摘要:
A method includes performing a first programming operation on a plurality of memory cells in a same programming cycle; and performing a verification operation on the plurality of memory cells to find failed memory cells in the plurality of memory cells, wherein the failed memory cells are not successfully programmed in the first programming operation; and performing a second programming operation on the failed memory cells. Passed memory cells successfully programmed in the first programming operation are not programmed in the second programming operation.
摘要:
A method includes performing a first programming operation on a plurality of memory cells in a same programming cycle; and performing a verification operation on the plurality of memory cells to find failed memory cells in the plurality of memory cells, wherein the failed memory cells are not successfully programmed in the first programming operation; and performing a second programming operation on the failed memory cells. Passed memory cells successfully programmed in the first programming operation are not programmed in the second programming operation.
摘要:
A method for forming a tip is disclosed. A layer is formed overlying a substrate. A mask layer is formed overlying the layer. The mask is patterned to form a mask pattern comprising an inner portion and an outer portion, wherein the inner portion is surrounded by the outer portion. The layer uncovered by the mask pattern is treated to form a reaction mask, wherein at least one portion of the reaction mask connect to form a tip of the layer under the inner portion of the mask pattern.
摘要:
Voltage-dropping components are bypassed during testing of the erasing of a flash memory device thereby effectively lowering the applied erase voltage to the marginal level desired (VME). These voltage-dropping components may be a plurality of diode-connected NMOS transistors. If a plurality of diode-connected NMOS transistors are used, the voltage applied to the flash macro is reduced by m*Vt, where m is the number of bypassed diode connected NMOS transistors and Vt is the threshold voltage of the NMOS transistors. In normal operation, the voltage dropping components are placed in series with the charge pump, thereby returning the voltage applied to the flash macro to the normal level (VNE).
摘要:
A P-type Metal-Oxide-Semiconductor Field Effect Transistor (PMOSFET) includes a gate, a first source/drain region connected to the gate, and a second source/drain region on an opposite side of the gate than the first source/drain region. A first Schottky diode includes a first anode connected to the first source/drain region, and a first cathode connected to a body of the PMOSFET. A second Schottky diode includes a second anode connected to the second source/drain region, and a second cathode connected to the body of the PMOSFET.
摘要:
A semiconductor device and method for fabricating a semiconductor device is disclosed. An exemplary semiconductor device includes a substrate including a metal oxide device. The metal oxide device includes first and second doped regions disposed within the substrate and interfacing in a channel region. The first and second doped regions are doped with a first type dopant. The first doped region has a different concentration of dopant than the second doped region. The metal oxide device further includes a gate structure traversing the channel region and the interface of the first and second doped regions and separating source and drain regions. The source region is formed within the first doped region and the drain region is formed within the second doped region. The source and drain regions are doped with a second type dopant. The second type dopant is opposite of the first type dopant.
摘要:
A semiconductor device and method for fabricating a semiconductor device is disclosed. An exemplary semiconductor device includes a substrate including a metal oxide device. The metal oxide device includes first and second doped regions disposed within the substrate and interfacing in a channel region. The first and second doped regions are doped with a first type dopant. The first doped region has a different concentration of dopant than the second doped region. The metal oxide device further includes a gate structure traversing the channel region and the interface of the first and second doped regions and separating source and drain regions. The source region is formed within the first doped region and the drain region is formed within the second doped region. The source and drain regions are doped with a second type dopant. The second type dopant is opposite of the first type dopant.
摘要:
A system is disclosed for constructing a reconfigurable programmable logic device (PLD) comprising a first P-channel nonvolatile memory cell with a first source, a first drain and a first gate coupled to a first input node, a second P-channel nonvolatile memory cell with a second source, a second drain and a second gate coupled to a second input node, and an NMOS transistor with a third source and a third drain, wherein the first and second sources are commonly connected to a positive voltage supply (Vcc), the first, second and third drains are commonly connected to an output node and the third source is coupled to a complementary low voltage supply (Vss).
摘要:
A P-type Metal-Oxide-Semiconductor Field Effect Transistor (PMOSFET) includes a gate, a first source/drain region connected to the gate, and a second source/drain region on an opposite side of the gate than the first source/drain region. A first Schottky diode includes a first anode connected to the first source/drain region, and a first cathode connected to a body of the PMOSFET. A second Schottky diode includes a second anode connected to the second source/drain region, and a second cathode connected to the body of the PMOSFET.
摘要:
A power switch includes a control circuit, a cross-coupled amplifier, a first switching circuit coupled between a first output terminal and the first controlled ground terminal, and a second switching circuit coupled between a second output terminal and the second controlled ground terminal. The control circuit is configured to connect the second controlled ground terminal to a ground during a first period that a voltage level at the first output terminal is switched from the ground to a first voltage level and to set the second controlled ground terminal at an elevated ground level during a second period that the voltage level at the first output terminal remains at the first voltage level.