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19 条记录 (耗时 0.026 秒)

    Check-valved silicon diaphragm pump and method of fabricating the same
    1.
    发明授权
    Check-valved silicon diaphragm pump and method of fabricating the same 有权
    检查阀硅隔膜泵及其制造方法

    公开(公告)号：US06334761B1

    公开(公告)日：2002-01-01

    申请号：US09517226

    申请日：2000-03-02

    申请人： Yu-Chong Tai ,  Ellis Meng ,  Xuan-Qi Wang ,  Charles Grosjean

    发明人： Yu-Chong Tai ,  Ellis Meng ,  Xuan-Qi Wang ,  Charles Grosjean

    IPC分类号： F04B1700

    CPC分类号： F16K99/0001 ,  F04B43/043 ,  F15C5/00 ,  F16K99/0009 ,  F16K99/0046 ,  F16K99/0051 ,  F16K2099/0074 ,  F16K2099/0094 ,  Y10T137/7888 ,  Y10T137/7895

    摘要： A silicone rubber diaphragm pump utilizing a pair of MEMS Parylene check valves and a miniature solenoid plunger and actuator is comprised of a spacer sandwiched by a silicone rubber diaphragm on one side and a check valve support on the other. The check valves in the check valve support form the inlet and outlet to a pumping chamber defined between the check valve support and silicone rubber diaphragm. The pumping action has been demonstrated by driving the silicone diaphragm with the plunger using the solenoid type actuator to generate over and under pressures in the chamber. This forces the pumped medium into and out of the chamber, thus allowing the medium to be transported. Tubing or connectors affixed to the inlet and outlet ports of the check valve support structure allow for external fluidic access. The pump works with both gas and liquid.

    摘要翻译： 使用一对MEMS Parylene止回阀和微型电磁阀柱塞和致动器的硅橡胶隔膜泵由一侧上的硅橡胶隔膜和另一侧的止回阀支架夹持的间隔件组成。 止回阀支架中的止回阀形成在止回阀支撑件和硅橡胶隔膜之间限定的泵送室的入口和出口。 已经通过使用螺线管型致动器来驱动具有柱塞的硅树脂隔膜来产生泵送作用，以在腔室中产生过压和过压。 这迫使泵送的介质进出室，从而允许介质被输送。 固定在止回阀支撑结构的入口和出口上的管道或连接件允许进行外部流体通路。 泵与气体和液体一起使用。

    Planar micropump
    7.
    发明授权
    Planar micropump 有权
    平面微型泵

    公开(公告)号：US06520753B1

    公开(公告)日：2003-02-18

    申请号：US09587666

    申请日：2000-06-05

    申请人： Charles Grosjean ,  Yu-Chong Tai

    发明人： Charles Grosjean ,  Yu-Chong Tai

    IPC分类号： F09B45053

    CPC分类号： F04B43/06 ,  F04B19/24 ,  F04B43/02 ,  F04B43/043 ,  F04B43/073

    摘要： A micropump including a chamber plate with connected pumping chambers for accepting small volumes of a fluid and a pumping structure. The pumping structure includes a flexible membrane, portions of which may be inflated into associated pumping chambers to pump the fluid out of the chamber or seal the chamber. A working fluid in cavities below the flexible membrane portions are used to inflate the membrane. The cavities may include a suspended heating element to enable a thermopneumatic pumping operation. The pumping chambers are shaped to closely correspond to the shape of the associated flexible membrane portion in its inflated state.

    摘要翻译： 微型泵包括具有连接的泵室的室板，用于接收小体积的流体和泵送结构。 泵送结构包括柔性膜，其一部分可以膨胀到相关联的泵送室中以将流体泵送出室或密封室。 在柔性膜部分下面的空腔中的工作流体用于使膜膨胀。 空腔可以包括悬挂的加热元件，以实现热气动泵送操作。 泵送室被成形为在其膨胀状态下与相关联的柔性膜部分的形状紧密对应。

    Substrate contact for a MEMS device
    9.
    发明申请
    Substrate contact for a MEMS device 审中-公开

    公开(公告)号：US20080119003A1

    公开(公告)日：2008-05-22

    申请号：US11941057

    申请日：2007-11-15

    申请人： Charles Grosjean ,  Paul Merritt Hagelin ,  Nicholas Ian Buchan

    发明人： Charles Grosjean ,  Paul Merritt Hagelin ,  Nicholas Ian Buchan

    IPC分类号： H01L21/00

    CPC分类号： B81C1/00095

    摘要： One embodiment of the present invention sets forth a substrate contact for a MEMS device die, where the substrate contact is formed through an electrically insulative layer in the device die that is positioned between a handle wafer layer and a MEMS device layer formed on the handle wafer layer. The substrate contact serves as a path to ground for the MEMS handle wafer layer and is formed during the fabrication process of the MEMS device. One advantage of the disclosed invention is that a robust, low-impedance path to ground is provided for the MEMS handle wafer layer, with minimal impact on the process of fabricating a MEMS device.

    Substrate contact for a MEMS device
    10.
    发明申请
    Substrate contact for a MEMS device 审中-公开
    MEMS器件的基板接触

    公开(公告)号：US20080116534A1

    公开(公告)日：2008-05-22

    申请号：US11941053

    申请日：2007-11-15

    申请人： Charles Grosjean ,  Paul Merritt Hagelin ,  Nicholas Ian Buchan

    发明人： Charles Grosjean ,  Paul Merritt Hagelin ,  Nicholas Ian Buchan

    IPC分类号： H01L29/84

    CPC分类号： B81C1/00301 ,  B81B2207/092

    摘要： One embodiment of the present invention sets forth a substrate contact for a MEMS device die, where the substrate contact is formed through an electrically insulative layer in the device die that is positioned between a handle wafer layer and a MEMS device layer formed on the handle wafer layer. The substrate contact serves as a path to ground for the MEMS handle wafer layer and is formed during the fabrication process of the MEMS device. One advantage of the disclosed invention is that a robust, low-impedance path to ground is provided for the MEMS handle wafer layer, with minimal impact on the process of fabricating a MEMS device.

    摘要翻译： 本发明的一个实施例提出了用于MEMS器件裸片的衬底接触，其中衬底接触通过器件管芯中的电绝缘层形成，该电绝缘层位于处理晶片层和形成在处理晶片上的MEMS器件层之间 层。 衬底接触件用作MEMS处理晶片层的接地路径，并且在MEMS器件的制造过程期间形成。 所公开的发明的一个优点是为MEMS处理晶片层提供了坚固的，低阻抗的接地路径，对制造MEMS器件的过程的影响最小。