公开(公告)号：US4216246A

公开(公告)日：1980-08-05

申请号：US905398

申请日：1978-05-12

申请人： Yorio Iwasaki ,  Toshiro Okamura ,  Akishi Nakaso ,  Nobuo Uozu ,  Hiroshi Takahashi

发明人： Yorio Iwasaki ,  Toshiro Okamura ,  Akishi Nakaso ,  Nobuo Uozu ,  Hiroshi Takahashi

IPC分类号： C23C18/16 ,  C23C18/20 ,  H05K3/18 ,  H05K3/38 ,  B05D3/06

CPC分类号： H05K3/387 ,  C23C18/1605 ,  C23C18/1608 ,  C23C18/1612 ,  C23C18/2086 ,  H05K2201/0133 ,  H05K2201/0212 ,  H05K2203/0773 ,  H05K3/181

摘要： A method of improving adhesion between the surface of a substrate and a metal deposit electrolessly plated thereon by forming a novel adhesive material layer comprising (A) a rubber material and (B) a thermosetting resin which is present in a proportion defined by the formula 20.ltoreq.(B)/(A)+(B).ltoreq.85 volume %. In the adhesive layer the thermosetting resin is dispersed, in the form of substantially spherical particles of 0.5 to 15.mu., in the continuous phase of the rubber material. The method is useful for producing printed circuit boards having a high precision and high accuracy pattern circuit. Further, the method is extremely advantageous when it is applied to the so-called photo-forming process since disappearance of the catalyst nuclei on the circuit pattern image can be eliminated.

摘要翻译： 通过形成包含（A）橡胶材料的新型粘合剂层和（B）按照式20所定义的比例存在的热固性树脂，改善基材表面和无电镀在其上的金属沉积物之间的粘附性的方法

公开(公告)号：US4315845A

公开(公告)日：1982-02-16

申请号：US131625

申请日：1980-03-19

申请人： Hiroshi Takahashi ,  Koichi Tsuyama ,  Nobuo Uozu ,  Makoto Fujikura

发明人： Hiroshi Takahashi ,  Koichi Tsuyama ,  Nobuo Uozu ,  Makoto Fujikura

IPC分类号： B05D5/12 ,  B05D7/24 ,  C09D5/03 ,  H05K1/05 ,  H05K3/18 ,  H05K3/38 ,  C08K5/15

CPC分类号： H05K1/056 ,  C09D5/03 ,  H05K2201/0209 ,  H05K3/181 ,  H05K3/386 ,  Y10S524/904

摘要： A process for preparing a chemically platable thermosetting powder coating characterized by preliminarily kneading a composition comprising 3 to 50% by weight of a thermosetting resin, 5 to 60% by weight of an inorganic filler and up to 80% by weight of a rubber component comprising at least 10% by weight of a rubber having ethylenic double bonds and polar groups in the molecule, the amount of which rubber component constitutes the total amount of rubber component in the final powder coating, the rubber component content of the composition to be subjected to the preliminary kneading being at least twice the rubber component content of the final powder coating, said composition being heated at a temperature of at least the melting point of the thermosetting resin at least once during the course of the preliminary kneading, thereby to effect efficient dispersion of the components. The powder coating prepared according to the process of the present invention is substantially homogeneous due to the uniform dispersion of its components, thus providing good applicability thereof on an article, excellent levelling of a coated film of the powder coating when molten in the step of heat hardening and an improved peeling strength between the coated and heat-hardened film of the powder coating and a metal deposited thereon by chemical plating. The chemically platable thermosetting powder coating prepared according to the process of the present invention may further comprise a catalyst for chemical plating, at least 50% by weight of catalyst in the final powder coating being kneaded together with the above-mentioned composition in the step of preliminary kneading.

摘要翻译： 一种制备化学镀层热固性粉末涂料的方法，其特征在于预先捏合包含3至50重量％的热固性树脂，5至60重量％的无机填料和至多80重量％的橡胶组分的组合物，其包含 至少10重量％的分子中具有烯属双键和极性基团的橡胶，其中橡胶成分构成最终粉末涂料中橡胶组分总量的量，待处理组合物的橡胶组分含量 初步捏合是最终粉末涂料的橡胶组分含量的至少两倍，所述组合物在预混合过程中至少在热固性树脂的熔点至少一次的温度下加热，从而有效地分散 的组件。 根据本发明的方法制备的粉末涂料由于其组分的均匀分散而基本上是均质的，因此在制品上提供了良好的适用性，当在热的步骤中熔融时，粉末涂料的涂膜的流平性优异 硬化，并且通过化学镀在粉末涂料的涂覆和加热硬化膜和沉积在其上的金属之间提高剥离强度。 根据本发明方法制备的化学镀热固性粉末涂料还可以包括用于化学镀的催化剂，在最终粉末涂料中的至少50重量％的催化剂与上述组合物在步骤 初步揉捏。

公开(公告)号：US4585502A

公开(公告)日：1986-04-29

申请号：US701533

申请日：1985-02-14

申请人： Nobuo Uozu ,  Hiroyoshi Yokoyama ,  Yoichi Matsuda

发明人： Nobuo Uozu ,  Hiroyoshi Yokoyama ,  Yoichi Matsuda

IPC分类号： H05K3/18 ,  H05K3/38 ,  H05K3/42 ,  B32B31/00 ,  B05D5/12 ,  B44C1/22 ,  C23F1/00

CPC分类号： H05K3/422 ,  H05K3/42 ,  H05K3/426 ,  H05K2201/09581 ,  H05K2203/0709 ,  H05K2203/1407 ,  H05K3/184 ,  H05K3/387 ,  Y10T29/49144 ,  Y10T29/49165

摘要： A process for producing a printed circuit board characterized by forming a thermosetting resin layer on internal walls of through holes before an electroless plating treatment can produce printed circuit boards having high reliability without causing blow-holes on the through hole walls.

摘要翻译： 制造印刷电路板的方法，其特征在于在化学镀处理之前在通孔的内壁上形成热固性树脂层，可以生产具有高可靠性的印刷电路板，而不会在通孔壁上产生气孔。