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    LIGHT-EMITTING DEVICE
    1.
    发明申请
    LIGHT-EMITTING DEVICE 有权
    发光装置

    公开(公告)号：US20090026485A1

    公开(公告)日：2009-01-29

    申请号：US11993956

    申请日：2006-06-30

    申请人： Youji Urano ,  Takuya Nakatani ,  Yasuhiro Hidaka

    发明人： Youji Urano ,  Takuya Nakatani ,  Yasuhiro Hidaka

    IPC分类号： H01L33/00

    CPC分类号： H01L33/483 ,  F21K9/00 ,  F21V21/30 ,  F21Y2105/00 ,  F21Y2115/10 ,  H01L33/58 ,  H01L33/62 ,  H01L33/64 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/00014

    摘要： A light-emitting device of the present invention includes: a LED chip 10; a chip mounting member 70 having a conductive plate (heat transfer plate) 71 one surface side of which the LED chip 10 is mounted on and a conductor patterns 73, 73 which is formed on the one surface side of the conductive plate 71 through an insulating part 72 and electrically connected to the LED chip 10; and a sheet-shaped connecting member 80 disposed on the other surface side of the conductive plate 71 to connect the conductive plate 71 to a body of the luminaire 90 which is a metal member for holding the chip mounting member 70. The connecting member 80 is made of a resin sheet which includes a filler and whose viscosity is reduced by heating, and the connecting member 80 has an electrical insulating property and thermally connects the conductive plate 71 and the body 90 of the luminaire to each other.

    摘要翻译： 本发明的发光装置包括：LED芯片10; 具有其一个表面侧安装有LED芯片10的导电板（传热板）71的芯片安装构件70和通过绝缘体形成在导电板71的一个表面侧上的导体图案73,73 部分72并且电连接到LED芯片10; 以及布置在导电板71的另一个表面侧上的片状连接件80，以将导电板71连接到作为用于保持芯片安装部件70的金属部件的照明器90的主体。连接部件80是 由包含填料的树脂片制成，其粘度通过加热而降低，并且连接构件80具有电绝缘性能，并且将导电板71和照明器的主体90彼此热连接。

    Light-emitting device
    2.
    发明授权
    Light-emitting device 有权
    发光装置

    公开(公告)号：US07800124B2

    公开(公告)日：2010-09-21

    申请号：US11993956

    申请日：2006-06-30

    申请人： Youji Urano ,  Takuya Nakatani ,  Yasuhiro Hidaka

    发明人： Youji Urano ,  Takuya Nakatani ,  Yasuhiro Hidaka

    IPC分类号： H01L33/00

    CPC分类号： H01L33/483 ,  F21K9/00 ,  F21V21/30 ,  F21Y2105/00 ,  F21Y2115/10 ,  H01L33/58 ,  H01L33/62 ,  H01L33/64 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/00014

    摘要： A light-emitting device of the present invention includes: a LED chip 10; a chip mounting member 70 having a conductive plate (heat transfer plate) 71 one surface side of which the LED chip 10 is mounted on and a conductor patterns 73, 73 which is formed on the one surface side of the conductive plate 71 through an insulating part 72 and electrically connected to the LED chip 10; and a sheet-shaped connecting member 80 disposed on the other surface side of the conductive plate 71 to connect the conductive plate 71 to a body of the luminaire 90 which is a metal member for holding the chip mounting member 70. The connecting member 80 is made of a resin sheet which includes a filler and whose viscosity is reduced by heating, and the connecting member 80 has an electrical insulating property and thermally connects the conductive plate 71 and the body 90 of the luminaire to each other.

    摘要翻译： 本发明的发光装置包括：LED芯片10; 具有其一个表面侧安装有LED芯片10的导电板（传热板）71的芯片安装构件70和通过绝缘体形成在导电板71的一个表面侧上的导体图案73,73 部分72并且电连接到LED芯片10; 以及布置在导电板71的另一个表面侧上的片状连接件80，以将导电板71连接到作为用于保持芯片安装部件70的金属部件的照明器90的主体。连接部件80是 由包含填料的树脂片制成，其粘度通过加热而降低，并且连接构件80具有电绝缘性能，并且将导电板71和照明器的主体90彼此热连接。

    Light-emitting device
    3.
    发明授权
    Light-emitting device 有权
    发光装置

    公开(公告)号：US08044424B2

    公开(公告)日：2011-10-25

    申请号：US12856775

    申请日：2010-08-16

    申请人： Youji Urano ,  Takuya Nakatani ,  Yasuhiro Hidaka

    发明人： Youji Urano ,  Takuya Nakatani ,  Yasuhiro Hidaka

    IPC分类号： H01L33/00

    CPC分类号： H01L33/483 ,  F21K9/00 ,  F21V21/30 ,  F21Y2105/00 ,  F21Y2115/10 ,  H01L33/58 ,  H01L33/62 ,  H01L33/64 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/00014

    摘要： A light-emitting device of the present invention includes: a LED chip 10; a chip mounting member 70 having a conductive plate (heat transfer plate) 71 one surface side of which the LED chip 10 is mounted on and a conductor patterns 73, 73 which is formed on the one surface side of the conductive plate 71 through an insulating part 72 and electrically connected to the LED chip 10; and a sheet-shaped connecting member 80 disposed on the other surface side of the conductive plate 71 to connect the conductive plate 71 to a body of the luminaire 90 which is a metal member for holding the chip mounting member 70. The connecting member 80 is made of a resin sheet which includes a filler and whose viscosity is reduced by heating, and the connecting member 80 has an electrical insulating property and thermally connects the conductive plate 71 and the body 90 of the luminaire to each other.

    摘要翻译： 本发明的发光装置包括：LED芯片10; 具有其一个表面侧安装有LED芯片10的导电板（传热板）71的芯片安装构件70和通过绝缘体形成在导电板71的一个表面侧上的导体图案73,73 部分72并且电连接到LED芯片10; 以及布置在导电板71的另一个表面侧上的片状连接件80，以将导电板71连接到作为用于保持芯片安装部件70的金属部件的照明器90的主体。连接部件80是 由包含填料的树脂片制成，其粘度通过加热而降低，并且连接构件80具有电绝缘性能，并且将导电板71和照明器的主体90彼此热连接。

    Light-emitting device
    4.
    发明授权
    Light-emitting device 有权

    公开(公告)号：US07960751B2

    公开(公告)日：2011-06-14

    申请号：US12856775

    申请日：2010-08-16

    申请人： Youji Urano ,  Takuya Nakatani ,  Yasuhiro Hidaka

    发明人： Youji Urano ,  Takuya Nakatani ,  Yasuhiro Hidaka

    IPC分类号： H01L33/00

    摘要： A light-emitting device of the present invention includes: a LED chip 10; a chip mounting member 70 having a conductive plate (heat transfer plate) 71 one surface side of which the LED chip 10 is mounted on and a conductor patterns 73, 73 which is formed on the one surface side of the conductive plate 71 through an insulating part 72 and electrically connected to the LED chip 10; and a sheet-shaped connecting member 80 disposed on the other surface side of the conductive plate 71 to connect the conductive plate 71 to a body of the luminaire 90 which is a metal member for holding the chip mounting member 70. The connecting member 80 is made of a resin sheet which includes a filler and whose viscosity is reduced by heating, and the connecting member 80 has an electrical insulating property and thermally connects the conductive plate 71 and the body 90 of the luminaire to each other.

    LIGHT-EMITTING DEVICE
    6.
    发明申请
    LIGHT-EMITTING DEVICE 有权
    发光装置

    公开(公告)号：US20100301373A1

    公开(公告)日：2010-12-02

    申请号：US12856775

    申请日：2010-08-16

    申请人： Youji Urano ,  Takuya Nakatani ,  Yasuhiro Hidaka

    发明人： Youji Urano ,  Takuya Nakatani ,  Yasuhiro Hidaka

    IPC分类号： H01L33/50 ,  H01L33/58

    CPC分类号： H01L33/483 ,  F21K9/00 ,  F21V21/30 ,  F21Y2105/00 ,  F21Y2115/10 ,  H01L33/58 ,  H01L33/62 ,  H01L33/64 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/00014

    摘要： A light-emitting device of the present invention includes: a LED chip 10; a chip mounting member 70 having a conductive plate (heat transfer plate) 71 one surface side of which the LED chip 10 is mounted on and a conductor patterns 73, 73 which is formed on the one surface side of the conductive plate 71 through an insulating part 72 and electrically connected to the LED chip 10; and a sheet-shaped connecting member 80 disposed on the other surface side of the conductive plate 71 to connect the conductive plate 71 to a body of the luminaire 90 which is a metal member for holding the chip mounting member 70. The connecting member 80 is made of a resin sheet which includes a filler and whose viscosity is reduced by heating, and the connecting member 80 has an electrical insulating property and thermally connects the conductive plate 71 and the body 90 of the luminaire to each other.

    摘要翻译： 本发明的发光装置包括：LED芯片10; 具有其一个表面侧安装有LED芯片10的导电板（传热板）71的芯片安装构件70和通过绝缘体形成在导电板71的一个表面侧上的导体图案73,73 部分72并且电连接到LED芯片10; 以及布置在导电板71的另一个表面侧上的片状连接件80，以将导电板71连接到作为用于保持芯片安装部件70的金属部件的照明器90的主体。连接部件80是 由包含填料的树脂片制成，其粘度通过加热而降低，并且连接构件80具有电绝缘性能，并且将导电板71和照明器的主体90彼此热连接。

    Lighting Apparatus With Leds
    7.
    发明申请
    Lighting Apparatus With Leds 有权
    带灯的照明设备

    公开(公告)号：US20090046456A1

    公开(公告)日：2009-02-19

    申请号：US12086389

    申请日：2006-12-21

    申请人： Youji Urano ,  Takuya Nakatani ,  Yasuhiro Hidaka ,  Yoshiro Goto

    发明人： Youji Urano ,  Takuya Nakatani ,  Yasuhiro Hidaka ,  Yoshiro Goto

    IPC分类号： F21V7/00

    CPC分类号： F21V29/70 ,  F21K9/00 ,  F21S4/20 ,  F21V23/002 ,  F21Y2115/10 ,  H01L33/62 ,  H01L33/64 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/01019 ,  H01L2924/01079 ,  H01L2924/19041 ,  H05K1/0203 ,  H05K1/021 ,  H05K1/182 ,  H05K2201/10106 ,  H01L2924/00014 ,  H01L2924/00

    摘要： A lighting apparatus with LED includes a metal-made main body 90; a plurality of LED chip units 1 each including an LED chip and a pair of lead terminals 42, 43 electrically connected to electrodes of the LED chip; and a dielectric layer 80 disposed between the main body 90 and each LED chip unit 1 for making electrical insulation therebetween as well as bond the same. The circuit board 20 is formed with a plurality of windows 23 through which the individual LED chip units 1 extend respectively with the lead terminals held in electrical contact with the circuit pattern of the circuit board at the circumference of the window, each of the LED chip units being thermally coupled at its bottom face with the main body 90 through the dielectric layer 80, and the heat generated in the LED chip is conducted to the main body through the dielectric layer without passing through the circuit board.

    摘要翻译： 具有LED的照明装置包括金属制主体90; 多个LED芯片单元1，其各自包括LED芯片和与LED芯片的电极电连接的一对引线端子42,43; 以及设置在主体90和每个LED芯片单元1之间以在其间进行电绝缘以及将其粘合的电介质层80。 电路板20形成有多个窗口23，各个LED芯片单元1分别延伸，引线端子在窗口的圆周处保持与电路板的电路图案电接触，每个LED芯片 单元在其底面与主体90通过电介质层80热耦合，并且在LED芯片中产生的热量通过电介质层传导到主体而不通过电路板。

    Automated part assembly machine
    8.
    发明授权
    Automated part assembly machine 失效
    自动零件装配机

    公开(公告)号：US5586387A

    公开(公告)日：1996-12-24

    申请号：US360568

    申请日：1994-12-21

    申请人： Takuya Nakatani ,  Mitsutaka Abe ,  Shigeru Dono ,  Youji Urano

    发明人： Takuya Nakatani ,  Mitsutaka Abe ,  Shigeru Dono ,  Youji Urano

    IPC分类号： B23P19/04 ,  B23P21/00 ,  B25J9/18 ,  G05B19/418

    CPC分类号： G05B19/4182 ,  B23P21/00 ,  G05B2219/34368 ,  G05B2219/39083 ,  G05B2219/39468 ,  G05B2219/40607 ,  G05B2219/50362 ,  G05B2219/50366 ,  G05B2219/50377 ,  Y02P90/04 ,  Y02P90/083 ,  Y10T29/53013 ,  Y10T29/53087 ,  Y10T29/5337 ,  Y10T29/53383 ,  Y10T29/53417

    摘要： An automated part assembly machine has a work table supported to a base and movable relative thereto and at least two separate robots each having an end effector movable around within an individual work region. The two robots are positioned in such a relation as to give a common work region in which the individual work regions of the two robots overlap. A parts supply is arranged to the work table for storing parts to be picked-up by the robots. A plurality of operator hands are selectively and removably attached to the end effector of the robot for handling the parts by the robot. Disposed within the common region is a jig which positions the parts for assembly by the robot. The robots and the work table are controlled to operate in cooperation for assembly of the parts. The machine is characterized in that the robots are mounted on the movable work table together with the operator hands and the jig with the robots spaced in the moving direction of the work table, and that the parts supply extends in the moving direction of the work table. Thus, the robots are enabled to move together with the jig and the operator hands relative to the parts supply so that the robots can reach over a wide range of the parts supply beyond the individual work regions to thereby successfully pick-up suitable parts and transfer them to the jig for immediate assembly of the parts. Further, since the operator hands are on the movable work table, the robot can change the operator hands while moving relative to the parts supply for effecting the part assembly substantially without interruption, in addition to the advantage of enabling one robot to change the operator hand while the other robot is handling the parts.

    摘要翻译： 自动化部件组装机具有支撑到基座并可相对于其移动的工作台，以及至少两个分离的机器人，每个机器人具有可在单个工作区域内移动的末端执行器。 两个机器人位于这样的关系中，以便给出两个机器人的各个工作区域重叠的公共工作区域。 零件供应被安排在工作台上，用于存储由机器人拾取的零件。 多个操作者手被选择性地并且可移除地附接到机器人的末端执行器以由机器人处理部件。 在公共区域内设置有用于将机器人组装的部件定位的夹具。 机器人和工作台被控制以协作组装零件。 该机器的特征在于，机器人与操作者手和夹具一起安装在可移动工作台上，其中机器人在工作台的移动方向上间隔开，并且部件供应沿工作台的移动方向延伸 。 因此，机器人能够与夹具和操作者手相对于零件供应一起移动，使得机器人可以跨越各个工作区域的范围内的零件供应范围，从而成功地拾取适当的部件并转移 他们到夹具立即组装零件。 此外，由于操作者手在可移动工作台上，所以机器人可以相对于零件供应而移动时可以改变操作者的手，以实现零件组装的基本上不间断，除了使一个机器人能够改变操作者手的优点 而另一个机器人正在处理部件。

    LED UNIT
    9.
    发明申请
    LED UNIT 有权
    LED单元

    公开(公告)号：US20120032203A1

    公开(公告)日：2012-02-09

    申请号：US13264188

    申请日：2010-04-13

    申请人： Youji Urano

    发明人： Youji Urano

    IPC分类号： H01L33/62

    CPC分类号： F21V29/70 ,  F21K9/00 ,  F21V19/0015 ,  F21V19/045 ,  F21V29/58 ,  F21V29/83 ,  H01L33/486 ,  H01L33/62 ,  H01L33/642 ,  H01L33/648 ,  H01L2924/0002 ,  H05K1/0203 ,  H05K1/117 ,  H05K3/0061 ,  H05K2201/09745 ,  H05K2201/10106 ,  H05K2201/10446 ,  H01L2924/00

    摘要： The LED unit 100 comprises a plurality of the LED module 1 and the heat radiation plate. Each the LED module 1 comprises the LED chip and the package for incorporating the LED chip therein; the package has the electrical insulation property. Each the package comprises the sub-mount member which is located between the LED chip and the heat radiation plate and which has heat conductivity; these are integrally formed. The LED modules are arranged on the first surface of the heat radiation plate. This configuration makes it possible for the LED unit to efficiently disperse the heat in the LED chip 10 to the heat radiation plate.

    摘要翻译： LED单元100包括多个LED模块1和散热板。 每个LED模块1包括LED芯片和用于将LED芯片并入其中的封装; 该封装具有电绝缘性能。 每个包装件包括位于LED芯片和散热板之间并具有导热性的子安装构件; 这些是整体形成的。 LED模块布置在散热板的第一表面上。 该结构使得LED单元有可能将LED芯片10中的热量有效地分散到散热板。

    Light emitting device
    10.
    发明授权
    Light emitting device 有权
    发光装置

    公开(公告)号：US07956372B2

    公开(公告)日：2011-06-07

    申请号：US12067194

    申请日：2005-12-28

    申请人： Kazuo Kamada ,  Yasushi Nishioka ,  Youji Urano

    发明人： Kazuo Kamada ,  Yasushi Nishioka ,  Youji Urano

    IPC分类号： H01L33/48

    CPC分类号： H01L33/483 ,  H01L33/505 ,  H01L33/507 ,  H01L33/58 ,  H01L33/60 ,  H01L33/642 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/19107 ,  H01L2924/00014 ,  H01L2924/00

    摘要： A light emitting device includes a light emitting diode chip, a heat conductive plate mounting thereon the light emitting diode chip, a sub-mount member disposed between said light emitting diode chip and said heat conductive plate, a dielectric substrate stacked on the heat conductive plate and being formed with a through-hole through which the sub-mount member is exposed, an encapsulation member for encapsulation of said light emitting diode chip, and a lens superimposed on the encapsulation member. The sub-mount member is formed around a coupling portion of the light emitting diode chip with a reflective film which reflects a light emitted from a side face of the light emitting diode chip. The sub-mount member is selected to have a thickness such that the reflecting film has its surface spaced away from said heat conductive plate by a greater distance than said dielectric substrate.

    摘要翻译： 发光装置包括：发光二极管芯片，安装在发光二极管芯片上的导热板，设置在所述发光二极管芯片和所述导热板之间的副安装构件，堆叠在所述导热板上的电介质基板 并且形成有用于露出子安装构件的通孔，用于封装所述发光二极管芯片的封装构件和叠置在封装构件上的透镜。 副安装构件围绕发光二极管芯片的耦合部分形成有反射膜，该反射膜反射从发光二极管芯片的侧面发射的光。 子安装构件被选择为具有使得反射膜的表面与所述导热板间隔远离所述电介质基板的厚度的厚度。