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12 条记录 (耗时 0.017 秒)

    Board mounting method and mounting structure
    1.
    发明申请
    Board mounting method and mounting structure 审中-公开
    板安装方法和安装结构

    公开(公告)号：US20050231929A1

    公开(公告)日：2005-10-20

    申请号：US11166180

    申请日：2005-06-27

    申请人： Yoshihiro Morita ,  Yoshinori Uzuka

    发明人： Yoshihiro Morita ,  Yoshinori Uzuka

    IPC分类号： H05K1/14 ,  H05K1/18 ,  H05K3/36 ,  H05K7/06

    CPC分类号： H05K1/141 ,  H05K1/182 ,  H05K3/366 ,  H05K2201/045 ,  H05K2201/09072 ,  H05K2203/1572

    摘要： A bonded board is formed by bonding at least two boards via an insulation member. A through hole is formed in the bonded board to mount a firs electronic component on one face of the bonded board, and a second electronic component on the other face of the bonded board. The first electronic component and the second electronic component are electrically connected via the through hole.

    摘要翻译： 通过绝缘部件粘合至少两块基板而形成粘合板。 在接合板上形成通孔，以在接合板的一个面上安装第一电子部件，在接合板的另一面上形成第二电子部件。 第一电子部件和第二电子部件经由通孔电连接。

    Spacer, printed circuit board, and electronic equipment
    5.
    发明申请
    Spacer, printed circuit board, and electronic equipment 失效
    隔板，印刷电路板和电子设备

    公开(公告)号：US20050167153A1

    公开(公告)日：2005-08-04

    申请号：US10849523

    申请日：2004-05-20

    申请人： Yoshinori Uzuka ,  Masahiro Suzuki ,  Takeshi Nishiyama ,  Masaki Yoshimaru ,  Hirotoshi Muraishi

    发明人： Yoshinori Uzuka ,  Masahiro Suzuki ,  Takeshi Nishiyama ,  Masaki Yoshimaru ,  Hirotoshi Muraishi

    IPC分类号： H05K1/18 ,  H01G5/10 ,  H05K3/30

    CPC分类号： H05K3/303 ,  H05K3/301 ,  H05K2201/0133 ,  H05K2201/10734 ,  H05K2203/0182 ,  Y02P70/613

    摘要： The spacer is formed as an elastic member with no ends thereof, which is detachably attached, by exploiting its elastic deformation, onto a printed wiring board to which is fixed an electronic component having a component package, on one of whose surfaces connection terminals are arranged. Since the spacer is attached on the printed wiring board to enclose an electronic component so as to seal a gap formed between the electronic component and a printed wiring board, it is possible to prevent foreign objects entering the gap, so that failures, such as insufficient insulation, caused by such foreign objects are also prevented. Since the spacer is easily removed from the printed wiring board, it is recyclable and economical.

    摘要翻译： 间隔件形成为弹性构件，其无端部，通过利用其弹性变形可拆卸地附接到固定有具有部件封装的电子部件的印刷电路板上，其中一个表面上连接端子被布置 。 由于间隔件附着在印刷电路板上以包围电子部件以便密封形成在电子部件和印刷电路板之间的间隙，因此可以防止异物进入间隙，使得诸如不足的故障 也防止了由这种异物引起的绝缘。 由于间隔物容易从印刷线路板上移除，所以可回收利用和经济。

    Printed board unit
    6.
    发明授权
    Printed board unit 有权
    印刷板单元

    公开(公告)号：US06541855B2

    公开(公告)日：2003-04-01

    申请号：US09790697

    申请日：2001-02-23

    申请人： Yoshinori Uzuka

    发明人： Yoshinori Uzuka

    IPC分类号： H01L2310

    CPC分类号： H01L23/4006 ,  H01L2023/4056 ,  H01L2023/4081 ,  H01L2924/0002 ,  H05K3/325 ,  H05K7/1061 ,  H01L2924/00

    摘要： A printed board unit includes a printed board including lands thereon, a semiconductor device unit, and an attachment mechanism to attach the semiconductor device unit to the printed board. The semiconductor device unit includes a heat transfer member, a semiconductor device including first and second surfaces parallel to each other, the first surface having lands thereon, and a socket including contacts protruding from first and second surfaces of the socket, the first and second surfaces being parallel to each other. In the semiconductor device unit, the semiconductor device and the socket are attached to the heat transfer member so that the second surface of the semiconductor device opposes the heat transfer member. The lands of the semiconductor device are electrically connected to the lands of the printed board unit via the contacts of the socket.

    摘要翻译： 印刷电路板单元包括其上包括焊盘的印刷电路板，半导体器件单元和用于将半导体器件单元连接到印刷电路板的附接机构。 半导体器件单元包括传热构件，包括彼此平行的第一和第二表面的半导体器件，第一表面具有其上的焊盘，以及包括从插座的第一和第二表面突出的触点的插座，第一和第二表面 彼此平行。 在半导体器件单元中，半导体器件和插座附接到传热部件，使得半导体器件的第二表面与传热部件相对。 半导体器件的焊盘通过插座的触点电连接到印刷电路板单元的焊盘。

    Electronic device and complex electronic device
    7.
    发明授权
    Electronic device and complex electronic device 有权
    电子设备和复杂电子设备

    公开(公告)号：US08817470B2

    公开(公告)日：2014-08-26

    申请号：US13447515

    申请日：2012-04-16

    申请人： Nobumitsu Aoki ,  Hideo Kubo ,  Yoshinori Uzuka ,  Jun Taniguchi

    发明人： Nobumitsu Aoki ,  Hideo Kubo ,  Yoshinori Uzuka ,  Jun Taniguchi

    IPC分类号： H05K7/20 ,  G06F1/20 ,  G11B33/14

    CPC分类号： H05K7/20727 ,  G11B33/142 ,  H05K7/20736

    摘要： DIMMs to be cooled are mounted in DIMM areas of a printed circuit board of a system board. An air intake port that introduces cooling air is arranged on a side plate of the system board, whereas an air discharge port that discharges the cooling air is arranged on another side plate. The cooling air flows in a direction that is oblique with respect to the side plate. The air intake port is arranged at a position that is offset in the direction in which the cooling air is supplied. Accordingly, cooling is possible by efficiently bringing the cooling air into contact with the DIMMs.

    摘要翻译： 要冷却的DIMM安装在系统板印刷电路板的DIMM区域中。 在系统板的侧板上配置有引入冷气的吸气口，而排出冷气的排气口配置在另一侧板上。 冷却空气相对于侧板倾斜的方向流动。 进气口布置在沿供给冷却空气的方向偏移的位置。 因此，可以通过有效地使冷却空气与DIMM接触来进行冷却。

    Apparatus, mounting structure, inserting and pulling jig, and fixing method
    8.
    发明授权
    Apparatus, mounting structure, inserting and pulling jig, and fixing method 有权
    装置，安装结构，插入和拉动夹具以及固定方法

    公开(公告)号：US08007299B2

    公开(公告)日：2011-08-30

    申请号：US12767353

    申请日：2010-04-26

    申请人： Hajime Murakami ,  Yoshinori Uzuka ,  Eichiro Okumura ,  Takeshi Nishiyama ,  Tatsuya Akashi

    发明人： Hajime Murakami ,  Yoshinori Uzuka ,  Eichiro Okumura ,  Takeshi Nishiyama ,  Tatsuya Akashi

    IPC分类号： H01R13/62

    CPC分类号： H05K7/1007

    摘要： An apparatus includes a first substrate, a first connector disposed on a top face of the first substrate, a to-be-fixed member disposed on a back face of the first substrate, a second substrate disposed facing the first substrate, a second connector disposed on the second substrate and connected to the first connector, and a fixing module disposed on the second substrate and pivoting a locking arm using a rotating shaft, wherein the to-be-fixed member is pushed by a pushing portion provided at a tip of the locking arm when the locking arm is at a first position.

    摘要翻译： 一种装置，包括第一基板，设置在第一基板的顶面上的第一连接器，设置在第一基板的背面上的待固定部件，与第一基板相对设置的第二基板， 在所述第二基板上并连接到所述第一连接器，以及固定模块，其设置在所述第二基板上并且使用旋转轴枢转锁定臂，其中所述待固定构件被设置在所述第二基板的尖端处的推动部分推动 当锁定臂处于第一位置时，锁定臂。

    Spacer, printed circuit board, and electronic equipment
    9.
    发明授权
    Spacer, printed circuit board, and electronic equipment 失效
    隔板，印刷电路板和电子设备

    公开(公告)号：US07573718B2

    公开(公告)日：2009-08-11

    申请号：US10849523

    申请日：2004-05-20

    申请人： Yoshinori Uzuka ,  Masahiro Suzuki ,  Takeshi Nishiyama ,  Masaki Yoshimaru ,  Hirotoshi Muraishi

    发明人： Yoshinori Uzuka ,  Masahiro Suzuki ,  Takeshi Nishiyama ,  Masaki Yoshimaru ,  Hirotoshi Muraishi

    IPC分类号： H05K7/12

    CPC分类号： H05K3/303 ,  H05K3/301 ,  H05K2201/0133 ,  H05K2201/10734 ,  H05K2203/0182 ,  Y02P70/613

    摘要： The spacer is formed as an elastic member with no ends thereof, which is detachably attached, by exploiting its elastic deformation, onto a printed wiring board to which is fixed an electronic component having a component package, on one of whose surfaces connection terminals are arranged. Since the spacer is attached on the printed wiring board to enclose an electronic component so as to seal a gap formed between the electronic component and a printed wiring board, it is possible to prevent foreign objects entering the gap, so that failures, such as insufficient insulation, caused by such foreign objects are also prevented. Since the spacer is easily removed from the printed wiring board, it is recyclable and economical.

    摘要翻译： 间隔件形成为弹性构件，其无端部，通过利用其弹性变形可拆卸地附接到固定有具有部件封装的电子部件的印刷电路板上，其中一个表面上连接端子被布置 。 由于间隔件附着在印刷电路板上以包围电子部件以便密封形成在电子部件和印刷电路板之间的间隙，因此可以防止异物进入间隙，使得诸如不足的故障 也防止了由这种异物引起的绝缘。 由于间隔物容易从印刷线路板上移除，所以可回收利用和经济。