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    Method of producing light emitting apparatus
    2.
    发明授权
    Method of producing light emitting apparatus 有权
    制造发光装置的方法

    公开(公告)号：US07708613B2

    公开(公告)日：2010-05-04

    申请号：US11656580

    申请日：2007-01-23

    申请人： Yuichi Taguchi ,  Masahiro Sunohara ,  Hideaki Sakaguchi ,  Akinori Shiraishi ,  Naoyuki Koizumi ,  Kei Murayama ,  Mitsutoshi Higashi

    发明人： Yuichi Taguchi ,  Masahiro Sunohara ,  Hideaki Sakaguchi ,  Akinori Shiraishi ,  Naoyuki Koizumi ,  Kei Murayama ,  Mitsutoshi Higashi

    IPC分类号： H01J1/62

    CPC分类号： H01L33/507 ,  H01L24/97 ,  H01L2224/16225 ,  H01L2924/16195 ,  H01L2933/0041

    摘要： A method of producing a light emitting apparatus including a light emitting element, a light emitting element housing having a recess for housing the light emitting element, and a translucent substrate placed on the light emitting element housing is disclosed. The disclosed method includes a fluorescent-substance-containing resin forming step of forming a fluorescent-substance-containing resin on a first side of the translucent substrate which first side is opposite to a second side of the translucent substrate which second side faces the recess. In the fluorescent-substance-containing resin forming step, luminance and chromaticity of light that is emitted from the light emitting element and then transmitted by the fluorescent-substance-containing resin are measured and a thickness of the fluorescent-substance-containing resin is adjusted based on the measured luminance and chromaticity so that light emitted from the light emitting apparatus attains the specified luminance and chromaticity.

    摘要翻译： 公开了一种制造包括发光元件的发光装置的方法，具有用于容纳发光元件的凹部的发光元件壳体和放置在发光元件壳体上的透光性基板。 所公开的方法包括在透光性基板的第一面上形成含有荧光物质的树脂的荧光物质的树脂形成工序，第一面与透光性基板的第二面相对，第二面与凹部相对。 在含荧光物质的树脂形成步骤中，测量从发光元件发射并随后由含荧光物质的树脂透射的光的亮度和色度，并调节含荧光物质的树脂的厚度 基于测量的亮度和色度，使得从发光装置发射的光达到规定的亮度和色度。

    Probe card
    5.
    发明授权
    Probe card 有权
    探针卡

    公开(公告)号：US07888953B2

    公开(公告)日：2011-02-15

    申请号：US12464916

    申请日：2009-05-13

    申请人： Yuichi Taguchi ,  Akinori Shiraishi ,  Masahiro Sunohara ,  Kei Murayama ,  Hideaki Sakaguchi

    发明人： Yuichi Taguchi ,  Akinori Shiraishi ,  Masahiro Sunohara ,  Kei Murayama ,  Hideaki Sakaguchi

    IPC分类号： G01R31/02

    CPC分类号： G01R1/06716 ,  G01R1/06755 ,  G01R1/07314 ,  G01R3/00

    摘要： A probe card is disclosed that includes a board having a first surface and a second surface facing away from each other and a through hole formed between the first and second surfaces; and a probe needle having a penetration part and a support part. The penetration part is placed in the through hole without contacting the board and projects from the first and second surfaces of the board. The support part is integrated with a first one of the end portions of the penetration part and connected to one of the first and second surfaces of the board. The support part has a spring characteristic. The penetration part is configured to have a second one of its end portions come into contact with an electrode pad of a semiconductor chip at the time of conducting an electrical test on the semiconductor chip.

    摘要翻译： 公开了一种探针卡，其包括具有第一表面和彼此背离的第二表面的板和形成在第一表面和第二表面之间的通孔; 以及具有穿透部和支撑部的探针。 穿透部分放置在通孔中而不与板接触并从板的第一和第二表面突出。 所述支撑部与所述贯通部的所述端部的第一端部一体化，且与所述基板的所述第一面和所述第二表面中的一个连接。 支撑部分具有弹簧特性。 穿透部被配置为在半导体芯片上进行电气测试时使其第二端部与半导体芯片的电极焊盘接触。