利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

10 条记录 (耗时 0.022 秒)

    Electrolytic process for producing lead sulfonate and tin sulfonate for solder plating use
    1.
    发明授权
    Electrolytic process for producing lead sulfonate and tin sulfonate for solder plating use 失效
    用于生产铅酸锡和锡磺酸盐的电解工艺用于焊锡电镀

    公开(公告)号：US5618404A

    公开(公告)日：1997-04-08

    申请号：US442535

    申请日：1995-05-16

    申请人： Yoshiaki Okuhama ,  Seishi Masaki ,  Takao Takeuchi ,  Yoshiharu Matsuda ,  Masakazu Yoshimoto

    发明人： Yoshiaki Okuhama ,  Seishi Masaki ,  Takao Takeuchi ,  Yoshiharu Matsuda ,  Masakazu Yoshimoto

    IPC分类号： C25B3/00 ,  C25D3/60 ,  C25B1/00

    CPC分类号： C25B3/00 ,  C25D3/60

    摘要： An electrolytic process for producing lead and tin sulfonates which comprises applying a DC voltage to an anode and a plurality of cathodes in an electrolytic cell and thereby dissolving lead or tin in an electrolytic solution. The electrolytic cell is partitioned by cation- and anion-exchange membranes into anode and cathode chambers. The electrolytic solution is a solution of an organic sulfonic acid, and the anode is lead or tin. The process reduces contents of radioisotopes such as uranium and thorium to a level of less than 50 ppb, and therefore the coatings formed by solder plating using the lead and tin salts in accordance with the invention show radioactive .alpha. particle counts of less than 0.1 CPH/cm.sup.2.

    摘要翻译： 一种用于生产铅和锡磺酸盐的电解方法，其包括向电解池中的阳极和多个阴极施加DC电压，从而将铅或锡溶解在电解液中。 电解池被阳离子交换膜和阴离子交换膜分隔成阳极室和阴极室。 电解液是有机磺酸的溶液，阳极是铅或锡。 该方法将诸如铀和钍的放射性同位素的含量降低到低于50ppb的水平，因此根据本发明使用铅和锡盐的焊料镀覆形成的涂层显示出小于0.1CPH / cm2。

    Tin, lead, and tin-lead alloy plating baths
    4.
    发明授权
    Tin, lead, and tin-lead alloy plating baths 失效
    锡，铅和锡铅合金电镀浴

    公开(公告)号：US4459185A

    公开(公告)日：1984-07-10

    申请号：US532934

    申请日：1983-09-16

    申请人： Keigo Obata ,  Nobuyasu Dohi ,  Yoshiaki Okuhama ,  Seishi Masaki ,  Yukiyoshi Okada ,  Masakazu Yoshimoto

    发明人： Keigo Obata ,  Nobuyasu Dohi ,  Yoshiaki Okuhama ,  Seishi Masaki ,  Yukiyoshi Okada ,  Masakazu Yoshimoto

    IPC分类号： C25D3/30 ,  C25D3/32 ,  C25D3/34 ,  C25D3/36 ,  C25D3/56 ,  C25D3/60

    CPC分类号： C25D3/32 ,  C25D3/36 ,  C25D3/56 ,  C25D3/60

    摘要： A tin, lead or tin-lead alloy plating bath, which comprises(A) a principal plating bath containing an alkanesulfonic or alkanolsulfonic acid, and either a divalent tin salt or a divalent lead salt thereof or both;(B) at least one of surfactants comprising(a) a cationic surfactant selected from the group consisting of quarternary ammonium salts, alkyl pyridinium salts, alkyl imidazolinium salts and higher alkyl amine salts,(b) an amphoteric surfactant selected from betaines, or(c) a nonionic surfactant selected from the group consisting of condensation products of ethylene oxide and/or propylene oxide with a styrenated phenol, a higher alcohol, an alkylphenol, an alkylnaphthol, a fatty acid amide, a sorbitan or a phosphate; and(C) at least one of levelling agents selected from the group consisting of alkylidene sulfamic acids, quinolinol derivatives, benzotriazole derivatives, dialkylidene o-phenylene diamines, benzaldehyde derivatives, triazine derivatives, salicylic acid derivatives and nitriles.

    摘要翻译： 锡，铅或锡铅合金电镀浴，其包含（A）含有烷烃磺酸或链烷醇磺酸的主要电镀液，以及二价锡盐或其二价铅盐或两者; （B）至少一种表面活性剂，其包含（a）选自季铵盐，烷基吡啶鎓盐，烷基咪唑啉鎓盐和高级烷基胺盐的阳离子表面活性剂，（b）选自甜菜碱的两性表面活性剂或（ c）选自环氧乙烷和/或环氧丙烷与苯乙烯化酚，高级醇，烷基酚，烷基萘酚，脂肪酸酰胺，脱水山梨糖醇或磷酸酯的缩合产物的非离子表面活性剂; 和（C）选自亚烷基氨基磺酸，羟基喹啉衍生物，苯并三唑衍生物，二烷基亚苯基二胺，苯甲醛衍生物，三嗪衍生物，水杨酸衍生物和腈的至少一种流平剂。

    Method for forming circuit pattern
    6.
    发明授权
    Method for forming circuit pattern 有权
    电路图案形成方法

    公开(公告)号：US07056448B2

    公开(公告)日：2006-06-06

    申请号：US10441588

    申请日：2003-05-20

    申请人： Yoshiaki Okuhama ,  Keigo Obata ,  Masakazu Yoshimoto ,  Shingo Kitamura ,  Seiichiro Nakao ,  Osamu Masuyama ,  Hidenori Tsuji

    发明人： Yoshiaki Okuhama ,  Keigo Obata ,  Masakazu Yoshimoto ,  Shingo Kitamura ,  Seiichiro Nakao ,  Osamu Masuyama ,  Hidenori Tsuji

    IPC分类号： C23F1/00

    CPC分类号： C23C18/161 ,  C23C18/1651 ,  C23C18/30 ,  H05K3/181 ,  Y10T29/49121 ,  Y10T29/49156

    摘要： A method for forming a circuit pattern includes at least a step (a) of subjecting a non-conductor to electroless copper plating to form a copper film and a step (b) of etching the copper film so as to form a circuit pattern. As a catalyst for the electroless copper plating, a silver colloidal solution is used containing as essential components at least the following: (I) silver colloidal particles; (II) one or more of ions of metal having an electric potential which can reduce silver ions to metal silver in the solution and/or ions which result from oxidation of the ion at the time of reduction of the silver ions; and (III) one or more of hydroxycarboxylate, condensed phosphate and/or amine carboxylate ions. The silver colloidal particles (I) are produced by the ion (II) of the metal having an electric potential which can reduce silver ions to metal silver. The circuit pattern may be formed on a printed wiring board.

    摘要翻译： 形成电路图案的方法至少包括使非导体进行无电镀铜以形成铜膜的步骤（a）和蚀刻铜膜以形成电路图案的步骤（b）。 作为无电镀铜的催化剂，使用银胶体溶液作为至少以下的必要成分：（I）银胶体粒子; （II）一种或多种具有电位的金属离子，其可以将银离子还原成溶液中的金属银，和/或在还原银离子时离子氧化导致的离子; 和（III）一种或多种羟基羧酸盐，缩合磷酸盐和/或胺羧酸盐离子。 银胶体颗粒（I）由具有可以将银离子还原成金属银的电位的金属的离子（II）产生。 电路图案可以形成在印刷线路板上。

    Method for forming circuit pattern
    7.
    发明申请
    Method for forming circuit pattern 有权
    电路图案形成方法

    公开(公告)号：US20050258134A1

    公开(公告)日：2005-11-24

    申请号：US10441588

    申请日：2003-05-20

    申请人： Yoshiaki Okuhama ,  Keigo Obata ,  Masakazu Yoshimoto ,  Shingo Kitamura ,  Seiichiro Nakao ,  Osamu Masuyama ,  Hidenori Tsuji

    发明人： Yoshiaki Okuhama ,  Keigo Obata ,  Masakazu Yoshimoto ,  Shingo Kitamura ,  Seiichiro Nakao ,  Osamu Masuyama ,  Hidenori Tsuji

    IPC分类号： C23C18/28 ,  B05D3/10 ,  B05D5/12 ,  C23C18/16 ,  C23C18/30 ,  C23C18/38 ,  H01B13/00 ,  H05K3/06 ,  H05K3/18 ,  H05K3/46

    CPC分类号： C23C18/161 ,  C23C18/1651 ,  C23C18/30 ,  H05K3/181 ,  Y10T29/49121 ,  Y10T29/49156

    摘要： A method for forming a circuit pattern includes at least a step (a) of subjecting a non-conductor to electroless copper plating to form a copper film and a step (b) of etching the copper film so as to form a circuit pattern. As a catalyst for the electroless copper plating, a silver colloidal solution is used containing as essential components at least the following: (I) silver colloidal particles; (II) one or more of ions of metal having an electric potential which can reduce silver ions to metal silver in the solution and/or ions which result from oxidation of the ion at the time of reduction of the silver ions; and (III) one or more of hydroxycarboxylate, condensed phosphate and/or amine carboxylate ions. The silver colloidal particles (I) are produced by the ion (II) of the metal having an electric potential which can reduce silver ions to metal silver. The circuit pattern may be formed on a printed wiring board.

    摘要翻译： 形成电路图案的方法至少包括使非导体进行无电镀铜以形成铜膜的步骤（a）和蚀刻铜膜以形成电路图案的步骤（b）。 作为无电镀铜的催化剂，使用银胶体溶液作为至少以下的必要成分：（I）银胶体粒子; （II）一种或多种具有电位的金属离子，其可以将银离子还原成溶液中的金属银，和/或在还原银离子时离子氧化导致的离子; 和（III）一种或多种羟基羧酸盐，缩合磷酸盐和/或胺羧酸盐离子。 银胶体颗粒（I）由具有可以将银离子还原成金属银的电位的金属的离子（II）产生。 电路图案可以形成在印刷线路板上。

    Pretreatment solution for providing catalyst for electroless plating, pretreatment method using the solution, and electroless plated film and/or plated object produced by use of the method
    8.
    发明授权
    Pretreatment solution for providing catalyst for electroless plating, pretreatment method using the solution, and electroless plated film and/or plated object produced by use of the method 有权
    用于提供化学镀的催化剂的预处理溶液，使用该溶液的预处理方法以及使用该方法生产的无电镀膜和/或电镀对象

    公开(公告)号：US07166152B2

    公开(公告)日：2007-01-23

    申请号：US10636447

    申请日：2003-08-07

    申请人： Yoshiaki Okuhama ,  Keigo Obata ,  Masakazu Yoshimoto ,  Kim Dong Hyun ,  Shingo Kitamura ,  Seiichiro Nakao ,  Hidenori Tsuji ,  Hidemi Nawafune

    发明人： Yoshiaki Okuhama ,  Keigo Obata ,  Masakazu Yoshimoto ,  Kim Dong Hyun ,  Shingo Kitamura ,  Seiichiro Nakao ,  Hidenori Tsuji ,  Hidemi Nawafune

    IPC分类号： C23C18/28

    CPC分类号： C23C18/28

    摘要： A pretreatment solution for providing a catalyst for electroless plating and a pretreatment method using the solution are provided. The pretreatment solution comprises a silver colloidal solution containing, as essential components, at least the following components (I), (II) and (III): (I) silver colloidal particles, (II) one or more ions selected from an ion of a metal having an electric potential which can reduce a silver ion to metal silver in the solution and an ion oxidized at the time of reduction of the silver ion, and (III) one or more ions selected from a hydroxycarboxylate ion, a condensed phosphate ion and an amine carboxylate ion, the silver colloidal particles (I) being produced by the ion of the metal (II) having an electric potential which can reduce a silver ion to metal silver. When an object to be plated is pretreated by use of the pretreatment solution, provision of an effective catalyst for electroless plating is achieved.

    摘要翻译： 提供了一种用于提供无电镀的催化剂的预处理溶液和使用该溶液的预处理方法。 所述预处理溶液包含至少含有以下成分（I），（II）和（III）作为必要成分的银胶体溶液：（I）银胶体粒子，（II）一种或多种离子，选自 具有可以将银离子还原成溶液中的金属银的金属和在银离子还原时被氧化的离子的金属，和（III）一种或多种选自羟基羧酸根离子，缩合磷酸根离子 和胺羧酸根离子，银胶体粒子（I）由金属（II）的离子产生，具有可以将银离子还原成金属银的电位。 当通过使用预处理溶液预处理要镀覆的物体时，实现无电镀的有效催化剂。

    Tin-lead alloy plating bath
    9.
    发明授权
    Tin-lead alloy plating bath 失效
    锡铅合金电镀浴

    公开(公告)号：US4555314A

    公开(公告)日：1985-11-26

    申请号：US649107

    申请日：1984-09-10

    申请人： Keigo Obata ,  Nobuyasu Dohi ,  Yoshiaki Okuhama ,  Seishi Masaki ,  Yukiyoshi Okada ,  Tadashi Yoshida

    发明人： Keigo Obata ,  Nobuyasu Dohi ,  Yoshiaki Okuhama ,  Seishi Masaki ,  Yukiyoshi Okada ,  Tadashi Yoshida

    IPC分类号： C25D3/56 ,  C25D3/60

    CPC分类号： C25D3/56 ,  C25D3/60

    摘要： A tin-lead alloy plating bath based on a principal plating bath comprising an alkanesulfonic or alkanolsulfonic acid and both bivalent tin and lead salts thereof is characterized by the addition of a guanamine compound having the general formula ##STR1## wherein R.sub.1 and R.sub.2, which may be the same or different, represent each a hydrogen atom, C.sub.1-18 straight- or branched-chain alkyl radical, C.sub.1-18 straight- or branched-chain alkoxy-lower alkyl radical, or a C.sub.3-7 cycloalkyl radical, or R.sub.1 and R.sub.2 may combine to form a carbon cycle or hetero cycle, and A represents a lower alkylene radical.

    摘要翻译： 基于包含烷烃磺酸或链烷醇磺酸的二次锡和铅盐的主镀液的锡铅合金电镀浴的特征在于加入通式为“IMAGE”的胍胺化合物，其中R 1和R 2可以 相同或不同，表示氢原子，C1-18直链或支链烷基，C1-18直链或支链烷氧基 - 低级烷基或C3-7环烷基，或R1和 R2可以结合形成碳循环或杂环，A代表低级亚烷基。

    Aqueous solutions for obtaining noble metals by chemical reductive deposition
    10.
    发明授权
    Aqueous solutions for obtaining noble metals by chemical reductive deposition 有权
    通过化学还原沉积获得贵金属的水溶液

    公开(公告)号：US06235093B1

    公开(公告)日：2001-05-22

    申请号：US09340892

    申请日：1999-06-28

    申请人： Yoshiaki Okuhama ,  Takao Takeuchi ,  Keigo Obata ,  Yasuhito Kohashi ,  Hidemi Nawafune

    发明人： Yoshiaki Okuhama ,  Takao Takeuchi ,  Keigo Obata ,  Yasuhito Kohashi ,  Hidemi Nawafune

    IPC分类号： C23C1831

    CPC分类号： C23C18/44

    摘要： An aqueous solution for obtaining a noble metal by chemical reduction containing at least one water-soluble compound or complex of a metal selected from the group consisting of gold, platinum, silver, and palladium as a source of the metal to be deposited, and at least one mercapto compound or sulfide compound or a salt thereof as a reducing agent. The reducing agent is typically mercaptoacetic acid, 2-mercaptopropionic acid, 2-aminoethanethiol, 2-mercaptoethanol, glucose cysteine, 1-thioglycerol, sodium mercaptopropanesulfonate, N-acetylmethionine, thiosalicylic acid, 2-thiazoline-2-thiol, 2,5-dimercapto-1,3,4-thiadiazole, 2-benzothiazolethiol, or 2-benzimidazolethiol. They may be used singly or in combination.

    摘要翻译： 一种用于通过化学还原获得贵金属的水溶液，其含有至少一种选自金，铂，银和钯的金属的水溶性化合物或络合物作为待沉积金属的来源，以及在 至少一种巯基化合物或硫化物化合物或其盐作为还原剂。 还原剂通常为巯基乙酸，2-巯基丙酸，2-氨基乙硫醇，2-巯基乙醇，葡萄糖半胱氨酸，1-硫代甘油，巯基丙磺酸钠，N-乙酰基甲硫氨酸，硫代水杨酸，2-噻唑啉-2-硫醇， 二巯基-1,3,4-噻二唑，2-苯并噻唑硫醇或2-苯并咪唑硫醇。 它们可以单独使用或组合使用。