step electrochemical mechanical planarization process. The polishing compositions and methods described herein improve the effective removal rate of materials from the substrate surface, such as tungsten, with a reduction in planarization type defects.

    摘要翻译： 提供了抛光组合物和从衬底表面去除导电材料的方法。 在一个方面，提供了一种组合物，用于从基材表面除去至少一种导电材料，所述基材表面包括一种或多种无机酸，pH调节剂，螯合剂，钝化聚合物材料，约5至约10的pH，以及 溶剂。 组合物可以用于单步或两步电化学机械平面化工艺。 本文所述的抛光组合物和方法提高了材料从衬底表面（例如钨）的有效去除速率，同时平坦化型缺陷的减少。

    Process and composition for electrochemical mechanical polishing
    8.
    发明申请
    Process and composition for electrochemical mechanical polishing 审中-公开
    电化学机械抛光的工艺和组成

    公开(公告)号：US20060249394A1

    公开(公告)日：2006-11-09

    申请号：US11251630

    申请日：2005-10-14

    申请人： Renhe Jia ,  You Wang ,  Zhihong Wang ,  Jie Diao ,  Daxin Mao ,  Stan Tsai ,  Lakshmanan Karuppiah ,  Liang-Yuh Chen

    发明人： Renhe Jia ,  You Wang ,  Zhihong Wang ,  Jie Diao ,  Daxin Mao ,  Stan Tsai ,  Lakshmanan Karuppiah ,  Liang-Yuh Chen

    IPC分类号： C09K13/00 ,  B23H9/00 ,  C25F3/00 ,  C09K13/06

    CPC分类号： C25F3/02 ,  B23H5/08 ,  C09K3/1463

    摘要： Compositions and methods for processing a substrate having a conductive material layer disposed thereon are provided. In one embodiment, a composition for processing a substrate having a conductive material layer disposed thereon is provided which composition includes an acid based electrolyte, a chelating agent, a corrosion inhibitor, a passivating polymeric material, a pH adjusting agent, a solvent, and a pH between about 3 and about 10. The composition is used in a method to form a passivation layer on the conductive material layer, abrading the passivation layer to expose a portion of the conductive material layer, applying a bias to the substrate, and removing the conductive material layer.

    摘要翻译： 提供了用于处理其上设置有导电材料层的基板的组合物和方法。 在一个实施方案中，提供了一种用于处理其上设置导电材料层的基材的组合物，其组成包括酸性电解质，螯合剂，缓蚀剂，钝化聚合物材料，pH调节剂，溶剂和 pH为约3至约10.该组合物用于在导电材料层上形成钝化层的方法，研磨钝化层以暴露导电材料层的一部分，向衬底施加偏压，以及去除 导电材料层。

    ABRASIVE COMPOSITION FOR ELECTROCHEMICAL MECHANICAL POLISHING
    9.
    发明申请
    ABRASIVE COMPOSITION FOR ELECTROCHEMICAL MECHANICAL POLISHING 审中-公开
    电化学机械抛光磨料组合物

    公开(公告)号：US20070254485A1

    公开(公告)日：2007-11-01

    申请号：US11735801

    申请日：2007-04-16

    申请人： Daxin Mao ,  You Wang ,  Junzi Zhao ,  Stan D. Tsai ,  Renhe Jia ,  Jie Diao ,  Yongqi Hu ,  Lakshmanan Karuppiah

    发明人： Daxin Mao ,  You Wang ,  Junzi Zhao ,  Stan D. Tsai ,  Renhe Jia ,  Jie Diao ,  Yongqi Hu ,  Lakshmanan Karuppiah

    IPC分类号： H01L21/461 ,  H01L21/302 ,  C09K13/00

    CPC分类号： H01L21/32125 ,  B23H5/08 ,  C09G1/02 ,  C09K3/1409 ,  C09K3/1463 ,  C25F3/02 ,  H01L21/7684

    摘要： Compositions and methods for processing a substrate having a conductive material layer disposed thereon are provided. In certain embodiments, a composition for processing a substrate having a conductive material layer disposed thereon is provided wherein the composition includes an acid based electrolyte, a chelating agent, a corrosion inhibitor, a passivating polymeric material, an amount of a pH adjusting agent sufficient to provide a pH between about 3 and about 10, anionic polymer abrasive particles, and a solvent. The composition is used in a method to form a passivation layer on the conductive material layer, abrading the passivation layer to expose a portion of the conductive material layer, applying a bias to the substrate, and removing the conductive material layer.

    摘要翻译： 提供了用于处理其上设置有导电材料层的基板的组合物和方法。 在某些实施方案中，提供了一种用于处理其上设置有导电材料层的基材的组合物，其中所述组合物包括酸性电解质，螯合剂，缓蚀剂，钝化聚合物材料，一定量的pH调节剂， 提供约3至约10个的阴离子聚合物研磨剂颗粒和溶剂之间的pH。 该组合物用于在导电材料层上形成钝化层的方法，研磨钝化层以暴露导电材料层的一部分，向衬底施加偏压，以及去除导电材料层。

    Method and composition for electrochemically polishing a conductive material on a substrate
    10.
    发明授权
    Method and composition for electrochemically polishing a conductive material on a substrate 失效
    在基材上电化学研磨导电材料的方法和组合物

    公开(公告)号：US07879255B2

    公开(公告)日：2011-02-01

    申请号：US11556593

    申请日：2006-11-03

    申请人： Huyen Karen Tran ,  Renhe Jia ,  You Wang ,  Stan D. Tsai ,  Martin S. Wohlert ,  Daxin Mao

    发明人： Huyen Karen Tran ,  Renhe Jia ,  You Wang ,  Stan D. Tsai ,  Martin S. Wohlert ,  Daxin Mao

    IPC分类号： C09K13/00

    CPC分类号： B23H5/08

    摘要： Polishing compositions and methods for removing conductive materials from a substrate surface are provided. The method includes providing a substrate comprising dielectric feature definitions, a barrier material disposed in the feature definitions, and a bulk conductive material disposed on the barrier material in an amount sufficient to fill feature definitions; polishing the substrate to substantially remove the bulk conductive material; polishing a residual conductive material to expose feature definitions, comprising: applying a first voltage for a first time period, wherein the first voltage is less than the critical voltage; and applying a second voltage for a second time period, wherein the second voltage is greater than the critical voltage.

    摘要翻译： 提供了抛光组合物和从衬底表面去除导电材料的方法。 该方法包括提供包括介电特征定义的基底，设置在特征定义中的阻挡材料和以足以填充特征定义的量设置在阻挡材料上的体导电材料; 抛光衬底以基本上去除体导电材料; 抛光残余导电材料以暴露特征定义，包括：施加第一电压第一时间段，其中所述第一电压小于所述临界电压; 以及施加第二时间段的第二电压，其中所述第二电压大于所述临界电压。