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    Two-dimensional laser diode array light-emitting device
    1.
    发明授权
    Two-dimensional laser diode array light-emitting device 失效
    二维激光二极管阵列发光器件

    公开(公告)号：US06934309B2

    公开(公告)日：2005-08-23

    申请号：US10216324

    申请日：2002-08-12

    申请人： Yuji Nishikawa ,  Hiroshi Takigawa ,  Tetsuro Sakano ,  Koji Hayano ,  Akinori Ohyama

    发明人： Yuji Nishikawa ,  Hiroshi Takigawa ,  Tetsuro Sakano ,  Koji Hayano ,  Akinori Ohyama

    IPC分类号： H01S5/024 ,  H01S5/22 ,  H01S5/40 ,  H01S3/04

    CPC分类号： H01S5/4025 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48465 ,  H01S5/02272 ,  H01S5/02276 ,  H01S5/024 ,  H01S5/02423 ,  H01L2924/00014 ,  H01L2924/00

    摘要： A two-dimensional LD (laser diode) array light-emitting device constituted by stacking light-emitting units each having a LD bar and a cooling assembly for cooling the LD bar with a simplified electrical connection structure to reduce manufacturing cost. The cooling assembly is electrically connected with one electrode of the LD bar through the die spacer so that a part of the cooling assembly serves as one electrode of the light-emitting unit. The other electrode of the LD bar is electrically connected with a webbed extending section of a conductive layer of a TAB (tape-automated bonding) sheet so that the conductive layer serves as the other electrode of the light-emitting unit. A space between the adjacent cooling assemblies for arranging the LD bar is adjusted by the spacer sheet intervened between the TAB sheet and the cooling assembly.

    摘要翻译： 一种二维LD（激光二极管）阵列发光器件，其通过堆叠具有LD棒的发光单元和用于以简化的电连接结构冷却LD棒的冷却组件而构成，以降低制造成本。 冷却组件通过模具间隔件与LD棒的一个电极电连接，使得冷却组件的一部分用作发光单元的一个电极。 LD条的另一个电极与TAB（带自动键合）片的导电层的网状延伸部电连接，使得导电层用作发光单元的另一个电极。 用于布置LD条的相邻冷却组件之间的空间通过介于TAB板和冷却组件之间的间隔板来调节。

    Cooling device for semiconductor component
    2.
    发明申请
    Cooling device for semiconductor component 审中-公开
    半导体元件冷却装置

    公开(公告)号：US20050141574A1

    公开(公告)日：2005-06-30

    申请号：US10933436

    申请日：2004-09-03

    申请人： Tetsuro Sakano ,  Hiroshi Takigawa ,  Yuji Nishikawa ,  Koji Hayano ,  Akinori Ohyama ,  Ryusuke Miyata

    发明人： Tetsuro Sakano ,  Hiroshi Takigawa ,  Yuji Nishikawa ,  Koji Hayano ,  Akinori Ohyama ,  Ryusuke Miyata

    IPC分类号： H05K7/20 ,  H01L23/473 ,  H01S3/04 ,  H01S5/02 ,  H01S5/024 ,  H01S5/40

    CPC分类号： H01S5/02423 ,  H01L2924/0002 ,  H01S5/02236 ,  H01S5/02272 ,  H01S5/4031 ,  H01L2924/00

    摘要： A cooling device for a semiconductor component which increases mechanical strength thereof and reduces a pressure loss of coolant. Plate members constituting the cooling device are formed with flow passages such as coolant supply and discharge openings, grooves divided by ridges, and through portions separated by projections or partitions. The ridges, projections, and partitions are joined to a adjacent plate member to increase the joining strength, which is further increased by forming the ridges, projections, and partitions of different plate members at the same positions. In the case of laminating the plate members having surfaces formed with solder layers, a number of minute vacant spaces are formed in those joining faces of the plate members which are not formed with passages, etc., and solder filets are formed over the entire joining faces to increase the joining strength. The grooves and through portions can be formed by chemical etching together with outer shapes of the plate members. A plurality of plate members can be fabricated from a single sheet material at a time.

    摘要翻译： 一种用于半导体部件的冷却装置，其增加其机械强度并降低冷却剂的压力损失。 构成冷却装置的板状构件形成有诸如冷却剂供应和排出开口的流动通道，由脊部分开的凹槽以及通过突出部或隔板分隔开的部分。 脊，突起和隔板连接到相邻的板构件以增加接合强度，这通过在相同位置形成不同板构件的脊，突起和隔板而进一步增加。 在层叠具有形成有焊料层的表面的板构件的情况下，在不形成有通路等的板构件的接合面中形成多个微小的空隙，并且在整个接合处形成焊料片 面对增加接合强度。 凹槽和贯通部分可以通过化学蚀刻与板构件的外形形成。 一次可以由单张片材制造多个板构件。

    Cooling device
    3.
    发明授权
    Cooling device 失效
    冷却装置

    公开(公告)号：US06865200B2

    公开(公告)日：2005-03-08

    申请号：US10178454

    申请日：2002-06-25

    申请人： Hiroshi Takigawa ,  Tetsuro Sakano ,  Yuji Nishikawa ,  Masao Sato ,  Shinya Naito ,  Ryusuke Miyata ,  Koji Hayano

    发明人： Hiroshi Takigawa ,  Tetsuro Sakano ,  Yuji Nishikawa ,  Masao Sato ,  Shinya Naito ,  Ryusuke Miyata ,  Koji Hayano

    IPC分类号： H05K7/20 ,  F28F3/08 ,  H01L23/473 ,  H01S5/024 ,  H01S5/40 ,  H01S3/04

    CPC分类号： F28F3/086 ,  H01S5/024 ,  H01S5/02423 ,  H01S5/4031 ,  H01S5/405

    摘要： A cooling device suitable for cooling a laser diode bar constituting a surface illuminating device as a light source for exciting a laser medium of a solid-state laser oscillator of high power. The cooling device is capable of flowing coolant at sufficient flow rate by reducing the pressure loss in the flow passage of the coolant in the device, to realize a light source device of small thickness with high cooling capability and high reliability. The cooling device comprises a first plate member, one or more second plate member and a third plate member to be joined together to form a laminated body. The second plate member has grooved paths formed on both surfaces thereof and having depths greater than a half of thickness of the plate member, and also opened paths for communicating grooved paths formed on the first plate member and the third plate member. The pressure loss in the flow passage of coolant is reduced by increasing a sectional area of the flow passage by the grooved paths and the opened path of the second plate member without lowering mechanical strength of the device and without increasing a manufacturing cost of the device.

    摘要翻译： 一种适于冷却构成表面照明装置的激光二极管条的冷却装置，作为用于激发高功率的固态激光振荡器的激光介质的光源。 冷却装置能够通过减小装置内的冷却剂的流路中的压力损失，以足够的流量流动冷却剂，实现具有高冷却能力和高可靠性的小厚度的光源装置。 冷却装置包括第一板构件，一个或多个第二板构件和第三板构件，以将其接合在一起以形成层压体。 第二板构件具有形成在其两个表面上并且具有大于板构件的厚度的一半的深度的凹槽路径，以及用于连通形成在第一板构件和第三板构件上的沟槽路径的开口路径。 通过在不降低装置的机械强度的情况下增加通过槽形路径和第二板构件的打开路径的流动通道的截面积而减小冷却剂的流动通道中的压力损失，并且不增加装置的制造成本。

    Semiconductor laser apparatus
    4.
    发明申请
    Semiconductor laser apparatus 审中-公开
    半导体激光装置

    公开(公告)号：US20060140238A1

    公开(公告)日：2006-06-29

    申请号：US11313756

    申请日：2005-12-22

    申请人： Yuji Nishikawa ,  Akinori Ohyama ,  Ryusuke Miyata

    发明人： Yuji Nishikawa ,  Akinori Ohyama ,  Ryusuke Miyata

    IPC分类号： H01S5/00

    CPC分类号： H01S5/02272 ,  H01S5/02236 ,  H01S5/0224 ,  H01S5/02469 ,  H01S5/4031

    摘要： A semiconductor laser apparatus (10) is provided and comprises a mounting substrate (6), a semiconductor laser chip (1) joined to a mounting surface (6a) of said mounting substrate (6) with solder (5), emitters (3) and non-active mesa portions (4) formed on a joining surface (1a) of said semiconductor laser chip (1) to be joined to said mounting surface (6a) of said mounting substrate (6); each of said emitters (3) and non-active mesa portions (4) being separated from the other by component separating channels (2) formed on said joining surface (1a) of said mounting substrate (1); wherein at least one mesa separating channel for separating said non-active mesa portion (4) is formed in said non-active mesa portion (4) at the joining surface (1a) of the semiconductor chip (1). Thereby, the joining strength of the solder is sufficient for preventing the separation of the semiconductor laser chip from the mounting substrate. The solder between the joining surface of the semiconductor laser chip and the mounting surface of the mounting substrate includes fillets (9a, 9b) disposed in the inner walls of the component separating channel and the mesa separating channel. The fill factor is preferably 50% or more.

    摘要翻译： 提供一种半导体激光装置（10），其包括安装基板（6），用焊料（5）接合到所述安装基板（6）的安装面（6a）上的半导体激光芯片（1），发射体（3） ）和与所述安装基板（6）的所述安装面（6a）接合的所述半导体激光芯片（1）的接合面（1a）上形成的非活性台面部（4）。 每个所述发射器（3）和非活性台面部分（4）通过形成在所述安装衬底（1）的所述接合表面（1a）上的部件分离通道（2）与另一个分离; 其特征在于，在所述非活性台面部（4）中，在所述半导体芯片（1）的接合面（1a）形成有用于分离所述非活性台面部（4）的至少一个台面分离通道。 因此，焊料的接合强度足以防止半导体激光器芯片与安装基板分离。 半导体激光芯片的接合面和安装基板的安装面之间的焊料包括设置在部件分离通道和台面分离通道的内壁中的圆角（9a，9b）。 填充率优选为50％以上。

    High-power laser unit wherein laser output can be accurately corrected
    5.
    发明授权
    High-power laser unit wherein laser output can be accurately corrected 有权
    其中激光输出可被精确校正的大功率激光单元

    公开(公告)号：US08428092B2

    公开(公告)日：2013-04-23

    申请号：US13308753

    申请日：2011-12-01

    申请人： Koji Hayano ,  Atsushi Mori ,  Yuji Nishikawa

    发明人： Koji Hayano ,  Atsushi Mori ,  Yuji Nishikawa

    IPC分类号： H01S3/00

    CPC分类号： H01S3/131 ,  H01S3/1317

    摘要： A high-power laser unit capable of accurately correcting laser output from low to rated outputs, even when the laser unit has a laser power monitor which may be affected by environmental factors inside or outside the laser unit, by effectively reducing environmental factors. The laser unit has a laser power monitor for measuring laser output, and a laser controller for correcting the laser output by correcting an amount of excitation energy to a laser power supply so that a measurement value coincides with a laser output command value. The laser unit has a laser output commanding part for generating a laser output command. When it is not necessary to correct the laser output command, the laser output command is converted into an excitation energy command value and sent to the power supply. Otherwise, an output correcting part of the laser controller corrects the laser output command.

    摘要翻译： 即使激光单元具有可能受激光单元内部或外部的环境因素影响的激光功率监视器，也能够有效降低环境因素，从而能够精确地校正从低电平到额定输出的激光输出的高功率激光单元。 激光单元具有用于测量激光输出的激光功率监视器，以及激光控制器，用于通过向激光电源校正激发能量的量来校正激光输出，使得测量值与激光输出命令值一致。 激光单元具有用于产生激光输出命令的激光输出指令部。 当不需要校正激光输出命令时，将激光输出命令转换为激发能量指令值并发送到电源。 否则，激光控制器的输出校正部分校正激光输出命令。

    Semiconductor laser device
    8.
    发明申请
    Semiconductor laser device 审中-公开
    半导体激光器件

    公开(公告)号：US20050111508A1

    公开(公告)日：2005-05-26

    申请号：US10995469

    申请日：2004-11-24

    申请人： Yuji Nishikawa ,  Hiroshi Takigawa ,  Ryusuke Miyata

    发明人： Yuji Nishikawa ,  Hiroshi Takigawa ,  Ryusuke Miyata

    IPC分类号： H01S5/02 ,  H01S5/022 ,  H01S5/024 ,  H01S5/40 ,  H01S5/00

    CPC分类号： H01S5/4031 ,  H01S5/0202 ,  H01S5/02236 ,  H01S5/0224 ,  H01S5/02272 ,  H01S5/02276 ,  H01S5/02469 ,  H01S2301/176

    摘要： A semiconductor laser device, including an LD array member having a monolithic linear-array configuration and provided with a plurality of emitters, respectively emitting a laser beam, in a parallel arrangement in a single semiconductor crystal. The LD array member includes a main area in which the emitters are disposed in the parallel arrangement, a first inactive area formed outside of the main area, and a second inactive area formed between the emitters disposed side-by-side in the main area. The first inactive area has a dimension larger than the second inactive area, as seen in a direction transverse to the plurality of emitters. The LD array member includes a first facet, in which emitting ends of the emitters are disposed, and a second facet opposite to the first facet; at least one of the first facet and the second facet being covered by a coating material. The LD array member also includes a pair of lateral faces respectively intersecting each of the first and second facets; at least one of the lateral faces being covered at least partially by a coating material.

    摘要翻译： 一种半导体激光器件，包括具有单片线性阵列配置的LD阵列构件，并且分别以单个半导体晶体的平行布置发射激光束并设置有多个发射极。 LD阵列构件包括其中发射器布置在并联装置中的主区域，形成在主区域外部的第一无效区域和形成在主区域并排布置的发射器之间的第二无效区域。 如横向于多个发射器的方向所见，第一无效区域的尺寸大于第二无效区域。 LD阵列构件包括其中设置发射器的发射端的第一小面和与第一小面相对的第二小面; 第一面和第二面中的至少一个被涂覆材料覆盖。 LD阵列构件还包括分别与第一和第二面各自相交的一对侧面; 至少一个侧面至少部分被涂层材料覆盖。

    Light source device for pumping solid-state laser medium
    9.
    发明授权
    Light source device for pumping solid-state laser medium 失效
    用于泵浦固态激光介质的光源装置

    公开(公告)号：US06850549B2

    公开(公告)日：2005-02-01

    申请号：US10200756

    申请日：2002-07-24

    申请人： Hiroshi Takigawa ,  Yuji Nishikawa ,  Masao Sato ,  Shinya Naito ,  Ryusuke Miyata

    发明人： Hiroshi Takigawa ,  Yuji Nishikawa ,  Masao Sato ,  Shinya Naito ,  Ryusuke Miyata

    IPC分类号： H01S3/094 ,  H01S3/042 ,  H01S3/0941 ,  H01S5/024 ,  H01S5/40 ,  H01S3/091

    CPC分类号： H01S3/0941 ,  H01S5/02423 ,  H01S5/4025

    摘要： A light source device for pumping a solid-state laser medium of a laser generator, which is compact and capable of economically using LD bars constituting the LD stack with easy maintenance. The light source device is constituted by a plurality of LD modules. Each LD module comprises a plurality of cooling devices on which LD bars are respectively mounted and connection plates on both sides thereof. The LD bars are stacked such that longitudinal directions thereof extend perpendicular to a stacking direction thereof. A desired number of LD modules are mechanically connected with each other using the connection plates to form the LD stack. A sealing member is intervened between confronting connection plates of adjacent LD modules, so that flow passages of coolant formed in the respective LD modules are continuously connected. The connection plates have functions of fixedly supporting the cooling devices of each LD module and electrically connecting the adjacent LD modules.

    摘要翻译： 一种用于泵浦激光发生器的固态激光介质的光源装置，其紧凑并且能够经济地使用容易维护的构成LD堆叠的LD棒。 光源装置由多个LD模块构成。 每个LD模块包括多个冷却装置，LD条分别安装在其上，连接板在其两侧。 LD条被堆叠成使得其纵向方向垂直于其堆叠方向延伸。 所需数量的LD模块使用连接板彼此机械连接以形成LD堆叠。 在相邻的LD模块的面对的连接板之间插入有密封构件，使得形成在各个LD模块中的冷却剂的流路连续地连接。 连接板具有固定地支撑每个LD模块的冷却装置并且电连接相邻的LD模块的功能。