摘要:
Disclosed are a method of forming metal wiring and metal wiring formed using the same. The method includes printing wiring using an ink composition including metallic nanoparticles and dispersants maintaining dispersion of the metallic nanoparticles, performing a first firing process of firing the wiring under vacuum or in an inert atmosphere to suppress grain growth, and performing a second firing process of firing the wiring with the vacuum or inert atmosphere released, to accelerate grain growth. The method of forming metal wiring induces abnormal grain growth by rapidly removing dispersants, capable of inducing the growth of metallic nanoparticles, at a temperature at which the growth force of the metallic nanoparticles is high, in the process of firing the metallic nanoparticles. Accordingly, the metal wiring has a coarse-grained structure containing metallic particles with a large average particle size, and the electrical and mechanical characteristics thereof can be enhanced.
摘要:
Disclosed are a method of forming metal wiring and metal wiring formed using the same. The method includes printing wiring using an ink composition including metallic nanoparticles and dispersants maintaining dispersion of the metallic nanoparticles, performing a first firing process of firing the wiring under vacuum or in an inert atmosphere to suppress grain growth, and performing a second firing process of firing the wiring with the vacuum or inert atmosphere released, to accelerate grain growth. The method of forming metal wiring induces abnormal grain growth by rapidly removing dispersants, capable of inducing the growth of metallic nanoparticles, at a temperature at which the growth force of the metallic nanoparticles is high, in the process of firing the metallic nanoparticles. Accordingly, the metal wiring has a coarse-grained structure containing metallic particles with a large average particle size, and the electrical and mechanical characteristics thereof can be enhanced.
摘要:
Disclosed herein is a conductive electrode pattern used as an electrode of a solar cell. The conductive electrode pattern includes a lower metal layer and an upper metal layer vertically disposed on a substrate, wherein any one of the lower metal layer and the upper metal layer includes silver (Ag) and the other one of the lower metal layer and the upper metal layer includes a metal of transition metals, different from that of the lower metal layer.
摘要:
A method for manufacturing a printed wiring board having one or more layers of a conductive pattern and an insulating pattern, including forming an insulating pattern on an insulating substrate; semi-hardening at least one of the insulating substrate and the insulating pattern; forming a conductive pattern on the insulating substrate and/or the insulating pattern, thereby providing a stack structure; performing a thermal treatment on the stack structure to fully harden the semi-hardened insulating substrate and/or insulating pattern; and firing the conductive pattern. In the method, the conductive pattern and the insulating pattern are simultaneously formed on the same layer using an inkjet process.
摘要:
Disclosed herein is a conductive electrode pattern used as an electrode of a solar cell. The conductive electrode pattern includes a lower metal layer and an upper metal layer vertically disposed on a substrate, wherein any one of the lower metal layer and the upper metal layer includes silver (Ag) and the other one of the lower metal layer and the upper metal layer includes a metal of transition metals, different from that of the lower metal layer.
摘要:
There are provided an inkjet head assembly and a method for manufacturing the same. The inkjet head assembly includes: an inkjet head plate having an ink flow passage formed therein and having an actuator formed thereon, the actuator providing driving force for discharging ink; a flexible printed circuit board (FPCB) applying voltage to the actuator; and an intermediate substrate provided so as to electrically connect the actuator to the flexible printed circuit board and having a second bonding portion bonded to the flexible printed circuit board formed inwardly of a first bonding portion, bonded to the actuator in a width direction of the inkjet head plate.
摘要:
Disclosed are an electronic component module and a method of manufacturing the same. The electronic component module includes a first insulating layer having a first surface in which first circuit patterns are embedded, electronic components of different kinds, the electronic components being mounted on the first circuit patterns and having electrode parts placed in different locations, and a molding layer encompassing the electronic components. Accordingly, a thin-film type electronic component module having a thin insulating layer with a circuit pattern can be provided.
摘要:
There is provided an inkjet head assembly that includes: an inkjet head plate including an ink path; a piezoelectric actuator facing a pressure chamber in the inkjet head plate and providing driving force for ejecting ink to a nozzle from the pressure chamber; a package part stacked on the inkjet head plate and including a path moving ink introduced from the outside to an inlet of the inkjet head plate; and an electrical connector filling a via penetrating the package part and electrically connected with the piezoelectric actuator.
摘要:
Provided is an inkjet head assembly capable of reducing the generation of air bubbles during ink injection by using a guide formed inside an ink tank. The inkjet head assembly includes an ink tank including an ink inlet through which ink is injected from the outside, and storing ink injected through the ink inlet, an inkjet head connected with the ink tank through an ink supply channel, receiving ink from the ink tank and discharging the received ink, and a guide disposed inside the ink tank and guiding ink, injected through the ink inlet, to an inner surface of the ink tank.
摘要:
There is provided an inkjet print head including: a pressure chamber storing ink in order to eject the ink to a nozzle; a piezoelectric actuator receiving part being recessed in order to correspond to the pressure chamber in a direction of the pressure chamber; and a piezoelectric actuator received in the piezoelectric actuator receiving part, in which viscous liquid having piezoelectric properties is filled and hardened, and supplying the pressure chamber with a driving force for ejection of the ink.