摘要:
A method for forming a compact LCD package and devices formed by such method are disclosed. In the method, an LCD display panel is formed by bonding an upper glass panel and a lower glass panel together and exposing an edge portion formed by a larger lower glass panel. Conductive traces formed of a conductive film layer such as ITO is provided on the edge portion of the LCD display panel for providing electrical connection to the drive lines and scan lines for the LCD panel. A two-step bonding method is used to first bond a printed circuit board in a pre-bonding step to the exposed edge portion of the LCD panel by using an anisotropic conductive film layer. The bonding is conducted under pressure and heat such that electrical communication is established through the conductive metal particles contained in the anisotropic conductive film. In a second, or post-bonding step, an IC chip or a driver chip is bonded to the top of the PCB by a multiplicity of solder bumps formed on the driver chip connecting electrically to a second multiplicity of conductive pads formed on top of the PCB substrate. The present invention novel method therefore produces a more compact LCD package which saves a planar area in an edge portion by at least 50%. In the first pre-bonding method that utilizes an anisotropic conductive film, fabrication equipment for an outer lead bonding method can be utilized. In the post-bonding step, fabrication equipment for an inner lead bonding method can be used.
摘要:
A manually operated switch for a faucet has a body, an inner pipe, a switching valve assembly. The body is hollow. The inner pipe is located inside of the body and has a flowing way. The flowing way is formed through the inner pipe. The switching valve assembly is slidably mounted inside of the flowing way of the inner pipe and extends out the body. When the switching valve assembly closes the flowing way of the inner pipe, the water pressure will keep the switching valve assembly closed. After the water pressure applied to the switching valve assembly is released or dismissed, the switching valve assembly returns back to an original position so that the flowing way is opened. The opening and closing flowing way can manually control the way of water flowing so that a user may not be scared or burned by the water.
摘要:
A method for reel-type packaging flexible printed circuit boards (FPCs) is disclosed. Firstly, a flexible plate having a plurality of FPC patterns is cut out to form several bar-like materials, wherein each of the bar-like materials has a plurality of aligned FPCs thereon. Subsequently, the bar-like materials are wound onto a reel one by one to form a reel-type package so as to prevent the FPCs from crumpling, curving and deforming when suffering an external force.
摘要:
First, a substrate is provided and a photoresist layer is coated thereon. Then, a film having a pattern is used as a mask to perform an exposing and developing process for patterning the photoresist layer. Following that, LIGA technology is employed to form a thin film having a pattern corresponding to the pattern of the film.
摘要:
A liquid crystal display module includes a substrate, one or more first leads, one or more shorting bars. one or more second leads and one or more cutting traces. The first leads and the shorting bars are disposed over the substrate. The shorting bars are adjacent to the first leads and electrically connected to the first leads via one or more connecting lines. The second leads are mounted with the first leads respectively and are electrically connected to the corresponding first leads. The cutting traces are used for electrically disconnecting the first leads from the shorting bars. A laser beam is used to cut off the connecting lines along the cutting trace after the liquid crystal display module has been tested, so that the short bar is electrically disconnected from the first leads, and a disconnecting point is formed on the intersection of the each cutting trace and connecting line.
摘要:
A filling paste structure and process of wafer level package is disclosed. The process comprises filling an adhesive material to fill among plurality of dice and cover the plurality of dice. The pluralities of dice are adhered to glue pattern with viscosity in common state formed on a removable substrate. A rigid substrate is coated by adhesive material to adhere the dice. Then, pluralities of dice are departed from the glue pattern by a special environment after attaching the rigid base substrate.
摘要:
A method for reel-type packaging flexible printed circuit boards (FPCs) is disclosed. Firstly, a flexible plate having a plurality of FPC patterns is cut out to form several bar-like materials, wherein each of the bar-like materials has a plurality of aligned FPCs thereon. Subsequently, the bar-like materials are wound onto a reel one by one to form a reel-type package so as to prevent the FPCs from crumpling, curving and deforming when suffering an external force.
摘要:
An image sensor die comprises a substrate and an image sensor array formed over the substrate. Micro lens are disposed on the image sensor array. A protection layer is formed on the micro lens to prevent the micro lens from particle containment.
摘要:
A bump layout on the active region of a driver IC for increasing overall bump count. The layout fits IC packages that have a narrow and long body profile. Bumps are positioned close to the long side and central regions of the active region so that low marking pressure on the shorter sides of the package during chip-glass bondage is avoided. Dummy bumps may also be positioned close to the shorter sides of the package so that pressure distribution is optimized during chip-glass bondage.