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    Side-emitting LED package and method of manufacturing the same
    3.
    发明申请
    Side-emitting LED package and method of manufacturing the same 审中-公开
    侧面发光LED封装及其制造方法

    公开(公告)号：US20060273337A1

    公开(公告)日：2006-12-07

    申请号：US11444402

    申请日：2006-06-01

    申请人： Kyung Han ,  Myoung Choi ,  Seon Lee ,  Hun Hahm ,  Seong Han ,  Chang Song ,  Young Park

    发明人： Kyung Han ,  Myoung Choi ,  Seon Lee ,  Hun Hahm ,  Seong Han ,  Chang Song ,  Young Park

    IPC分类号： H01L33/00

    CPC分类号： H01L33/54 ,  H01L24/97 ,  H01L25/0753 ,  H01L33/60 ,  H01L2224/48091 ,  H01L2924/12035 ,  H01L2924/12041 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/00 ,  H01L2924/00014

    摘要： The invention relates to a side-emitting LED package and a manufacturing method thereof. The side-emitting LED package includes a substrate with an electrode formed thereon, and a light source disposed on the substrate and electrically connected to the electrode. The side-emitting LED package also includes a molded part having an upper surface with a center thereof depressed concavely, covering and protecting the substrate and the light source, and a reflection layer covering an entire upper surface of the molded part to reflect light sideward from the molded part which forms a light transmitting surface. The package is not restricted in the shape of the molded part and is not affected by the LED chip size, enabling a compact structure. The invention can also process a substrate by a PCB process, enabling mass-production.

    摘要翻译： 本发明涉及一种侧面发光LED封装及其制造方法。 侧发光LED封装包括其上形成有电极的基板和设置在基板上并与电极电连接的光源。 侧发光LED封装还包括具有上表面的模制部件，其中心凹陷地凹陷，覆盖和保护基板和光源，以及覆盖模制部件的整个上表面的反射层，以将光从侧向反射 模制部件形成透光表面。 封装不限制成型件的形状，不受LED芯片尺寸的影响，从而实现了紧凑的结构。 本发明还可以通过PCB工艺处理衬底，从而实现批量生产。

    Light emitting diode package having dual lens structure for lateral light emission
    5.
    发明申请
    Light emitting diode package having dual lens structure for lateral light emission 有权
    具有用于横向发光的双透镜结构的发光二极管封装

    公开(公告)号：US20070019416A1

    公开(公告)日：2007-01-25

    申请号：US11488067

    申请日：2006-07-18

    申请人： Kyung Han ,  Myoung Choi ,  Seon Lee ,  Seong Han ,  Hun Hahm ,  Chang Song

    发明人： Kyung Han ,  Myoung Choi ,  Seon Lee ,  Seong Han ,  Hun Hahm ,  Chang Song

    IPC分类号： F21V7/00

    CPC分类号： H01L33/58 ,  G02B19/0028 ,  G02B19/0061 ,  G02B19/0071 ,  H01L33/60 ,  H01L33/62 ,  H01L33/644 ,  H01L33/647 ,  H01L2224/48247 ,  H01L2924/3025 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00

    摘要： An LED package having a dual structure for lateral emission of light includes an LED chip, a lower structure, a lower lens and an upper lens. The lower structure includes a pair of electric connection parts, a package body, and a transparent encapsulant filled in the recess of the package body to seal the LED chip. The upper-hemispheric lower lens is fixed to an upper part of the lower structure with a bottom part thereof attached to an upper surface of the transparent encapsulant. The funnel-shaped upper lens is fixed to an upper end of the lower lens, and includes an axially symmetrical reflecting surface for laterally reflecting light from the lower lens, and an emitting surface for laterally emitting light reflected from the reflecting surface. The upper lens and the lower lens are separately molded and combined together to easily manufacture and efficiently install the LED package.

    摘要翻译： 具有用于光的横向发射的双重结构的LED封装包括LED芯片，下部结构，下部透镜和上部透镜。 下部结构包括一对电连接部分，封装主体和填充在封装体的凹部中的透明密封剂，以密封LED芯片。 上半球下透镜固定到下结构的上部，其下部附接到透明密封剂的上表面。 漏斗状上透镜固定在下透镜的上端，并且包括用于横向反射来自下透镜的光的轴对称反射表面和用于横向发射从反射表面反射的光的发射表面。 上透镜和下透镜分别模制并组合在一起以容易地制造和有效地安装LED封装。

    Light emitting diode package with diffuser and method of manufacturing the same
    6.
    发明申请
    Light emitting diode package with diffuser and method of manufacturing the same 有权
    具有扩散器的发光二极管封装及其制造方法

    公开(公告)号：US20070045644A1

    公开(公告)日：2007-03-01

    申请号：US11491947

    申请日：2006-07-25

    申请人： Seong Han ,  Seon Lee ,  Chang Song ,  Jung Park ,  Young Park ,  Kyung Han

    发明人： Seong Han ,  Seon Lee ,  Chang Song ,  Jung Park ,  Young Park ,  Kyung Han

    IPC分类号： H01L33/00

    CPC分类号： H01L33/58 ,  H01L33/505 ,  H01L2224/48091 ,  H01L2224/49107 ,  H01L2224/73265 ,  H01L2924/181 ,  H01L2933/0091 ,  H01L2924/00014 ,  H01L2924/00012

    摘要： The invention relates to an LED package for facilitating color mixing using a diffuser and a manufacturing method of the same. The LED package includes a substrate with an electrode formed thereon, and an LED chip mounted on the substrate. The LED package also includes an encapsulant applied around the light emitting diode chip, containing a diffuser. The LED package further includes a lens part disposed on the light emitting diode chip and the encapsulant to radiate light in a wide angle. The LED package allows light from the light emitting diode chip to be emitted out of the package without distortion. The invention allows light to exit through the encapsulant containing the diffuser and the lens part, achieving uniform diffusion and emission of light from the LED chip, thereby increasing a radiating angle and obtaining a uniform light source.

    摘要翻译： 本发明涉及一种便于使用扩散器进行混色的LED封装及其制造方法。 LED封装包括其上形成有电极的基板和安装在基板上的LED芯片。 LED封装还包括施加在发光二极管芯片周围的密封剂，其包含扩散器。 LED封装还包括设置在发光二极管芯片上的透镜部分和密封剂以广角度辐射光。 LED封装允许来自发光二极管芯片的光从封装外部发射而不变形。 本发明允许光通过包含扩散器和透镜部分的密封剂而离开，实现来自LED芯片的均匀的扩散和发射，从而增加辐射角度并获得均匀的光源。

    Chip coated light emitting diode package and manufacturing method thereof
    7.
    发明申请
    Chip coated light emitting diode package and manufacturing method thereof 有权
    芯片涂层发光二极管封装及其制造方法

    公开(公告)号：US20070158669A1

    公开(公告)日：2007-07-12

    申请号：US11651524

    申请日：2007-01-10

    申请人： Seon Lee ,  Kyung Han ,  Seong Han

    发明人： Seon Lee ,  Kyung Han ,  Seong Han

    IPC分类号： H01L33/00 ,  H01L21/00

    CPC分类号： H01L33/62 ,  H01L33/508 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48465 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/00014 ,  H01L2924/00

    摘要： A chip coated LED package and a manufacturing method thereof. The chip coated LED package includes a light emitting chip composed of a chip die-attached on a submount and a resin layer uniformly covering an outer surface of the chip die. The chip coated LED package also includes an electrode part electrically connected by metal wires with at least one bump ball exposed through an upper surface of the resin layer. The chip coated LED package further includes a package body having the electrode part and the light emitting chip mounted thereon. The invention improves light efficiency by preventing difference in color temperature according to irradiation angles, increases a yield, miniaturizes the package, and accommodates mass production.

    摘要翻译： 一种芯片涂覆的LED封装及其制造方法。 芯片涂覆的LED封装包括由安装在基座上的芯片芯片和均匀覆盖芯片裸片外表面的树脂层组成的发光芯片。 芯片涂覆的LED封装还包括通过金属线电连接的电极部分，其中至少一个凸块球通过树脂层的上表面暴露。 芯片涂覆的LED封装还包括具有安装在其上的电极部分和发光芯片的封装体。 本发明通过根据照射角度防止色温差异提高光效，提高成品率，使封装体小型化，适应批量生产。

    Light emitting diode package with metal reflective layer and method of manufacturing the same
    8.
    发明申请
    Light emitting diode package with metal reflective layer and method of manufacturing the same 审中-公开
    具有金属反射层的发光二极管封装及其制造方法

    公开(公告)号：US20060284207A1

    公开(公告)日：2006-12-21

    申请号：US11455648

    申请日：2006-06-20

    申请人： Jung Park ,  Seon Lee ,  Kyung Han ,  Seong Han

    发明人： Jung Park ,  Seon Lee ,  Kyung Han ,  Seong Han

    IPC分类号： H01L33/00

    CPC分类号： H01L33/60 ,  H01L24/97 ,  H01L33/486 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73204 ,  H01L2924/12041 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00

    摘要： The invention relates to an LED package having a metal reflective layer for focusing and emitting light through a side of the package, and a manufacturing method of the same. The LED package includes a substrate with an electrode formed thereon, a light emitting diode chip disposed on the substrate, and an encapsulant covering the LED chip and the substrate to protect the LED chip. The LED package also includes a metal reflective layer surrounding side surfaces of the encapsulant to form a light transmitting surface on a top surface of the encapsulant. The invention minimizes light loss, improves luminance, can be mass-produced as a PCB type, and adopts EMC transfer molding to minimize irregular color distribution, thereby improving optical quality.

    摘要翻译： 本发明涉及一种具有用于聚焦并通过封装侧发光的金属反射层的LED封装及其制造方法。 LED封装包括其上形成有电极的基板，设置在基板上的发光二极管芯片以及覆盖LED芯片和基板的密封剂以保护LED芯片。 LED封装还包括围绕密封剂的侧表面的金属反射层，以在密封剂的顶表面上形成透光表面。 本发明使光损失最小化，亮度提高，可以作为PCB类型批量生产，并采用EMC传递模塑，以减少不规则的颜色分布，从而提高光学质量。

    LED housing and fabrication method thereof
    9.
    发明申请
    LED housing and fabrication method thereof 审中-公开
    LED外壳及其制造方法

    公开(公告)号：US20060180925A1

    公开(公告)日：2006-08-17

    申请号：US11325327

    申请日：2006-01-05

    申请人： Seon Lee ,  Bum Jin ,  Kyung Han ,  Chang Kim

    发明人： Seon Lee ,  Bum Jin ,  Kyung Han ,  Chang Kim

    IPC分类号： H01L23/34

    CPC分类号： H01L33/642 ,  H01L33/486 ,  H01L33/62 ,  H01L33/647 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/01019 ,  H01L2924/12041 ,  H01L2924/00014

    摘要： The invention relates to an LED housing and its fabrication method. In the LED housing, a heat conducting part has a chip mounting area, a heat connecting area opposed to the chip mounting area and a groove formed adjacent to the heat connecting area. An electrical connecting part has a wiring area placed adjacent to the chip mounting area and an external power connecting area led to the wiring area. A housing body is made of molding resin, and integrally holds the heat conducting part and the electrical connecting part while isolating the electrical connecting part from the heat conducting part. The housing body is provided with a recess extended from a portion of the groove of the heat conducting part to a side of the housing body. In this fashion, the invention can overcome restricted application problems by isolating the electrical connecting parts from the heat conducting part.

    摘要翻译： 本发明涉及一种LED外壳及其制造方法。 在LED壳体中，导热部具有芯片安装区域，与芯片安装区域相对的热连接区域和与热连接区域相邻形成的槽。 电气连接部件具有与芯片安装区域相邻放置的布线区域和引导到布线区域的外部电源连接区域。 壳体由成型树脂制成，并且一体地保持导热部和电连接部，同时将电连接部与导热部隔离。 壳体设置有从导热部分的槽的一部分延伸到壳体的一侧的凹部。 以这种方式，本发明可以通过将电气连接部件与导热部分隔离来克服限制的应用问题。

    LED package having recess in heat conducting part
    10.
    发明申请
    LED package having recess in heat conducting part 有权
    LED封装在导热部分具有凹槽

    公开(公告)号：US20070030703A1

    公开(公告)日：2007-02-08

    申请号：US11500361

    申请日：2006-08-08

    申请人： Seon Lee ,  Chang Song ,  Kyung Han

    发明人： Seon Lee ,  Chang Song ,  Kyung Han

    IPC分类号： H01J1/62

    CPC分类号： H01L33/647 ,  H01L24/97 ,  H01L33/486 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/12041 ,  H01L2924/181 ,  Y10S362/80 ,  H01L2924/00014 ,  H01L2924/00

    摘要： The invention provides an LED package including an LED chip. In the LED package, a heat conducting part of folded sheet metals has a recess formed thereon to seat the LED chip therein. A package body houses the heat conducting part and directs light generated from the LED chip upward. Also, a transparent encapsulant is provided to at least the recess of the heat conducting part. Leads are partially housed by the package body to supply power to the LED chip. According to the invention, the sheet metals are folded to form the heat conducting part, and the recess is formed on the heat conducting part to seat the LED chip therein. This improves reflection efficiency and simplifies an overall process.

    摘要翻译： 本发明提供一种包括LED芯片的LED封装。 在LED封装中，折叠的金属片的导热部分具有形成在其上的凹部，以将LED芯片置于其中。 包装体容纳导热部分，并将LED芯片产生的光向上引导。 此外，透明密封剂至少设置在导热部分的凹部上。 引线部分地由封装体容纳以向LED芯片供电。 根据本发明，折叠金属板以形成导热部分，并且在导热部分上形成凹部以将LED芯片置于其中。 这提高了反射效率并简化了整个过程。