公开(公告)号：US20130309702A1

公开(公告)日：2013-11-21

申请号：US13982819

申请日：2012-01-31

申请人： Young Keun Kim ,  Jun Hua Wu ,  Ji Hyun Min ,  Ji-Sung Lee ,  Jae-Ho Jung

发明人： Young Keun Kim ,  Jun Hua Wu ,  Ji Hyun Min ,  Ji-Sung Lee ,  Jae-Ho Jung

IPC分类号： G01N27/72

CPC分类号： G01N27/72 ,  A61K49/1827 ,  A61K49/1851 ,  A61K49/1866 ,  A61K49/1875 ,  C01G45/12 ,  C01P2002/72 ,  C01P2002/85 ,  C01P2004/04 ,  C01P2004/62 ,  C01P2004/64 ,  C01P2006/42 ,  G01N33/587

摘要： The present invention relates to a magnetic nanoparticle having a Curie temperature which is within a biocompatible temperature range, a method for preparing same, and a nanocomposite and a target substance detection composition comprising the magnetic nanoparticle. As the magnetic nanoparticle of the present invention has a Curie temperature within the temperature range of 0 degrees centigrade to 41 degrees centigrade, the ferromagnetic and paramagnetic properties of the magnetic nanoparticle may be controlled within a biocompatible temperature range at a temperature at which a biological control agent is not destroyed, and the temperature of the magnetic nanoparticle is adjusted to control the magnetic properties thereof such that the properties of the magnetic nanoparticle may be used only when ferromagnetic properties are required, such as in the case of signal amplification in detecting, separating, and delivering biological control agents. Accordingly, the magnetic nanoparticle of the present invention can minimize adverse effects of ferromagnetic properties thereof, and can be used in the effective detection and separation of biological control agents.

摘要翻译： 本发明涉及具有在生物相容性温度范围内的居里温度的磁性纳米颗粒，其制备方法以及包含该磁性纳米颗粒的纳米复合材料和目标物质检测组合物。 由于本发明的磁性纳米颗粒的居里温度在0摄氏度到41摄氏度的温度范围内，磁性纳米颗粒的铁磁性和顺磁性能可以在生物相容性温度范围内控制， 试剂不被破坏，并且调节磁性纳米颗粒的温度以控制其磁性，使得仅当需要铁磁性质时才能使用磁性纳米颗粒的性质，例如在检测，分离中的信号放大的情况下 ，并提供生物控制剂。 因此，本发明的磁性纳米颗粒可以使其铁磁性能的不利影响最小化，并可用于生物控制剂的有效检测和分离。

公开(公告)号：US20070287280A1

公开(公告)日：2007-12-13

申请号：US11808584

申请日：2007-06-12

申请人： Dong-Min Kang ,  Young-Sam Lim ,  Gi-Jung Kim ,  Young-Nam Kim ,  Yun-Deok Kang ,  Ji-Sung Lee ,  Ki-Hyeon Kim ,  Kyoung-Jin Choi

发明人： Dong-Min Kang ,  Young-Sam Lim ,  Gi-Jung Kim ,  Young-Nam Kim ,  Yun-Deok Kang ,  Ji-Sung Lee ,  Ki-Hyeon Kim ,  Kyoung-Jin Choi

IPC分类号： H01L21/44

CPC分类号： H01L21/31133 ,  G03F7/425 ,  H01L24/11 ,  H01L24/12 ,  H01L2224/03912 ,  H01L2224/0401 ,  H01L2224/1147 ,  H01L2224/11472 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/16 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01016 ,  H01L2924/01022 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/19041

摘要： A composition for removing a photoresist and a method of forming a bump electrode using the composition are provided. The composition includes an amine compound having a hydroxyl group, a polar organic solvent having a heteroatom, an alkylammonium hydroxide and water. The method of forming the bump electrode includes forming a conductive pattern on a substrate, forming a passivation layer on the substrate, the passivation layer having a first opening that partially exposes the conductive pattern, forming a photoresist pattern on the passivation layer, the photoresist pattern having a second opening that exposes the first opening forming a bump electrode that fills the first opening and the second opening, and removing the photoresist pattern from the substrate using a composition including an amine compound having a hydroxyl group, a polar organic solvent having a heteroatom, an alkylammonium hydroxide and water.

摘要翻译： 提供了用于除去光致抗蚀剂的组合物和使用该组合物形成凸块电极的方法。 该组合物包括具有羟基的胺化合物，具有杂原子的极性有机溶剂，烷基氢氧化铵和水。 形成凸起电极的方法包括在衬底上形成导电图案，在衬底上形成钝化层，钝化层具有部分地暴露导电图案的第一开口，在钝化层上形成光致抗蚀剂图案，光致抗蚀剂图案 具有露出第一开口的第二开口，其形成充满第一开口和第二开口的凸块电极，并且使用包含具有羟基的胺化合物的组合物，具有杂原子的极性有机溶剂从基板除去光致抗蚀剂图案 ，烷基氢氧化铵和水。

公开(公告)号：US20130060014A1

公开(公告)日：2013-03-07

申请号：US13600976

申请日：2012-08-31

申请人： Chul-Ho Jun ,  Ye-Lim Yeon ,  Ji-Sung Lee ,  Young-Jun Park

发明人： Chul-Ho Jun ,  Ye-Lim Yeon ,  Ji-Sung Lee ,  Young-Jun Park

IPC分类号： C07F7/12 ,  C07F7/10 ,  C07F7/08

CPC分类号： C03C17/42 ,  C03C17/009 ,  C08F292/00 ,  C08K3/36

摘要： A surface-modified inorganic material and a preparation method thereof. A surface-modified inorganic material is provided which is obtained by allowing an organosilane compound having allyl or an allyl derivative to react with an inorganic material, particularly solid silica or ITO glass, in the presence of an acid and an organic solvent, to introduce an organic group into the inorganic material even at room temperature, as well as a preparation method thereof. The invention can effectively introduce the organic group into the inorganic material even at room temperature, and thus is very effective in introducing compounds having a thermally sensitive functional group, for example, natural compounds or proteins. It is possible to introduce various organic groups into an inorganic material and to separate and purify organic molecule-bonded organosilane compounds using a silica gel column to effectively bond them to inorganic materials.

摘要翻译： 表面改性无机材料及其制备方法。 提供了通过使具有烯丙基或烯丙基衍生物的有机硅烷化合物与无机材料，特别是固体二氧化硅或ITO玻璃在酸和有机溶剂的存在下反应而得到的表面改性无机材料， 有机基团也可以在室温下进入无机材料，以及其制备方法。 本发明即使在室温下也可有效地将有机基团引入到无机材料中，因此在引入具有热敏性官能团的化合物，例如天然化合物或蛋白质中非常有效。 可以将各种有机基团引入无机材料中，并使用硅胶柱分离和纯化有机分子键合的有机硅烷化合物以有效地将它们键合到无机材料上。

公开(公告)号：US20090270590A1

公开(公告)日：2009-10-29

申请号：US11989367

申请日：2006-05-16

申请人： Chul-Ho Jun ,  Ye-Lim Yeon ,  Ji-Sung Lee ,  Young-Jun Park

发明人： Chul-Ho Jun ,  Ye-Lim Yeon ,  Ji-Sung Lee ,  Young-Jun Park

IPC分类号： C07F7/08 ,  C07H15/00 ,  C03C17/30 ,  C07K2/00 ,  C07K1/00

CPC分类号： C03C17/42 ,  C03C17/009 ,  C08F292/00 ,  C08K3/36

摘要： A surface-modified inorganic material and a preparation method thereof. A surface-modified inorganic material is provided which is obtained by allowing an organosilane compound having allyl or an allyl derivative to react with an inorganic material, particularly solid silica or ITO glass, in the presence of an acid and an organic solvent, to introduce an organic group into the inorganic material even at room temperature, as well as a preparation method thereof. The invention can effectively introduce the organic group into the inorganic material even at room temperature, and thus is very effective in introducing compounds having a thermally sensitive functional group, for example, natural compounds or proteins. It is possible to introduce various organic groups into an inorganic material and to separate and purify organic molecule-bonded organosilane compounds using a silica gel column to effectively bond them to inorganic materials. Accordingly, the invention is very useful in the chemical industry.

摘要翻译： 表面改性无机材料及其制备方法。 提供了通过使具有烯丙基或烯丙基衍生物的有机硅烷化合物与无机材料，特别是固体二氧化硅或ITO玻璃在酸和有机溶剂的存在下反应而得到的表面改性无机材料， 有机基团也可以在室温下进入无机材料，以及其制备方法。 本发明即使在室温下也可有效地将有机基团引入到无机材料中，因此在引入具有热敏性官能团的化合物，例如天然化合物或蛋白质中非常有效。 可以将各种有机基团引入无机材料中，并使用硅胶柱分离和纯化有机分子键合的有机硅烷化合物以有效地将它们键合到无机材料上。 因此，本发明在化学工业中非常有用。

公开(公告)号：US20080045035A1

公开(公告)日：2008-02-21

申请号：US11783978

申请日：2007-04-13

申请人： Ji-Sung Lee ,  Dong-Min Kang ,  Young Nam Kim ,  Young-Sam Lim ,  Yun-Deok Kang

发明人： Ji-Sung Lee ,  Dong-Min Kang ,  Young Nam Kim ,  Young-Sam Lim ,  Yun-Deok Kang

IPC分类号： H01L21/461 ,  B44C1/22 ,  C09K13/06

CPC分类号： H01L21/32134 ,  C09K13/06 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/0361 ,  H01L2224/03901 ,  H01L2224/03912 ,  H01L2224/0401 ,  H01L2224/05027 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05166 ,  H01L2224/05181 ,  H01L2224/05184 ,  H01L2224/05572 ,  H01L2224/05582 ,  H01L2224/05644 ,  H01L2224/1147 ,  H01L2224/13005 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2924/0002 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01072 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/00014 ,  H01L2224/05552

摘要： A metal etching solution may include nitric acid, hydrochloric acid, organic acid and water. A semiconductor product fabricating method may include forming a seed layer on a substrate with a metal pad, forming a sacrificial layer that may have an opening exposing the seed layer on the substrate with the seed layer, forming a gold bump that may fill the opening of the sacrificial layer by performing gold electroplating, removing the sacrificial layer, and etching the seed layer exposed by the gold bump, using an etching solution that may include nitric acid, hydrochloric acid, organic acid and water.

摘要翻译： 金属蚀刻溶液可以包括硝酸，盐酸，有机酸和水。 半导体产品制造方法可以包括用金属焊盘在衬底上形成晶种层，形成牺牲层，牺牲层可以具有使种子层暴露在衬底上的种子层的开口，形成可以填充 使用可以包括硝酸，盐酸，有机酸和水的蚀刻溶液进行金电镀，去除牺牲层和蚀刻由金凸块暴露的种子层的牺牲层。