公开(公告)号：US08817470B2

公开(公告)日：2014-08-26

申请号：US13447515

申请日：2012-04-16

申请人： Nobumitsu Aoki ,  Hideo Kubo ,  Yoshinori Uzuka ,  Jun Taniguchi

发明人： Nobumitsu Aoki ,  Hideo Kubo ,  Yoshinori Uzuka ,  Jun Taniguchi

IPC分类号： H05K7/20 ,  G06F1/20 ,  G11B33/14

CPC分类号： H05K7/20727 ,  G11B33/142 ,  H05K7/20736

摘要： DIMMs to be cooled are mounted in DIMM areas of a printed circuit board of a system board. An air intake port that introduces cooling air is arranged on a side plate of the system board, whereas an air discharge port that discharges the cooling air is arranged on another side plate. The cooling air flows in a direction that is oblique with respect to the side plate. The air intake port is arranged at a position that is offset in the direction in which the cooling air is supplied. Accordingly, cooling is possible by efficiently bringing the cooling air into contact with the DIMMs.

摘要翻译： 要冷却的DIMM安装在系统板印刷电路板的DIMM区域中。 在系统板的侧板上配置有引入冷气的吸气口，而排出冷气的排气口配置在另一侧板上。 冷却空气相对于侧板倾斜的方向流动。 进气口布置在沿供给冷却空气的方向偏移的位置。 因此，可以通过有效地使冷却空气与DIMM接触来进行冷却。

公开(公告)号：US07872875B2

公开(公告)日：2011-01-18

申请号：US11867277

申请日：2007-10-04

申请人： Tsuyoshi So ,  Yoshinori Uzuka ,  Osamu Aizawa ,  Hideo Kubo

发明人： Tsuyoshi So ,  Yoshinori Uzuka ,  Osamu Aizawa ,  Hideo Kubo

IPC分类号： H05K7/20

CPC分类号： H05K3/3436 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2924/15311 ,  H01L2924/16152 ,  H05K3/303 ,  H05K2201/0308 ,  H05K2201/2036 ,  H05K2203/306 ,  Y02P70/613 ,  Y10T29/49144

摘要： An electronic part having mounting terminals made of a thermally-meltable bonding material is mounted on a mounting board. A structural part is used for moving a height-adjusting member to a position under the electronic part in a process of heating and melting the thermally-meltable bonding material so as to maintain a predetermined distance between the electronic part and the mounting board.

摘要翻译： 具有由可热熔接合材料制成的安装端子的电子部件安装在安装板上。 结构部件用于在加热和熔化可热熔接合材料的过程中将高度调节构件移动到电子部件下方的位置，以便保持电子部件和安装板之间的预定距离。

公开(公告)号：US08953312B2

公开(公告)日：2015-02-10

申请号：US13445386

申请日：2012-04-12

申请人： Akira Shimasaki ,  Hideo Kubo

发明人： Akira Shimasaki ,  Hideo Kubo

IPC分类号： G06F1/20 ,  H05K7/20

CPC分类号： H05K7/20736

摘要： In a casing, a printed circuit board is arranged such that a first side of the printed circuit board has a first angle of α° with respect to a first side surface plate. A cooling device is arranged to have a second angle of β with respect to the first side surface plate. Accordingly, an amount of cooling air flowing in and out via an air intake port and an air discharge port may be increased. Furthermore, by reducing the angle of the change in the flow direction of the cooling air flowing over the printed circuit board, the cooling air flowing over the printed circuit board may be made to efficiently flow through an air discharge port 119a. Furthermore, the efficiency with which a heat-generating component on the printed circuit board is cooled may be improved.

摘要翻译： 在壳体中，印刷电路板布置成使得印刷电路板的第一侧相对于第一侧面板具有α°的第一角度。 冷却装置被布置成具有第二角度＆bgr; 相对于第一侧面板。 因此，可以增加通过进气口和排气口流入和流出的冷却空气量。 此外，通过减少流过印刷电路板的冷却空气的流动方向的变化的角度，可以使流过印刷电路板的冷却空气有效地流过排气口119a。 此外，可以提高印刷电路板上的发热部件被冷却的效率。

公开(公告)号：US08067515B2

公开(公告)日：2011-11-29

申请号：US12914813

申请日：2010-10-28

申请人： Hideo Kubo ,  Hitoshi Matsumoto ,  Takeshi Shimotori ,  Tooru Kawabe

发明人： Hideo Kubo ,  Hitoshi Matsumoto ,  Takeshi Shimotori ,  Tooru Kawabe

IPC分类号： C08F124/00 ,  C08F120/06 ,  C08G63/08

CPC分类号： C08F220/28 ,  C08F293/005 ,  C08F297/02 ,  C08F297/026

摘要： Disclosed is a method for producing a polymer through living polymerization, comprising forming an oligomer having a polymerization active end, which is an oligomer higher than an average 1.0-mer and lower than an average 4.0-mer or an average 4.0-mer, and polymerizing using the oligomer having a polymerization active end as an initiating species, wherein the acrylic acid-based polymer comprising a repeating unit derived from a poly(α-lower alkyl)acrylate, and a repeating unit derived from an (α-lower alkyl)acrylic ester represented by formula (I) wherein R1 represents a hydrogen atom or a lower alkyl group, and R2 represents an organic group having a polar group in an arm portion.

摘要翻译： 公开了一种通过活性聚合制备聚合物的方法，包括形成具有聚合活性末端的低聚物，其是高于平均1.0聚体且低于平均4.0聚体或平均4.0聚体的低聚物，并且聚合 使用具有聚合活性末端的低聚物作为引发物质，其中包含衍生自聚（α-低级烷基）丙烯酸酯的重复单元的丙烯酸类聚合物和衍生自（α-低级烷基）丙烯酸酯的重复单元 由式（I）表示的酯，其中R 1表示氢原子或低级烷基，R 2表示在臂部分具有极性基团的有机基团。

公开(公告)号：US07999374B2

公开(公告)日：2011-08-16

申请号：US12585704

申请日：2009-09-22

申请人： Tsuyoshi So ,  Hideo Kubo ,  Seiji Ueno ,  Osamu Igawa

发明人： Tsuyoshi So ,  Hideo Kubo ,  Seiji Ueno ,  Osamu Igawa

IPC分类号： H01L23/34 ,  H01L21/60 ,  H01L23/02

CPC分类号： H01L23/3675 ,  H01L23/16 ,  H01L23/36 ,  H01L23/3735 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/0401

摘要： A semiconductor component includes a semiconductor element that has a plurality of signals, a wiring board that is disposed below the semiconductor element and that draws the plurality of signals of the semiconductor element, a heat conduction member that dissipates heat generated by the semiconductor element, a joining member that is disposed between the semiconductor element and the heat conduction member and that joins the heat conduction member to the semiconductor element, a support member formed with an opening so as to surround the semiconductor element that supports the heat conduction member, a first adhesive member that is disposed between the support member and the wiring board to bond the support member with the wiring board and a second adhesive member that is disposed between the support member and the heat conduction member to bond the support member with the heat conduction member.

摘要翻译： 半导体部件包括具有多个信号的半导体元件，配置在半导体元件的下方并且拉出半导体元件的多个信号的布线基板，散发由半导体元件产生的热量的导热部件， 连接构件，其设置在所述半导体元件和所述导热构件之间，并且将所述导热构件接合到所述半导体元件;支撑构件，形成有围绕所述半导体元件的开口，所述支撑构件支撑所述导热构件;第一粘合剂 构件，其设置在所述支撑构件和所述布线板之间，以将所述支撑构件与所述布线板接合;以及第二粘合构件，所述第二粘合构件设置在所述支撑构件和所述导热构件之间，以将所述支撑构件与所述导热构件接合。

公开(公告)号：US07834443B2

公开(公告)日：2010-11-16

申请号：US12222233

申请日：2008-08-05

申请人： Tsuyoshi So ,  Hideo Kubo

发明人： Tsuyoshi So ,  Hideo Kubo

IPC分类号： H01L23/12

CPC分类号： H01L23/36 ,  H01L21/4871 ,  H01L23/42 ,  H01L23/642 ,  H01L25/165 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/19105 ,  H01L2224/0401

摘要： A semiconductor includes a board, a semiconductor element mounted on the board, an electronic component, with the semiconductor element, mounted on the board, a heat radiation member provided so as to face the board, the heat radiation member configured to radiate heat of the semiconductor element, and a thermal connecting member being configured to thermally connect the heat radiation member and the semiconductor element. A metal material is used as the thermal connecting member, and an adhesion preventing member is provided so as to be separated from the electronic component, the adhesion preventing member being configured to prevent the metal material molten and flowing at a heating time being adhered to the electronic component.

摘要翻译： 半导体包括板，安装在板上的半导体元件，安装在板上的半导体元件的电子部件，设置成面向板的散热构件，该散热构件被配置为辐射热 半导体元件和热连接构件，其被配置为热连接所述散热构件和所述半导体元件。 使用金属材料作为热连接构件，并且设置防粘接构件以与电子部件分离，防粘接构件用于防止金属材料在加热时熔化和流动粘附到 电子元件

公开(公告)号：US20100226102A1

公开(公告)日：2010-09-09

申请号：US12706962

申请日：2010-02-17

申请人： Tsuyoshi SO ,  Hideo Kubo ,  Misao Umematsu

发明人： Tsuyoshi SO ,  Hideo Kubo ,  Misao Umematsu

IPC分类号： H05K1/00

CPC分类号： H05K1/0204 ,  H01L23/4006 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/19105 ,  H05K1/0203 ,  H05K1/0271 ,  H05K3/0061 ,  H05K2201/10409 ,  H05K2201/10734 ,  H05K2201/2009 ,  H05K2201/2036 ,  H01L2924/00 ,  H01L2224/0401

摘要： A printed circuit board unit includes a printed wiring board, an electronic component package mounted on a front surface of the printed wiring board, a radiating plate that is placed on an upper surface of the electronic component package, a bolt that has a head and a tip protruding from a back surface of the printed wiring board, and penetrates through the radiating plate and the printed wiring board, a reinforcing plate separated from the back surface of the printed wiring board by a predetermined gap, a stud arranged on a front surface of the reinforcing plate and coupled with the tip of the bolt, and a shock absorbing plate that is arranged between the reinforcing plate and the back surface of the printed wiring board.

摘要翻译： 印刷电路板单元包括印刷线路板，安装在印刷线路板的前表面上的电子部件封装，放置在电子部件封装的上表面上的散热板，具有头部和 从印刷电路板的后表面突出并且穿过散热板和印刷电路板，加强板与印刷电路板的背面隔开预定的间隙;螺柱，其设置在印刷电路板的前表面上 所述加强板与所述螺栓的前端连接，以及设置在所述加强板与所述印刷电路板的背面之间的减震板。

公开(公告)号：US20100013089A1

公开(公告)日：2010-01-21

申请号：US12585704

申请日：2009-09-22

申请人： Tsuyoshi So ,  Hideo Kubo ,  Seiji Ueno ,  Osamu Igawa

发明人： Tsuyoshi So ,  Hideo Kubo ,  Seiji Ueno ,  Osamu Igawa

IPC分类号： H01L23/34 ,  H01L21/60

CPC分类号： H01L23/3675 ,  H01L23/16 ,  H01L23/36 ,  H01L23/3735 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/0401

摘要： A semiconductor component includes a semiconductor element that has a plurality of signals, a wiring board that is disposed below the semiconductor element and that draws the plurality of signals of the semiconductor element, a heat conduction member that dissipates heat generated by the semiconductor element, a joining member that is disposed between the semiconductor element and the heat conduction member and that joins the heat conduction member to the semiconductor element, a support member formed with an opening so as to surround the semiconductor element that supports the heat conduction member, a first adhesive member that is disposed between the support member and the wiring board to bond the support member with the wiring board and a second adhesive member that is disposed between the support member and the heat conduction member to bond the support member with the heat conduction member.

摘要翻译： 半导体部件包括具有多个信号的半导体元件，配置在半导体元件的下方并且拉出半导体元件的多个信号的布线基板，散发由半导体元件产生的热量的导热部件， 连接构件，其设置在所述半导体元件和所述导热构件之间，并且将所述导热构件接合到所述半导体元件;支撑构件，形成有围绕所述半导体元件的开口，所述支撑构件支撑所述导热构件;第一粘合剂 构件，其设置在所述支撑构件和所述布线板之间，以将所述支撑构件与所述布线板接合;以及第二粘合构件，所述第二粘合构件设置在所述支撑构件和所述导热构件之间，以将所述支撑构件与所述导热构件接合。

公开(公告)号：US20060146503A1

公开(公告)日：2006-07-06

申请号：US11262999

申请日：2005-10-28

申请人： Hideo Kubo

发明人： Hideo Kubo

IPC分类号： H05K7/20

CPC分类号： H01L23/42 ,  H01L23/04 ,  H01L23/3675 ,  H01L23/4006 ,  H01L2023/405 ,  H01L2023/4056 ,  H01L2023/4062 ,  H01L2023/4068 ,  H01L2023/4081 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/1616 ,  H01L2924/19105 ,  H01L2224/0401

摘要： A heat spreading member is received on a predetermined surface of an electronic component. The heat spreading member extends larger than the predetermined surface. A contact piece is contacted with the heat spreading member over a contact area smaller than the predetermined surface. The contact piece serves to realize concentration of an urging force applied to the heat spreading member. The heat spreading member is thus reliably urged against the electronic component. The concentration of the urging force serves to prevent the heat spreading member and the electronic component from camber even if heat is applied to the heat spreading member and the electronic component. Separation is thus avoided between the heat spreading member and the electronic component. The heat spreading member reliably keeps contacting with the electronic component, so that the electronic component package is allowed to enjoy improvement in heat radiation.

公开(公告)号：US07007506B2

公开(公告)日：2006-03-07

申请号：US10837651

申请日：2004-05-04

申请人： Hideo Kubo ,  Hisashi Kawashima ,  Jie Wei ,  Junichi Ishimine ,  Masahiro Suzuki ,  Yoshiaki Udagawa ,  Masahiro Mochizuki

发明人： Hideo Kubo ,  Hisashi Kawashima ,  Jie Wei ,  Junichi Ishimine ,  Masahiro Suzuki ,  Yoshiaki Udagawa ,  Masahiro Mochizuki

IPC分类号： F25B39/02

CPC分类号： F28D15/0266 ,  F25B39/02 ,  F25B2600/21 ,  F25D19/006 ,  F28F3/12 ,  F28F13/06 ,  H01L23/427 ,  H01L23/467 ,  H01L2924/0002 ,  H05K7/20309 ,  H01L2924/00

摘要： A refrigeration system allows the refrigerant to circulate through a closed circulation channel. A dry evaporator is incorporated in the circulation channel. The dry evaporator is designed to keep a quality smaller than 1.0 in evaporating the refrigerant. The quantity of heat transfer per unit area, namely, a heat transfer coefficient depends on the quality. The heat transfer coefficient remarkably drops when the quality of the refrigerant exceeds a predetermined threshold level before the quality actually reaches 1.0. The quality of the refrigerant kept below the predetermined threshold level during vaporization of the refrigetant in the dry evaporator allows a reliable establishment of a higher performance of cooling. On the other hand, if a refrigerant completely evaporates in a dry evaporator in a conventional manner, the heat transfer coefficient of the refrigerant remarkably drops after the quality of the refrigerant exceeds the predetermined threshold level. Accordingly, the conventional dry evaporator is forced to absorb heat at a lower heat transfer coefficient, as compared with the present dry evaporator.

摘要翻译： 制冷系统允许制冷剂循环通过封闭的循环通道。 干燥蒸发器结合在循环通道中。 干蒸发器设计成在蒸发制冷剂时保持小于1.0的质量。 每单位面积的传热量，即传热系数取决于质量。 当质量实际达到1.0之前制冷剂的质量超过预定阈值水平时，传热系数显着下降。 在干燥蒸发器中的冷凝器蒸发期间，制冷剂的质量保持在预定阈值水平以下，可以可靠地建立更高的冷却性能。 另一方面，如果制冷剂在干式蒸发器中以常规方式完全蒸发，则在制冷剂的质量超过预定阈值水平之后，制冷剂的传热系数显着下降。 因此，与本发明的干式蒸发器相比，传统的干式蒸发器被迫以较低的传热系数吸收热量。