摘要:
A cooling device suitable for cooling a laser diode bar constituting a surface illuminating device as a light source for exciting a laser medium of a solid-state laser oscillator of high power. The cooling device is capable of flowing coolant at sufficient flow rate by reducing the pressure loss in the flow passage of the coolant in the device, to realize a light source device of small thickness with high cooling capability and high reliability. The cooling device comprises a first plate member, one or more second plate member and a third plate member to be joined together to form a laminated body. The second plate member has grooved paths formed on both surfaces thereof and having depths greater than a half of thickness of the plate member, and also opened paths for communicating grooved paths formed on the first plate member and the third plate member. The pressure loss in the flow passage of coolant is reduced by increasing a sectional area of the flow passage by the grooved paths and the opened path of the second plate member without lowering mechanical strength of the device and without increasing a manufacturing cost of the device.
摘要:
A light source device for pumping a solid-state laser medium of a laser generator, which is compact and capable of economically using LD bars constituting the LD stack with easy maintenance. The light source device is constituted by a plurality of LD modules. Each LD module comprises a plurality of cooling devices on which LD bars are respectively mounted and connection plates on both sides thereof. The LD bars are stacked such that longitudinal directions thereof extend perpendicular to a stacking direction thereof. A desired number of LD modules are mechanically connected with each other using the connection plates to form the LD stack. A sealing member is intervened between confronting connection plates of adjacent LD modules, so that flow passages of coolant formed in the respective LD modules are continuously connected. The connection plates have functions of fixedly supporting the cooling devices of each LD module and electrically connecting the adjacent LD modules.
摘要:
A cooling device for a semiconductor component which increases mechanical strength thereof and reduces a pressure loss of coolant. Plate members constituting the cooling device are formed with flow passages such as coolant supply and discharge openings, grooves divided by ridges, and through portions separated by projections or partitions. The ridges, projections, and partitions are joined to a adjacent plate member to increase the joining strength, which is further increased by forming the ridges, projections, and partitions of different plate members at the same positions. In the case of laminating the plate members having surfaces formed with solder layers, a number of minute vacant spaces are formed in those joining faces of the plate members which are not formed with passages, etc., and solder filets are formed over the entire joining faces to increase the joining strength. The grooves and through portions can be formed by chemical etching together with outer shapes of the plate members. A plurality of plate members can be fabricated from a single sheet material at a time.
摘要:
A semiconductor laser device, including an LD array member having a monolithic linear-array configuration and provided with a plurality of emitters, respectively emitting a laser beam, in a parallel arrangement in a single semiconductor crystal. The LD array member includes a main area in which the emitters are disposed in the parallel arrangement, a first inactive area formed outside of the main area, and a second inactive area formed between the emitters disposed side-by-side in the main area. The first inactive area has a dimension larger than the second inactive area, as seen in a direction transverse to the plurality of emitters. The LD array member includes a first facet, in which emitting ends of the emitters are disposed, and a second facet opposite to the first facet; at least one of the first facet and the second facet being covered by a coating material. The LD array member also includes a pair of lateral faces respectively intersecting each of the first and second facets; at least one of the lateral faces being covered at least partially by a coating material.
摘要:
A laser oscillator enabling estimation of the lifetime of the pump light source by a simple configuration, provided with a pump light source, a power source supplying current to the pump light source, a laser crystal outputting laser light by the pump light emitted from the pump light source, a power sensor receiving laser light generated from the laser crystal and outputting a signal corresponding to the intensity of the laser light, a memory storing the operating time of the laser oscillator, and a processor judging if the signal output by the power sensor satisfies a predetermined condition and, if satisfying the predetermined condition, uses the value of the current supplied by the power source to the pump light source and the operating time stored in the memory to estimate the lifetime of the pump light source.
摘要:
A semiconductor laser apparatus (10) is provided and comprises a mounting substrate (6), a semiconductor laser chip (1) joined to a mounting surface (6a) of said mounting substrate (6) with solder (5), emitters (3) and non-active mesa portions (4) formed on a joining surface (1a) of said semiconductor laser chip (1) to be joined to said mounting surface (6a) of said mounting substrate (6); each of said emitters (3) and non-active mesa portions (4) being separated from the other by component separating channels (2) formed on said joining surface (1a) of said mounting substrate (1); wherein at least one mesa separating channel for separating said non-active mesa portion (4) is formed in said non-active mesa portion (4) at the joining surface (1a) of the semiconductor chip (1). Thereby, the joining strength of the solder is sufficient for preventing the separation of the semiconductor laser chip from the mounting substrate. The solder between the joining surface of the semiconductor laser chip and the mounting surface of the mounting substrate includes fillets (9a, 9b) disposed in the inner walls of the component separating channel and the mesa separating channel. The fill factor is preferably 50% or more.
摘要:
A laser unit using circulating cooling water, which may economically maintain the cleanliness of the cooling water and a channel for the cooling water. By a command of an operator, the activation of a water conveying device of the laser unit, the start of the laser oscillation, the stop of the laser oscillation and the stop of the conveying device are sequentially executed. When the laser unit is stopped for a relatively long period, an intermittent conveyance mode is automatically started in the laser unit. In this mode, the conveyance of the water starts after the passing of a first predetermined period of time and the conveyance stops after the passing of a second predetermined period of time. Similarly, the start and the stop of the conveyance of the water by the conveying device are alternately changed. When the laser oscillation should be started, the intermittent conveyance mode is terminated by the operator. The water conveyance device may be located within the laser unit or outside of a body of the laser unit.
摘要:
A cooling device of a laser diode array includes a stacking of a plurality of metal plate members formed with a branched groove pattern or apertures acting as a cooling water path, by a chemical etching process.
摘要:
A cooling device of a laser diode array includes a stacking of a plurality of metal plate members formed with a branched groove pattern or apertures acting as a cooling water path, by a chemical etching process.
摘要:
A two-dimensional LD (laser diode) array light-emitting device constituted by stacking light-emitting units each having a LD bar and a cooling assembly for cooling the LD bar with a simplified electrical connection structure to reduce manufacturing cost. The cooling assembly is electrically connected with one electrode of the LD bar through the die spacer so that a part of the cooling assembly serves as one electrode of the light-emitting unit. The other electrode of the LD bar is electrically connected with a webbed extending section of a conductive layer of a TAB (tape-automated bonding) sheet so that the conductive layer serves as the other electrode of the light-emitting unit. A space between the adjacent cooling assemblies for arranging the LD bar is adjusted by the spacer sheet intervened between the TAB sheet and the cooling assembly.