公开(公告)号：US3972063A

公开(公告)日：1976-07-27

申请号：US513924

申请日：1974-10-10

申请人： Yoshio Kimura ,  Hiroshi Mitsuoka ,  Isamu Hosono

发明人： Yoshio Kimura ,  Hiroshi Mitsuoka ,  Isamu Hosono

IPC分类号： H01L23/40 ,  H01L23/427 ,  H01L23/48 ,  H01L25/04 ,  H01L23/42 ,  H01L23/44 ,  H01L23/46

CPC分类号： H01L23/427 ,  H01L23/4006 ,  H01L24/72 ,  H01L2023/4025 ,  H01L2023/4081 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01082

摘要： A stack including a semiconductor element and the associated components is held within a lower portion of a hermetic envelope between its side wall and a closure block movably secured to its opposite side wall to close an opening on the latter and is immersed into a cooling liquid boilable adjacent the operating temperature of the semiconductor element. A pressing plate fixed to the opposite side wall resiliently presses the closure block to apply a compressible contact force to the semiconductor element. The stack may be sandwiched between two closure blocks closing the opposite opening on the bilateral walls of the lower envelope portion and pressed toward each other by two spherical segment of resilient material arranged back-to-back. Alternatively the stack may be carried between the bilateral envelope walls through a resilient spherical segment.

摘要翻译： 包括半导体元件和相关部件的堆叠被保持在其侧壁和可移动地固定到其相对侧壁的封闭块之间的密封外壳的下部，以封闭其上的开口并且被浸入冷却液体可煮沸 邻近半导体元件的工作温度。 固定到相对侧壁的按压板弹性地按压封闭块，以对半导体元件施加可压缩的接触力。 堆叠可以夹在两个闭合块之间，封闭块封闭下部信封部分的双侧壁上的相对的开口，并通过背对背布置的两个弹性材料的球形部分彼此挤压。 或者，堆叠可以通过弹性球形段在双向包络壁之间承载。

公开(公告)号：US3996604A

公开(公告)日：1976-12-07

申请号：US545346

申请日：1975-01-30

申请人： Yoshio Kimura ,  Hiroshi Mitsuoka

发明人： Yoshio Kimura ,  Hiroshi Mitsuoka

IPC分类号： F25D9/00 ,  G12B15/02 ,  H01L23/40 ,  H01L23/427 ,  H01L23/44 ,  H02M7/04 ,  H01L25/04 ,  H01L23/42 ,  H01L23/46

CPC分类号： H01L23/4006 ,  H01L23/427 ,  H01L2023/4025 ,  H01L2023/4081 ,  H01L2924/0002

摘要： A vapor cooled semiconductor device which comprises an envelope having at least one aperture, at least one semiconductor element enclosed therein, an electrode contacting the semiconductor element and exposed across the aperture of the envelope, an expandable diaphragm disposed through an insulator between the electrode and the wall of the envelope to seal the gap therebetween, spherical spring plates disposed outside the envelope and arranged to support the semiconductor element through the electrode under pressure, and a liquid coolant enclosed in the closed envelope, with space provided therein, whereby the semiconductor element may be cooled by the latent heat of vaporization of the liquid coolant.

摘要翻译： 一种蒸汽冷却的半导体器件，其包括具有至少一个孔的外壳，封装在其中的至少一个半导体元件，与半导体元件接触并暴露于外壳的孔的电极，可扩张的隔膜，其设置成穿过电极和 密封其间的间隙的球形弹簧板，设置在外壳外部并且布置成在压力下支撑半导体元件通过电极，以及封闭在封闭的外壳中的液体冷却剂，其中设置有空间，由此半导体元件可以 被液体冷却剂的蒸发潜热所冷却。

公开(公告)号：US3980133A

公开(公告)日：1976-09-14

申请号：US487650

申请日：1974-07-11

申请人： Hiroshi Mitsuoka ,  Yoshio Kimura

发明人： Hiroshi Mitsuoka ,  Yoshio Kimura

IPC分类号： H01L23/44 ,  F28D15/02 ,  H01L23/427 ,  F28D15/00

CPC分类号： F28D15/025 ,  H01L23/427 ,  H01L2924/0002

摘要： A heat transferring apparatus comprising an evaporator and a condensor disposed thereabove, a conduit connecting the evaporator and condensor, and a plurality of fine fabric tubes made of glass fiber or the like disposed in the conduit, the tube walls being permeable to the coolant liquid phase of a coolant being used for cooling an electric or heat generating device in the evaporator, wherein a coolant gas vaporized by the latent heat of gasification in the evaporator is fed to the condensor through the conduit by the increasing pressure caused by the gasification and the coolant gas is then condensed by discharging the latent heat in the condensor, the condensed coolant liquid flowing down into the evaporator under force of gravity and this cycle is repeated to cool the electric or heat generating device. The feedback of the condensed coolant liquid is smoothly performed because of the permeable fabric tube in the conduit allowing the liquid coolant supported above the upflowing gas to permeate thereinto whereby frictional contact between the liquid and gas coolant phases is precluded and the liquid coolant is able to be returned freely through the fabric tubes to the evaporator.

摘要翻译： 一种传热装置，包括蒸发器和设置在其上方的冷凝器，连接蒸发器和冷凝器的导管以及设置在导管中的由玻璃纤维等制成的多个精细织物管，管壁可透过冷却剂液相 用于冷却蒸发器中的电力或发热装置的冷却剂，其中由蒸发器中的气化潜热蒸发的冷却剂气体通过由气化和冷却剂引起的增加的压力通过导管供给到冷凝器 然后通过排出冷凝器中的潜热来冷凝气体，冷凝的冷却剂液体在重力作用下向下流入蒸发器，并且重复该循环以冷却电或发热装置。 由于导管中的可渗透的织物管允许支撑在上流气体上方的液体冷却剂渗入其中，所以冷凝的冷却剂液体的反馈平稳地进行，从而排除了液体和气体冷却剂相之间的摩擦接触，并且液体冷却剂能够 通过织物管自由返回到蒸发器。

公开(公告)号：US20100326353A1

公开(公告)日：2010-12-30

申请号：US12855524

申请日：2010-08-12

申请人： Masami AKIMOTO ,  Shinichi Hayashi ,  Yasushi Hayashida ,  Nobuaki Matsuoka ,  Yoshio Kimura ,  Issei Ueda ,  Hikaru Ito

发明人： Masami AKIMOTO ,  Shinichi Hayashi ,  Yasushi Hayashida ,  Nobuaki Matsuoka ,  Yoshio Kimura ,  Issei Ueda ,  Hikaru Ito

IPC分类号： B05C9/12

CPC分类号： H01L21/67184 ,  H01L21/67173 ,  H01L21/67178 ,  H01L21/67207 ,  H01L21/67745

摘要： Provided is a coating and developing apparatus composed of an assembly of plural unit blocks. A first unit-block stack and a second unit-block stack are arranged at different positions with respect to front-and-rear direction. Unit blocks for development, each of which comprises plural processing units including a developing unit that performs developing process after exposure and a transfer device that transfers a substrate among the processing units, are arranged at the lowermost level. Unit blocks for application, or coating, each of which comprises plural processing units including a coating unit that performs application process before exposure and a transfer device that transfers a substrate among the processing units, are arranged above the unit blocks for development. Unit blocks for application are arranged in both the first and second unit-block stacks. Unit blocks for application which a wafer goes through are determined depending on the layering positional relationship between an antireflective film and a resist film. An exposed wafer goes only through the unit block for development without going through any one of the unit blocks for application.

公开(公告)号：US20100277755A1

公开(公告)日：2010-11-04

申请号：US12836395

申请日：2010-07-14

申请人： Yoshio Kimura ,  Yushi Matsukubo ,  Fumio Mikami ,  Yoshinobu Umeda ,  Tadashi Kawaguchi ,  Hiroshi Uchikawa ,  Yasuhiko Hirano ,  Hitoshi Imai ,  Hiroyasu Morita

发明人： Yoshio Kimura ,  Yushi Matsukubo ,  Fumio Mikami ,  Yoshinobu Umeda ,  Tadashi Kawaguchi ,  Hiroshi Uchikawa ,  Yasuhiko Hirano ,  Hitoshi Imai ,  Hiroyasu Morita

IPC分类号： G06K15/02 ,  H04L9/28

CPC分类号： H04N1/44 ,  H04L9/0822 ,  H04N1/00236 ,  H04N2201/0039 ,  H04N2201/0094

摘要： An information processing apparatus connected to a printing apparatus via a network encrypts print data if identification information is input, and does not encrypt print data if identification information is not input. If identification information is input and the print data has been encrypted, the information processing apparatus sends a print job including the encrypted print data to the printing apparatus via the network; otherwise, the information processing apparatus sends unencrypted print data to the printing apparatus via the network.

摘要翻译： 经由网络连接到打印装置的信息处理装置如果输入了识别信息则对打印数据进行加密，如果未输入识别信息，则不对打印数据进行加密。 如果输入了识别信息并且打印数据已被加密，则信息处理设备经由网络将包含加密的打印数据的打印作业发送到打印设备; 否则，信息处理装置经由网络向打印装置发送未加密的打印数据。

公开(公告)号：US07797855B2

公开(公告)日：2010-09-21

申请号：US11505810

申请日：2006-08-18

申请人： Tetsuo Fukuoka ,  Masami Akimoto ,  Takahiro Kitano ,  Yoshio Kimura ,  Shinichi Hayashi ,  Hikaru Ito

发明人： Tetsuo Fukuoka ,  Masami Akimoto ,  Takahiro Kitano ,  Yoshio Kimura ,  Shinichi Hayashi ,  Hikaru Ito

IPC分类号： F26B21/06

CPC分类号： C30B33/02 ,  C30B35/00 ,  H01L21/67098 ,  H01L21/67748

摘要： A heating apparatus 2 comprises a housing 20; a flat heating chamber 4 which is provided in the housing 2 and adapted to heat a wafer W used as a substrate, with one side of the heating chamber 4 opening for carrying in and carrying out the wafer; and a heating plates 44, 45 provided in the heating chamber 4 such that the wafer W can be heated from both above and below. A cooling plate 3 is provided in the housing 20 located in the vicinity of the opening of the heating chamber 4, for cooling the wafer W after being heated by the heating plates 44, 45. Additionally, a carrying means is provided in the housing 20 for carrying the wafer W between an upper position of the cooling plate 3 and the interior of the heating chamber 4 such that a heat treatment for the wafer W can be performed with the wafer W being held in the heating chamber 4.

摘要翻译： 加热装置2包括壳体20; 平面加热室4，其设置在壳体2中并且适于加热用作基板的晶片W，加热室4的一侧开口用于承载和执行晶片; 以及设置在加热室4中的加热板44,45，使得晶片W能够从上下两者加热。 冷却板3设置在位于加热室4的开口附近的壳体20中，用于在被加热板44,45加热之后冷却晶片W.此外，在壳体20中设置有承载装置 用于在冷却板3的上部位置和加热室4的内部之间承载晶片W，使得可以在将晶片W保持在加热室4中的情况下进行晶片W的热处理。

公开(公告)号：US07793609B2

公开(公告)日：2010-09-14

申请号：US11342616

申请日：2006-01-31

申请人： Masami Akimoto ,  Shinichi Hayashi ,  Yasushi Hayashida ,  Nobuaki Matsuoka ,  Yoshio Kimura ,  Issei Ueda ,  Hikaru Ito

发明人： Masami Akimoto ,  Shinichi Hayashi ,  Yasushi Hayashida ,  Nobuaki Matsuoka ,  Yoshio Kimura ,  Issei Ueda ,  Hikaru Ito

IPC分类号： B05C5/02

CPC分类号： H01L21/67184 ,  H01L21/67173 ,  H01L21/67178 ,  H01L21/67207 ,  H01L21/67745

摘要： Provided is a coating and developing apparatus composed of an assembly of plural unit blocks. A first unit-block stack and a second unit-block stack are arranged at different positions with respect to front-and-rear direction. Unit blocks for development, each of which comprises plural processing units including a developing unit that performs developing process after exposure and a transfer device that transfers a substrate among the processing units, are arranged at the lowermost level. Unit blocks for application, or coating, each of which comprises plural processing units including a coating unit that performs application process before exposure and a transfer device that transfers a substrate among the processing units, are arranged above the unit blocks for development. Unit blocks for application are arranged in both the first and second unit-block stacks. Unit blocks for application which a wafer goes through are determined depending on the layering positional relationship between an antireflective film and a resist film. An exposed wafer goes only through the unit block for development without going through any one of the unit blocks for application.

摘要翻译： 提供一种由多个单元块组成的涂层显影装置。 第一单位块堆叠和第二单位块堆叠被布置在相对于前后方向的不同位置。 用于显影的单元块，每个包括多个处理单元，包括执行曝光之后的显影处理的显影单元和在处理单元之间传送基板的转印装置布置在最下层。 用于应用或涂布的单元块包括多个处理单元，其包括在曝光之前进行施加处理的涂布单元和在处理单元之间传送基板的转印装置，布置在用于显影的单位块上方。 用于应用的单元块被布置在第一和第二单元块堆叠中。 根据防反射膜和抗蚀剂膜之间的层叠位置关系确定晶片通过的应用单元块。 暴露的晶片仅通过单元块进行开发，而不经过用于应用的单元块中的任何一个。

公开(公告)号：US07782477B2

公开(公告)日：2010-08-24

申请号：US11041067

申请日：2005-01-21

申请人： Yoshio Kimura ,  Yushi Matsukubo ,  Fumio Mikami ,  Yoshinobu Umeda ,  Tadashi Kawaguchi ,  Hiroshi Uchikawa ,  Yasuhiko Hirano ,  Hitoshi Imai ,  Hiroyasu Morita

发明人： Yoshio Kimura ,  Yushi Matsukubo ,  Fumio Mikami ,  Yoshinobu Umeda ,  Tadashi Kawaguchi ,  Hiroshi Uchikawa ,  Yasuhiko Hirano ,  Hitoshi Imai ,  Hiroyasu Morita

IPC分类号： G06F15/00 ,  B41J1/00

CPC分类号： H04N1/44 ,  H04L9/0822 ,  H04N1/00236 ,  H04N2201/0039 ,  H04N2201/0094

摘要： An information processing apparatus connected to a printing apparatus via a network encrypts print data if identification information is input, and does not encrypt print data if identification information is not input. If identification information is input and the print data has been encrypted, the information processing apparatus sends a print job including the encrypted print data to the printing apparatus via the network; otherwise, the information processing apparatus sends unencrypted print data to the printing apparatus via the network.

摘要翻译： 经由网络连接到打印装置的信息处理装置如果输入了识别信息则对打印数据进行加密，如果未输入识别信息，则不对打印数据进行加密。 如果输入了识别信息并且打印数据已被加密，则信息处理设备经由网络将包含加密的打印数据的打印作业发送到打印设备; 否则，信息处理装置经由网络向打印装置发送未加密的打印数据。

公开(公告)号：US20100047702A1

公开(公告)日：2010-02-25

申请号：US12610907

申请日：2009-11-02

申请人： Kunie OGATA ,  Koki Nishimuko ,  Hiroshi Tomita ,  Yoshio Kimura ,  Ryouichi Uemura ,  Michio Tanaka

发明人： Kunie OGATA ,  Koki Nishimuko ,  Hiroshi Tomita ,  Yoshio Kimura ,  Ryouichi Uemura ,  Michio Tanaka

IPC分类号： G03F7/20 ,  G03B27/32

CPC分类号： H01L21/67253 ,  G03F7/162 ,  G03F7/3021 ,  H01L21/6715

摘要： A resist pattern forming method using a coating and developing apparatus and an aligner being connected thereto which are controlled to form a resist film on a surface of a substrate with a base film and a base pattern formed thereon, followed by inspecting at least one of a plurality of measurement items selected from: reflection ratio and film thickness of the base film and the resist film, line width after a development, an accuracy that the base pattern matches with a resist pattern, a defect on the surface after the development, etc. A parameter subject to amendment is selected based on corresponding data of each measurement item, such as the film thickness of the resist and the line width after the development, and amendment of the parameter is performed. This results in a reduced workload of an operator, and the appropriate amendment can be performed.

摘要翻译： 使用涂覆和显影装置和对准器连接的抗蚀剂图案形成方法被控制以在其上形成有基膜和基底图案的基板的表面上形成抗蚀剂膜，然后检查至少一个 选自以下的多个测量项目：基膜和抗蚀剂膜的反射率和膜厚度，显影后的线宽度，基底图案与抗蚀剂图案匹配的精度，显影后的表面上的缺陷等。 基于每个测量项目的对应数据（例如抗蚀剂的膜厚度和显影后的线宽度）来选择修改参数，并且修改参数。 这导致操作者的工作量减少，并且可以执行适当的修改。

公开(公告)号：US07281869B2

公开(公告)日：2007-10-16

申请号：US11335635

申请日：2006-01-20

申请人： Masami Akimoto ,  Shinichi Hayashi ,  Yasushi Hayashida ,  Nobuaki Matsuoka ,  Yoshio Kimura ,  Issei Ueda ,  Hikaru Ito

发明人： Masami Akimoto ,  Shinichi Hayashi ,  Yasushi Hayashida ,  Nobuaki Matsuoka ,  Yoshio Kimura ,  Issei Ueda ,  Hikaru Ito

IPC分类号： G03B5/00

CPC分类号： H01L21/67184 ,  H01L21/00 ,  H01L21/6715 ,  H01L21/67178 ,  H01L21/6719

摘要： A coating and developing system includes a resist film forming unit block and antireflection film forming unit blocks stacked up in layers to form a resist film and an antireflection film underlying the resist film and an antireflection film overlying the resist film in a small space. The coating and developing system can cope with a case where antireflection films are formed and a case where any antireflection film is not formed. Film forming unit blocks, namely, a TCT layer, a COT layer and a BCT layer, and developing unit blocks, namely, DEV layers, are stacked up in layers in a processing block. The TCT layer, the COT layer and the BCT layer are used selectively in the case where antireflection films are formed and where no antireflection film is formed. The coating and developing system is controlled by a simple carrying program.

摘要翻译： 涂覆显影系统包括：抗蚀剂膜形成单元块和层叠的抗反射膜形成单元块，以形成抗蚀剂膜和抗反射膜下面的抗反射膜以及在小空间中覆盖抗蚀剂膜的抗反射膜。 涂覆和显影系统可以应对形成防反射膜的情况以及没有形成任何抗反射膜的情况。 成膜单位块，即TCT层，COT层和BCT层，以及显影单元块，即DEV层，在处理块中层叠。 在形成防反射膜并且不形成抗反射膜的情况下，TCT层，COT层和BCT层被选择性地使用。 涂层和显影系统由简单的携带程序控制。