SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SAME
    2.
    发明申请
    SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SAME 审中-公开
    半导体器件及其制造方法

    公开(公告)号:US20140110758A1

    公开(公告)日:2014-04-24

    申请号:US14124600

    申请日:2011-06-08

    IPC分类号: H01L29/778 H01L29/66

    摘要: The semiconductor device is formed in the form of a GaN-based stacked layer including an n-type drift layer 4, a p-type layer 6, and an n-type top layer 8. The semiconductor device includes a regrown layer 27 formed so as to cover a portion of the GaN-based stacked layer that is exposed to an opening 28, the regrown layer 27 including a channel. The channel is two-dimensional electron gas formed at an interface between the electron drift layer and the electron supply layer. When the electron drift layer 22 is assumed to have a thickness of d, the p-type layer 6 has a thickness in the range of d to 10d, and a graded p-type impurity layer 7 whose concentration decreases from a p-type impurity concentration in the p-type layer is formed so as to extend from a (p-type layer/n-type top layer) interface to the inside of the n-type top layer.

    摘要翻译: 半导体器件形成为包括n型漂移层4,p型层6和n型顶层8的GaN基叠层的形式。半导体器件包括如下形成的再生长层27 为了覆盖暴露于开口28的GaN基叠层的一部分,再生长层27包括沟道。 通道是在电子漂移层和电子供给层之间的界面处形成的二维电子气。 当假定电子漂移层22的厚度为d时,p型层6的厚度在d至10d的范围内,并且p型杂质层7的浓度从p型杂质降低 从(p型层/ n型顶层)界面向n型顶层的内部形成p型层的浓度。

    SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SAME
    3.
    发明申请
    SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SAME 有权
    半导体器件及其制造方法

    公开(公告)号:US20130168739A1

    公开(公告)日:2013-07-04

    申请号:US13824248

    申请日:2011-07-06

    IPC分类号: H01L29/778 H01L29/66

    摘要: A vertical semiconductor device in which pinch-off characteristics and breakdown voltage characteristics can be stably improved by fixing the electric potential of a p-type GaN barrier layer with certainty is provided. The semiconductor device includes a GaN-based stacked layer having an opening, a regrown layer including a channel located so as to cover a wall surface of the opening, an n+-type source layer that is in ohmic contact with the source electrode, a p-type GaN barrier layer, and a p+-type GaN-based supplementary layer located between the p-type GaN barrier layer and the n+-type source layer. The p+-type GaN-based supplementary layer and the n+-type source layer form a tunnel junction to fix the electric potential of the p-type GaN barrier layer at a source potential.

    摘要翻译: 提供了通过确定地固定p型GaN势垒层的电位可以稳定地提高夹断特性和击穿电压特性的垂直半导体器件。 半导体器件包括具有开口的GaN基层叠层,包含覆盖开口壁面的沟道的再生长层,与源电极欧姆接触的n +型源极,p 位于p型GaN势垒层和n +型源极层之间的p +型GaN基辅助层。 p +型GaN基辅助层和n +型源极层形成隧道结,以将p型GaN阻挡层的电位固定在源极电位。

    SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING THE SAME
    4.
    发明申请
    SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING THE SAME 有权
    半导体器件及其制造方法

    公开(公告)号:US20130181226A1

    公开(公告)日:2013-07-18

    申请号:US13822591

    申请日:2011-07-06

    IPC分类号: H01L29/778 H01L29/66

    摘要: There are provided a semiconductor device in which a drain leak current can be reduced in the transistor operation while high vertical breakdown voltage is achieved and a method for producing the semiconductor device. In the semiconductor device, an opening 28 that extends from an n+-type contact layer 8 and reaches an n-type drift layer 4 through a p-type barrier layer 6 is formed. The semiconductor device includes a regrown layer 27 located so as to cover portions of the p-type barrier layer 6 and the like that are exposed to the opening, the regrown layer 27 including an undoped GaN channel layer 22 and a carrier supply layer 26; an insulating layer 9 located so as to cover the regrown layer 27; and a gate electrode G located on the insulating layer 9. In the p-type barrier layer, the Mg concentration A (cm−3)and the hydrogen concentration B (cm−3) satisfy 0.1

    摘要翻译: 提供了一种半导体器件,其中在实现高的垂直击穿电压的同时,在晶体管操作中可以减小漏极漏电流,以及制造半导体器件的方法。 在半导体器件中,形成从n +型接触层8延伸并通过p型阻挡层6到达n型漂移层4的开口28。 半导体器件包括再生长层27,其被覆盖以覆盖暴露于开口的p型阻挡层6等的部分,再生长层27包括未掺杂的GaN沟道层22和载流子供给层26; 定位成覆盖再生长层27的绝缘层9; 和位于绝缘层9上的栅电极G.在p型阻挡层中,Mg浓度A(cm-3)和氢浓度B(cm-3)满足0.1

    Vertical GaN-based semiconductor device
    5.
    发明授权
    Vertical GaN-based semiconductor device 有权
    垂直GaN基半导体器件

    公开(公告)号:US08969920B2

    公开(公告)日:2015-03-03

    申请号:US13824248

    申请日:2011-07-06

    摘要: A vertical semiconductor device in which pinch-off characteristics and breakdown voltage characteristics can be stably improved by fixing the electric potential of a p-type GaN barrier layer with certainty is provided. The semiconductor device includes a GaN-based stacked layer having an opening, a regrown layer including a channel located so as to cover a wall surface of the opening, an n+-type source layer that is in ohmic contact with the source electrode, a p-type GaN barrier layer, and a p+-type GaN-based supplementary layer located between the p-type GaN barrier layer and the n+-type source layer. The p+-type GaN-based supplementary layer and the n+-type source layer form a tunnel junction to fix the electric potential of the p-type GaN barrier layer at a source potential.

    摘要翻译: 提供了通过确定地固定p型GaN势垒层的电位可以稳定地提高夹断特性和击穿电压特性的垂直半导体器件。 半导体器件包括具有开口的GaN基层叠层,包含覆盖开口壁面的沟道的再生长层,与源电极欧姆接触的n +型源极,p 位于p型GaN势垒层和n +型源极层之间的p +型GaN基辅助层。 p +型GaN基辅助层和n +型源极层形成隧道结,以将p型GaN阻挡层的电位固定在源极电位。

    Semiconductor device including GaN-based compound semiconductor stacked layer and method for producing the same
    6.
    发明授权
    Semiconductor device including GaN-based compound semiconductor stacked layer and method for producing the same 有权
    包括GaN基化合物半导体堆叠层的半导体器件及其制造方法

    公开(公告)号:US08981428B2

    公开(公告)日:2015-03-17

    申请号:US13822591

    申请日:2011-07-06

    摘要: There are provided a semiconductor device in which a drain leak current can be reduced in the transistor operation while high vertical breakdown voltage is achieved and a method for producing the semiconductor device. In the semiconductor device, an opening 28 that extends from an n+-type contact layer 8 and reaches an n-type drift layer 4 through a p-type barrier layer 6 is formed. The semiconductor device includes a regrown layer 27 located so as to cover portions of the p-type barrier layer 6 and the like that are exposed to the opening, the regrown layer 27 including an undoped GaN channel layer 22 and a carrier supply layer 26; an insulating layer 9 located so as to cover the regrown layer 27; and a gate electrode G located on the insulating layer 9. In the p-type barrier layer, the Mg concentration A (cm−3)and the hydrogen concentration B (cm−3) satisfy 0.1

    摘要翻译: 提供了一种半导体器件,其中在实现高的垂直击穿电压的同时,在晶体管操作中可以减小漏极漏电流,以及制造半导体器件的方法。 在半导体器件中,形成从n +型接触层8延伸并通过p型阻挡层6到达n型漂移层4的开口28。 半导体器件包括再生长层27,其被覆盖以覆盖暴露于开口的p型阻挡层6等的部分,再生长层27包括未掺杂的GaN沟道层22和载流子供给层26; 定位成覆盖再生长层27的绝缘层9; 和位于绝缘层9上的栅电极G.在p型阻挡层中,Mg浓度A(cm-3)和氢浓度B(cm-3)满足0.1

    METHOD FOR MANUFACTURING NITRIDE SEMICONDUCTOR ELEMENT
    7.
    发明申请
    METHOD FOR MANUFACTURING NITRIDE SEMICONDUCTOR ELEMENT 审中-公开
    制造氮化物半导体元件的方法

    公开(公告)号:US20130316507A1

    公开(公告)日:2013-11-28

    申请号:US13981856

    申请日:2011-08-24

    IPC分类号: H01L29/20

    摘要: A method for manufacturing a heterojunction field effect transistor 1 comprises the steps of: epitaxially growing a drift layer 20a on a support substrate 10; epitaxially growing a current blocking layer 20b which is a p-type semiconductor layer on the drift layer 20a at a temperature equal to or higher than 1000° C. by using hydrogen gas as a carrier gas; and epitaxially growing a contact layer 20c on the current blocking layer 20b by using at least one gas selected from the group consisting of nitrogen gas, argon gas, helium gas, and neon gas as a carrier gas.

    摘要翻译: 异质结场效应晶体管1的制造方法包括以下步骤:在支撑基板10上外延生长漂移层20a; 通过使用氢气作为载气,在等于或高于1000℃的温度下外延生长漂移层20a上的p型半导体层的电流阻挡层20b; 并且使用从由氮气,氩气,氦气和氖气组成的组中选择的至少一种气体作为载气,在电流阻挡层20b上外延生长接触层20c。

    Semiconductor device and method for producing the same
    8.
    发明授权
    Semiconductor device and method for producing the same 有权
    半导体装置及其制造方法

    公开(公告)号:US08816398B2

    公开(公告)日:2014-08-26

    申请号:US13824043

    申请日:2011-07-06

    摘要: There is provided a vertical GaN-based semiconductor device in which the on-resistance can be decreased while the breakdown voltage characteristics are improved using a p-type GaN barrier layer. The semiconductor device includes a regrown layer 27 including a channel located on a wall surface of an opening 28, a p-type barrier layer 6 whose end face is covered, a source layer 7 that is in contact with the p-type barrier layer, a gate electrode G located on the regrown layer, and a source electrode S located around the opening. In the semiconductor device, the source layer has a superlattice structure that is constituted by a stacked layer including a first layer (a layer) having a lattice constant smaller than that of the p-type barrier layer and a second layer (b layer) having a lattice constant larger than that of the first layer.

    摘要翻译: 提供了一种垂直GaN基半导体器件,其中可以使用p型GaN势垒层改善导通电阻,同时提高击穿电压特性。 半导体器件包括再生长层27,其包括位于开口28的壁表面上的沟道,其端面被覆盖的p型势垒层6,与p型势垒层接触的源极层7, 位于再生长层上的栅电极G和位于开口周围的源电极S. 在半导体器件中,源极层具有超晶格结构,该超晶格结构由包括具有比p型势垒层的晶格常数小的晶格常数的第一层(层)的层叠层和具有比p型阻挡层的晶格常数小的第二层(b层) 大于第一层的晶格常数。

    SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SAME
    9.
    发明申请
    SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SAME 有权
    半导体器件及其制造方法

    公开(公告)号:US20130221434A1

    公开(公告)日:2013-08-29

    申请号:US13884229

    申请日:2011-10-05

    IPC分类号: H01L29/78 H01L29/66

    摘要: It is an object to improve the breakdown voltage characteristics of a vertical semiconductor device having an opening and including a channel formed of two-dimensional electron gas in the opening. The vertical semiconductor device includes a GaN-based stacked layer 15 having an opening 28 and the GaN-based stacked layer 15 includes n-type GaN-based drift layer 4/p-type GaN-based barrier layer 6/n-type GaN-based contact layer 7. The vertical semiconductor device includes a regrown layer 27 located so as to cover the opening, the regrown layer 27 including an electron drift layer 22 and an electron supply layer 26, a source electrode S, and a gate electrode G located on the regrown layer. The gate electrode G covers a portion having a length corresponding to the thickness of the p-type GaN-based barrier layer and is terminated at a position on the wall surface, the position being away from the bottom portion of the opening.

    摘要翻译: 本发明的目的是提高具有开口的垂直半导体器件的击穿电压特性,并且在开口中包括由二维电子气形成的沟道。 垂直半导体器件包括具有开口28的GaN基叠层15,GaN基叠层15包括n型GaN基漂移层4 / p型GaN基阻挡层6 / n型GaN- 垂直半导体器件包括覆盖开口的再生长层27,包含电子漂移层22和电子供给层26的再生长层27,源电极S和位于 在再生长层上。 栅电极G覆盖长度对应于p型GaN基阻挡层的厚度的部分,并且终止在壁表面上的位置,该位置远离开口的底部。

    SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING THE SAME
    10.
    发明申请
    SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING THE SAME 有权
    半导体器件及其制造方法

    公开(公告)号:US20130181255A1

    公开(公告)日:2013-07-18

    申请号:US13824043

    申请日:2011-07-06

    IPC分类号: H01L29/778 H01L29/66

    摘要: There is provided a vertical GaN-based semiconductor device in which the on-resistance can be decreased while the breakdown voltage characteristics are improved using a p-type GaN barrier layer. The semiconductor device includes a regrown layer 27 including a channel located on a wall surface of an opening 28, a p-type barrier layer 6 whose end face is covered, a source layer 7 that is in contact with the p-type barrier layer, a gate electrode G located on the regrown layer, and a source electrode S located around the opening. In the semiconductor device, the source layer has a superlattice structure that is constituted by a stacked layer including a first layer (a layer) having a lattice constant smaller than that of the p-type barrier layer and a second layer (b layer) having a lattice constant larger than that of the first layer.

    摘要翻译: 提供了一种垂直GaN基半导体器件,其中可以使用p型GaN势垒层改善导通电阻,同时提高击穿电压特性。 半导体器件包括再生长层27,其包括位于开口28的壁表面上的沟道,其端面被覆盖的p型势垒层6,与p型势垒层接触的源极层7, 位于再生长层上的栅电极G和位于开口周围的源电极S. 在半导体器件中,源极层具有超晶格结构,该超晶格结构由包括具有比p型势垒层的晶格常数小的晶格常数的第一层(层)的层叠层和具有比p型阻挡层的晶格常数小的第二层(b层) 大于第一层的晶格常数。