公开(公告)号：US4216246A

公开(公告)日：1980-08-05

申请号：US905398

申请日：1978-05-12

申请人： Yorio Iwasaki ,  Toshiro Okamura ,  Akishi Nakaso ,  Nobuo Uozu ,  Hiroshi Takahashi

发明人： Yorio Iwasaki ,  Toshiro Okamura ,  Akishi Nakaso ,  Nobuo Uozu ,  Hiroshi Takahashi

IPC分类号： C23C18/16 ,  C23C18/20 ,  H05K3/18 ,  H05K3/38 ,  B05D3/06

CPC分类号： H05K3/387 ,  C23C18/1605 ,  C23C18/1608 ,  C23C18/1612 ,  C23C18/2086 ,  H05K2201/0133 ,  H05K2201/0212 ,  H05K2203/0773 ,  H05K3/181

摘要： A method of improving adhesion between the surface of a substrate and a metal deposit electrolessly plated thereon by forming a novel adhesive material layer comprising (A) a rubber material and (B) a thermosetting resin which is present in a proportion defined by the formula 20.ltoreq.(B)/(A)+(B).ltoreq.85 volume %. In the adhesive layer the thermosetting resin is dispersed, in the form of substantially spherical particles of 0.5 to 15.mu., in the continuous phase of the rubber material. The method is useful for producing printed circuit boards having a high precision and high accuracy pattern circuit. Further, the method is extremely advantageous when it is applied to the so-called photo-forming process since disappearance of the catalyst nuclei on the circuit pattern image can be eliminated.

摘要翻译： 通过形成包含（A）橡胶材料的新型粘合剂层和（B）按照式20所定义的比例存在的热固性树脂，改善基材表面和无电镀在其上的金属沉积物之间的粘附性的方法

公开(公告)号：US5309632A

公开(公告)日：1994-05-10

申请号：US970925

申请日：1992-11-02

申请人： Hiroshi Takahashi ,  Shin Takanezawa ,  Masao Kanno ,  Yorio Iwasaki ,  Toshirou Okamura ,  Akishi Nakaso ,  Kiyoshi Hasegawa

发明人： Hiroshi Takahashi ,  Shin Takanezawa ,  Masao Kanno ,  Yorio Iwasaki ,  Toshirou Okamura ,  Akishi Nakaso ,  Kiyoshi Hasegawa

IPC分类号： H05K1/03 ,  H05K3/18 ,  H05K3/38 ,  H05K3/42 ,  H01K3/10

CPC分类号： H05K3/181 ,  H05K3/184 ,  H05K3/426 ,  H05K1/0373 ,  H05K2201/0236 ,  H05K2201/0344 ,  H05K2203/0709 ,  H05K2203/1407 ,  H05K2203/1415 ,  H05K3/387 ,  Y10T29/49155 ,  Y10T29/49165

摘要： A process for producing a printed wiring board characterized by forming a nickel layer by electroless plating and a copper layer formed thereon by electroless plating, or forming a copper undercoating layer before the nickel layer by electroless plating can produce printed circuit boards excellent in resistance to electrolytic corrosion and suitable for mounting parts in high density.

摘要翻译： 一种印刷电路板的制造方法，其特征在于，通过无电解电镀形成镍层，通过无电镀形成在其上的铜层，或者通过化学镀在镍层之前形成铜底涂层，可以制造出耐电解质优异的印刷电路板 腐蚀，适合高密度安装。

公开(公告)号：US4643793A

公开(公告)日：1987-02-17

申请号：US750780

申请日：1985-07-01

申请人： Akishi Nakaso ,  Youichi Kaneko ,  Toshiro Okamura ,  Kiyoshi Yamanoi

发明人： Akishi Nakaso ,  Youichi Kaneko ,  Toshiro Okamura ,  Kiyoshi Yamanoi

IPC分类号： C23C22/06 ,  C23C18/40 ,  H05K3/38 ,  H05K3/46

CPC分类号： C23C18/40 ,  H05K3/384 ,  H05K2203/0307 ,  H05K2203/072 ,  H05K3/4611 ,  Y10S428/901

摘要： A process for treating a surface of a metal such as copper with a liquid composition comprising (I) copper ions, a complexing agent, a reducing agent, a pH adjusting agent, water, and (II) a nitrogen-containing organic compound such as heterocyclic compound or containing --N.dbd. and --NH.sub.2 and/or --OH groups in its molecule can give multilayer printed wiring boards having excellent adhesive strength and line definition of inner layer copper conductors with long shelf life.

摘要翻译： 一种用（I）铜离子，络合剂，还原剂，pH调节剂，水等液体组合物处理金属表面的方法，（II）含氮有机化合物如 杂环化合物或其分子中含有-N =和-NH 2和/或-OH基团可以提供具有优良的粘合强度和具有长保质期的内层铜导线的线定义的多层印刷线路板。

公开(公告)号：US4548644A

公开(公告)日：1985-10-22

申请号：US535057

申请日：1983-09-23

申请人： Akishi Nakaso ,  Kiyoshi Yamanoi ,  Toshiro Okamura ,  Yoshiyuki Tsuru

发明人： Akishi Nakaso ,  Kiyoshi Yamanoi ,  Toshiro Okamura ,  Yoshiyuki Tsuru

IPC分类号： C23C18/40 ,  C23C3/02

CPC分类号： C23C18/40

摘要： An electroless copper deposition solution comprising (a) cupric ions, a complexing agent for cupric ions, a reducing agent and a pH adjusting agent, (b) a polyoxyethylene ether and (c) at least one member selected from the group consisting of an inorganic cyanide and .alpha.,.alpha.'-dipyridyl can give a deposited film with high elongation.

摘要翻译： 一种无电解铜沉积溶液，其包含（a）铜离子，铜离子络合剂，还原剂和pH调节剂，（b）聚氧乙烯醚和（c）至少一种选自无机 氰化物和α，α'-二吡啶基可以产生具有高伸长率的沉积膜。

公开(公告)号：US4557762A

公开(公告)日：1985-12-10

申请号：US635403

申请日：1984-07-30

申请人： Akishi Nakaso ,  Toshiro Okamura ,  Kiyoshi Yamanoi ,  Sumiko Nakajima

发明人： Akishi Nakaso ,  Toshiro Okamura ,  Kiyoshi Yamanoi ,  Sumiko Nakajima

IPC分类号： C23C18/40

CPC分类号： C23C18/40 ,  C23C18/405

摘要： An electroless copper plating solution comprising cupric ions, a complexing agent, a reducing agent, a pH adjuster, a perfluoropolyether, a cyanide and/or .alpha.,.alpha.'-dipyridyl and/or 1,10-phenanthroline or a derivative thereof is capable of forming a deposited film with high elongation.

摘要翻译： 包含铜离子，络合剂，还原剂，pH调节剂，全氟聚醚，氰化物和/或α，α'-二吡啶基和/或1,10-菲咯啉或其衍生物的化学镀铜溶液能够 形成具有高伸长率的沉积膜。

公开(公告)号：US4902551A

公开(公告)日：1990-02-20

申请号：US224911

申请日：1988-07-27

申请人： Akishi Nakaso ,  Toshiro Okamura ,  Haruo Ogino ,  Tomoko Watanabe ,  Yuko Kimura

发明人： Akishi Nakaso ,  Toshiro Okamura ,  Haruo Ogino ,  Tomoko Watanabe ,  Yuko Kimura

IPC分类号： B32B15/04 ,  C23C18/40 ,  C23C22/63 ,  C23C22/83 ,  H05K1/00 ,  H05K1/03 ,  H05K3/02 ,  H05K3/28 ,  H05K3/38 ,  H05K3/42 ,  H05K3/46

CPC分类号： C23C22/63 ,  B32B15/04 ,  C23C18/40 ,  C23C22/83 ,  H05K3/022 ,  H05K3/385 ,  H05K3/4652 ,  H05K1/0366 ,  H05K1/0393 ,  H05K2201/0355 ,  H05K2203/0315 ,  H05K2203/1157 ,  H05K3/281 ,  H05K3/427 ,  Y10S428/901 ,  Y10T156/1057 ,  Y10T29/49165 ,  Y10T428/24322

摘要： Adhesion of copper to a resin layer is improved by reducing a copper oxide layer with an aqueous aldehyde solution (a) while applying a potential of -1000 mV to -400 mV to the copper oxide layer, (b) after contacting with a metal piece made of copper or a metal nobler than copper, or (c) after contacting with an aqueous solution of alkali borohydride.

公开(公告)号：US20080010819A1

公开(公告)日：2008-01-17

申请号：US11775294

申请日：2007-07-10

申请人： Hidehiro NAKAMURA ,  Akishi Nakaso ,  Shigeharu Arike ,  Fumio Inoue ,  Tetsuya Enomoto ,  Norio Moriike ,  Kousuke Hiroki

发明人： Hidehiro NAKAMURA ,  Akishi Nakaso ,  Shigeharu Arike ,  Fumio Inoue ,  Tetsuya Enomoto ,  Norio Moriike ,  Kousuke Hiroki

IPC分类号： H05K3/30

CPC分类号： H05K3/4617 ,  H01L21/4857 ,  H01L21/486 ,  H01L23/3128 ,  H01L23/49822 ,  H01L23/49827 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01327 ,  H01L2924/15183 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K3/0097 ,  H05K3/06 ,  H05K3/244 ,  H05K3/4038 ,  H05K3/4623 ,  H05K3/4632 ,  H05K3/4647 ,  H05K2201/0141 ,  H05K2201/0195 ,  H05K2201/0355 ,  H05K2201/0361 ,  H05K2201/096 ,  H05K2201/10378 ,  H05K2203/0152 ,  H05K2203/0156 ,  H05K2203/0384 ,  H05K2203/0733 ,  H05K2203/1536 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49147 ,  Y10T29/49165 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： The present invention provides a connection board that is formed by an insulating resin composition layer made of one layer or two or more layers and a connection conductor that is formed so as to pass through the insulating resin composition layer in its thickness direction at a position where a conductor circuit is connected, and a multi-layer wiring board, a substrate for semiconductor package and a semiconductor package using the connection board, and methods for manufacturing them.

摘要翻译： 本发明提供一种由一层或两层以上的绝缘树脂组合物层形成的连接板，以及形成为在其绝缘树脂组合物层的厚度方向上形成的连接导体， 连接导体电路，并且使用多层布线板，半导体封装用基板和使用该连接基板的半导体封装，以及其制造方法。

公开(公告)号：US06207266B1

公开(公告)日：2001-03-27

申请号：US08975649

申请日：1997-11-21

申请人： Hisashige Kanbara ,  Akishi Nakaso ,  Minoru Tosaka

发明人： Hisashige Kanbara ,  Akishi Nakaso ,  Minoru Tosaka

IPC分类号： H05K900

CPC分类号： H05K9/0096 ,  H01J29/868 ,  Y10T428/25 ,  Y10T428/256

摘要： Provided is bonding film in the form of web which has a high electromagnetic shielding effect for electromagnetic radiation from the front surface of a display device, and other favorable properties such as an infrared blocking property, a transparency, a invisibility and a favorable bonding property. The bonding film typically includes base film, a geometrically patterned electroconductive layer placed over the base film so as to achieve an aperture ratio of 80% of more, and a bonding layer for attaching the assembly to an object. The film may be applied to the surface of a transparent sheet member for the convenience of handling, and such an assembly has a symmetric structure so that the warping of the assembly may be minimized. The bonding film may be interposed between a pair transparent base sheets, or the bonding film may be applied over two sides a transparent base sheet. The assembly may further include an infrared blocking layer and an anti-glare layer.

摘要翻译： 提供了对从显示装置的前表面进行电磁辐射具有高电磁屏蔽效果的卷材形式的接合膜以及诸如红外线阻挡性，透明性，不可见性和良好的粘合性等的其它有利特性。 接合膜通常包括基膜，放置在基膜上的几何图案化的导电层，以达到80％以上的孔径比，以及用于将组件附接到物体的粘合层。 为了便于操作，膜可以施加到透明片材的表面，并且这种组件具有对称结构，使得组件的翘曲可以最小化。 接合膜可以插入在一对透明基片之间，或者接合膜可以在两侧涂覆有透明基片。 组件还可以包括红外阻挡层和防眩层。

公开(公告)号：US06197149B1

公开(公告)日：2001-03-06

申请号：US09057522

申请日：1998-04-09

申请人： Kazuhito Kobayashi ,  Yasushi Kumashiro ,  Atsushi Takahashi ,  Koji Morita ,  Takahiro Tanabe ,  Kazunori Yamamoto ,  Akishi Nakaso ,  Shigeharu Arike ,  Kazuhisa Otsuka ,  Naoyuki Urasaki ,  Daisuke Fujimoto ,  Nozomu Takano

发明人： Kazuhito Kobayashi ,  Yasushi Kumashiro ,  Atsushi Takahashi ,  Koji Morita ,  Takahiro Tanabe ,  Kazunori Yamamoto ,  Akishi Nakaso ,  Shigeharu Arike ,  Kazuhisa Otsuka ,  Naoyuki Urasaki ,  Daisuke Fujimoto ,  Nozomu Takano

IPC分类号： C09J500

CPC分类号： H05K3/4655 ,  C09D5/00 ,  H05K1/0373 ,  H05K3/4652 ,  H05K2201/0209 ,  H05K2201/0239 ,  H05K2201/0248 ,  H05K2201/0355 ,  H05K2201/0358 ,  Y10T428/24994 ,  Y10T428/249944 ,  Y10T428/249946 ,  Y10T428/249952

摘要： An insulating varnish comprising a resin component, electrical insulating whiskers, and if necessary, one or more additives such as an ion adsorbent, and/or an organic reagent for preventing injury from copper, produced by adding the additives to the resin component and the whiskers, or filtering the whiskers, or milled by using a beads mill or a three-roll mill, or the like, is excellent for producing a multilayer printed circuit board having high wiring density, high reliability and excellent other electrical properties.

摘要翻译： 一种绝缘漆，其包括树脂组分，电绝缘晶须，并且如果需要，可以使用一种或多种添加剂，例如离子吸附剂和/或用于防止铜损伤的有机试剂，其通过将添加剂添加到树脂组分和晶须 或过滤晶须，或通过使用珠磨机或三辊研磨机等进行研磨，对于制造具有高布线密度，高可靠性和优异的其它电性能的多层印刷电路板是优异的。

公开(公告)号：US5690837A

公开(公告)日：1997-11-25

申请号：US576488

申请日：1995-12-21

申请人： Akishi Nakaso ,  Koichi Tsuyama ,  Kazuhisa Otsuka ,  Haruo Ogino ,  Yoshihiro Tamura ,  Teiichi Inada ,  Kazunori Yamamoto ,  Akinari Kida ,  Atsushi Takahashi ,  Yoshiyuki Tsuru ,  Shigeharu Arike

发明人： Akishi Nakaso ,  Koichi Tsuyama ,  Kazuhisa Otsuka ,  Haruo Ogino ,  Yoshihiro Tamura ,  Teiichi Inada ,  Kazunori Yamamoto ,  Akinari Kida ,  Atsushi Takahashi ,  Yoshiyuki Tsuru ,  Shigeharu Arike

IPC分类号： H05K3/00 ,  H05K3/02 ,  H05K3/38 ,  H05K3/46 ,  B44C1/22 ,  C23F1/00

CPC分类号： H05K3/4652 ,  H05K3/0055 ,  H05K2201/0209 ,  H05K2203/063 ,  H05K2203/0773 ,  H05K2203/0789 ,  H05K2203/0793 ,  H05K2203/0796 ,  H05K3/025 ,  H05K3/381

摘要： In a process for producing a multilayer printed circuit board comprising drilling holes for via holes in a composite film material containing at least a copper foil and an insulating half-cured adhesive layer, laminating the resulting film material on an innerlayer circuit substrate, ad electrically connecting an innerlayer circuit with an outer layer copper foil, when an adhesive resin flowed into the holes is roughened, or when a composite film material having a copper foil of less than 12 .mu.m thick formed on a carrier is used, or a special cushion material is further laminated on the laminate of the innerlayer circuit substrate and the film material, electrical connection reliability is enhanced and circuit density can be increased with easy steps.

摘要翻译： 在制造多层印刷电路板的方法中，该多层印刷电路板包括至少包含铜箔和绝缘半固化粘合剂层的复合膜材料中的通孔钻孔，将所得薄膜材料层叠在内层电路基板上，电连接 具有外层铜箔的内层电路当流入孔中的粘合剂树脂被粗糙化时，或者当使用形成在载体上的具有小于12μm厚的铜箔的复合膜材料或特殊的缓冲材料 进一步层压在内层电路基板和膜材料的层压体上，提高了电连接的可靠性，并且通过简单的步骤可以提高电路密度。