摘要:
A polyimide precursor for obtaining a polyimide film having excellent adhesiveness to metals and improved transmittance in the UV-visible range, a polyimide in which the polyimide precursor is used, a polyimide film in which the polyimide is used, and a method for manufacturing a triazine compound used for manufacturing the polyimide precursor, polyimide film and polyimide.
摘要:
Disclosed are a polyimide precursor for obtaining a polyimide film having excellent adhesiveness to metals and improved transmittance in the UV-visible range, a polyimide in which the polyimide precursor is used, a polyimide film in which the polyimide is used, and a method for manufacturing triazine compound used for manufacturing these. The polyimide precursor contains a structural unit represented by general formula (I): in which A is a tetravalent aromatic group or aliphatic group and B is a divalent aromatic group, wherein B in general formula (I) comprises a triazine moiety represented by following formula (B1): in which R1 denotes hydrogen or alkyl or aryl having 1 to 12 carbon atoms, and R2 denotes hydrogen or alkyl or aryl having 1 to 12 carbon atoms.
摘要:
A polyimide film having improved adhesiveness is produced by flow-casting a solution of a polyamic acid, which is prepared by reacting a tetracarboxylic acid component and a diamine component, on a support, and drying the solution to form a self-supporting film; applying a solution containing a surface treatment agent to one side or both sides of the self-supporting film, wherein the solvent of the surface treatment agent solution is a water-soluble liquid and has a surface tension of 32 mN/m or less at 20° C. and a boiling point of 125° C. or higher; and heating the self-supporting film to provide a polyimide film.
摘要:
A method for manufacturing a polyimide-metal laminate including forming a polyimide film, in which at least surfaces of both sides of the film are formed by thermally fusion-bondable polyimide layers (a), and thermal compression-bonding metal layers on both sides of the polyimide film; in which forming the polyimide film includes reacting a tetracarboxylic dianhydride component with a diamine component containing a diamine compound represented by general formula (1) to give a solution of a polyamic acid (a), forming a self-supporting film from the solution of the polyamic acid (a) and imidizing the self-supporting film by heating at a maximum heating temperature of 440° C. or lower to form the polyimide layer (a); in which R1 represents hydrogen or alkyl or aryl having 1 to 12 carbon atoms; and R2 represents hydrogen or alkyl or aryl having 1 to 12 carbon atoms.
摘要:
A method for manufacturing a polyimide-metal laminate including forming a polyimide film, in which at least surfaces of both sides of the film are formed by thermally fusion-bondable polyimide layers (a), and thermal compression-bonding metal layers on both sides of the polyimide film; in which forming the polyimide film includes reacting a tetracarboxylic dianhydride component with a diamine component containing a diamine compound represented by general formula (1) to give a solution of a polyamic acid (a), forming a self-supporting film from the solution of the polyamic acid (a) and imidizing the self-supporting film by heating at a maximum heating temperature of 440° C. or lower to form the polyimide layer (a); in which R1 represents hydrogen or alkyl or aryl having 1 to 12 carbon atoms; and R2 represents hydrogen or alkyl or aryl having 1 to 12 carbon atoms.
摘要:
Disclosed is a polyimide film having improved adhesiveness to an adhesive and/or adherence to a metal layer. The polyimide film has at least a polyimide layer (b) and a polyimide layer (a) formed contacting the polyimide layer (b), wherein the polyimide layer (a) is a polyimide formed from a tetracarboxylic dianhydride component and a diamine component containing a diamine compound represented by general formula (1): wherein R1 denotes a hydrogen atom, an alkyl group having 1 to 12 carbon atoms or an aryl group, and R2 denotes an alkyl group having 1 to 12 carbon atoms or an aryl group.
摘要:
A polyimide film, which is produced by the reaction of a tetracarboxylic acid component comprising 3,3′,4,4′-biphenyltetracarboxylic dianhydride as the main component and a diamine component comprising p-phenylenediamine as the main component, is heated at a temperature of from 460° C. to 550° C., and then water or an alkaline aqueous solution is sprayed on a surface of the polyimide film for surface treatment, thereby improving adhesiveness, while maintaining the excellent properties inherent in the polyimide film.
摘要:
A polyimide film, which is produced by the reaction of a tetracarboxylic acid component comprising 3,3′,4,4′-biphenyltetracarboxylic dianhydride as the main component and a diamine component comprising p-phenylenediamine as the main component, is heated at a temperature of from 460° C. to 550° C., and then water or an alkaline aqueous solution is sprayed on a surface of the polyimide film for surface treatment, thereby improving adhesiveness, while maintaining the excellent properties inherent in the polyimide film.
摘要:
A polyimide obtained by reacting a tetracarboxylic acid component with a diamine component containing a diamine compound represented by the following general formula (1): wherein, A represents a biphenylene group which may be substituted with an alkyl group having up to 4 carbon atoms.
摘要:
Disclosed is a polyimide film prepared from an aromatic tetracarboxylic acid component consisting essentially of 3,3′,4,4′-biphenyltetracarboxylic dianhydride and an aromatic diamine component consisting essentially of not less than 65 mol phenylenediamine % but less than 97 mol % of p-phenylenediamine and not less than 3 mol % but less than 35 mol % of 2,4-toluenediamine.