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    ULTRASONIC CLEANING METHOD AND APPARATUS
    3.
    发明申请
    ULTRASONIC CLEANING METHOD AND APPARATUS 有权
    超声波清洗方法和装置

    公开(公告)号：US20130298941A1

    公开(公告)日：2013-11-14

    申请号：US13980312

    申请日：2012-01-17

    申请人： Yukio Eda ,  Toshiyuki Ibayashi ,  Hiroyuki Kurimura

    发明人： Yukio Eda ,  Toshiyuki Ibayashi ,  Hiroyuki Kurimura

    IPC分类号： B08B3/12 ,  B08B3/08

    CPC分类号： B08B3/12 ,  B08B3/08 ,  C03C23/0075 ,  C03C2218/328

    摘要： There is provided an ultrasonic cleaning method capable of reliably cleaning to remove adhesive components even when the adhesive components adhere to a rigid substrate. The ultrasonic cleaning method comprises performing the following steps (1) to (5), in this order: (1) a step of immersing a rigid substrate having an adhesive adhering to a surface thereof in an aromatic alcohol-based cleaning liquid at 25 to 60° C.; (2) a step of cleaning off the adhesive on the rigid substrate by ultrasonic oscillation while keeping the state where the rigid substrate is immersed in the step (1); (3) a step of subsequently immersing the rigid substrate in a glycol ether-based cleaning liquid at 25 to 60° C.; (4) a step of rinsing off the aromatic alcohol-based cleaning liquid adhering to the rigid substrate by ultrasonic oscillation while keeping the state where the rigid substrate is immersed in the step (3); and (5) a step of subsequently rinsing off the glycol ether-based cleaning liquid and aromatic alcohol-based cleaning liquid adhering to the rigid substrate with water.

    摘要翻译： 提供了即使当粘合剂组分粘附到刚性基材上时也能够可靠地清洁以除去粘合剂组分的超声波清洗方法。 超声波清洗方法包括按照以下顺序进行以下的工序（1）〜（5）：（1）将具有附着在其表面上的粘合剂的刚性基材浸渍在25℃的芳香族醇系清洗液中的工序， 60℃。 （2）在步骤（1）中保持刚性基板浸渍的状态下，通过超声波振荡清洗刚性基板上的粘合剂的步骤; （3）在25〜60℃下将刚性基材浸渍在二醇醚系清洗液中的工序。 （4）在步骤（3）中保持硬质基板浸渍的状态的同时，通过超声波振荡清洗附着在刚性基板上的芳香族醇类清洗液的工序; 和（5）随后用水冲洗附着在刚性基材上的二醇醚系清洗液和芳香族醇系清洗液的工序。

    Ultrasonic cleaning method and apparatus
    4.
    发明授权
    Ultrasonic cleaning method and apparatus 有权

    公开(公告)号：US09643221B2

    公开(公告)日：2017-05-09

    申请号：US13980312

    申请日：2012-01-17

    申请人： Yukio Eda ,  Toshiyuki Ibayashi ,  Hiroyuki Kurimura

    发明人： Yukio Eda ,  Toshiyuki Ibayashi ,  Hiroyuki Kurimura

    IPC分类号： B08B3/08 ,  B08B3/12 ,  C03C23/00

    CPC分类号： B08B3/12 ,  B08B3/08 ,  C03C23/0075 ,  C03C2218/328

    摘要： There is provided an ultrasonic cleaning method capable of reliably cleaning to remove adhesive components even when the adhesive components adhere to a rigid substrate. The ultrasonic cleaning method comprises performing the following steps (1) to (5), in this order: (1) a step of immersing a rigid substrate having an adhesive adhering to a surface thereof in an aromatic alcohol-based cleaning liquid at 25 to 60° C.; (2) a step of cleaning off the adhesive on the rigid substrate by ultrasonic oscillation while keeping the state where the rigid substrate is immersed in the step (1); (3) a step of subsequently immersing the rigid substrate in a glycol ether-based cleaning liquid at 25 to 60° C.; (4) a step of rinsing off the aromatic alcohol-based cleaning liquid adhering to the rigid substrate by ultrasonic oscillation while keeping the state where the rigid substrate is immersed in the step (3); and (5) a step of subsequently rinsing off the glycol ether-based cleaning liquid and aromatic alcohol-based cleaning liquid adhering to the rigid substrate with water.

    Method for processing transluscent rigid substrate laminate and method for manufacturing plate shaped product
    5.
    发明授权
    Method for processing transluscent rigid substrate laminate and method for manufacturing plate shaped product 有权
    用于加工柔性基体层压板的方法和制造板状产品的方法

    公开(公告)号：US09227385B2

    公开(公告)日：2016-01-05

    申请号：US13885929

    申请日：2011-11-17

    申请人： Hiroyuki Kurimura ,  Hayato Miyazaki

    发明人： Hiroyuki Kurimura ,  Hayato Miyazaki

    IPC分类号： B32B37/02 ,  C03B33/07 ,  C09J4/00 ,  C09J5/00

    CPC分类号： B32B37/02 ,  C03B33/076 ,  C09J4/00 ,  C09J5/00 ,  C09J2205/31 ,  C09J2433/00 ,  Y02P40/57 ,  Y10T156/11

    摘要： There is provided a method by which it is possible to precisely process a translucent rigid substrate laminate. The method for processing a translucent rigid substrate laminate includes the steps of: preparing a translucent rigid substrate laminate by adhering two or more translucent rigid substrates with photocurable adhering agent; fixing the laminate to a cradle with predetermined adhesive; performing processing A for cutting the laminate, which is fixed to the cradle, in a thickness direction and forming a desired number of divided translucent rigid substrate laminates, or performing desired outline processing B on the laminate which is fixed to the cradle; and peeling the processed translucent rigid substrate laminate from the cradle by applying external force without heating the translucent rigid substrate laminate at 40° C. or more.

    摘要翻译： 提供了一种可以精确地处理半透明刚性基板层压体的方法。 用于处理半透明刚性基板层压体的方法包括以下步骤：通过用可光固化粘合剂粘合两个或多个半透明刚性基板来制备半透明刚性基板层压体; 用预定的粘合剂将层压板固定到支架上; 执行处理A，其在厚度方向上切割固定到托架上的层压体，并形成期望数量的分开的半透明刚性基板层压板，或者在固定到托架上的层压板上执行期望的轮廓加工B; 并且通过施加外力而将加工的半透明刚性基板层压体从支架上剥离，而不在40℃或更高温度下加热半透明刚性基板层压板。

    Method of manufacturing translucent rigid substrate laminate and translucent rigid substrate bonding apparatus
    6.
    发明授权
    Method of manufacturing translucent rigid substrate laminate and translucent rigid substrate bonding apparatus 有权
    半导体刚性基板层压板和半透明刚性基板接合装置的制造方法

    公开(公告)号：US08673105B2

    公开(公告)日：2014-03-18

    申请号：US13554747

    申请日：2012-07-20

    申请人： Hiroyuki Kurimura ,  Hayato Miyazaki ,  Gosuke Nakajima

    发明人： Hiroyuki Kurimura ,  Hayato Miyazaki ,  Gosuke Nakajima

    IPC分类号： B32B37/02 ,  B32B38/10 ,  B32B41/00

    CPC分类号： G02F1/1303 ,  G02F1/1333 ,  G02F2001/133302 ,  G02F2001/133354

    摘要： Provided is a method of manufacturing a translucent rigid substrate laminate to improve a positional precision while increasing production efficiency. Further, a translucent rigid substrate bonding apparatus contributing to improvement of the positional precision while increasing production efficiency of a plate-shaped product is provided. In the method of manufacturing the translucent rigid substrate laminate and the translucent rigid substrate bonding apparatus according to the present invention, when translucent rigid substrates are bonded in a predetermined positional relationship by interposing a photo-curable fixing agent therebetween, only the fixing agent present on an outer boundary portion of both translucent rigid substrates is cured for provisional fastening.

    摘要翻译： 提供一种制造半透明刚性基板层叠体的方法，以提高定位精度，同时提高生产效率。 此外，提供了有助于提高定位精度同时提高板状产品的生产效率的半透明刚性基板粘合装置。 在制造本发明的半透明刚性基板层叠体和半透明刚性基板接合装置的方法中，当通过在其间插入光固化固定剂将半透明刚性基板以预定位置关系结合时，仅存在固定剂 两个半透明刚性基板的外边界部分被固化以用于临时紧固。

    ADHESIVE COMPOSITION AND METHOD FOR TEMPORARILY FIXING MEMBER BY USING THE SAME
    7.
    发明申请
    ADHESIVE COMPOSITION AND METHOD FOR TEMPORARILY FIXING MEMBER BY USING THE SAME 有权
    胶粘剂组合物及其使用方法

    公开(公告)号：US20100000670A1

    公开(公告)日：2010-01-07

    申请号：US12374603

    申请日：2007-06-28

    申请人： Hiroyuki Kurimura ,  Tomoyuki Kanai ,  Kazuhiro Oshima

    发明人： Hiroyuki Kurimura ,  Tomoyuki Kanai ,  Kazuhiro Oshima

    IPC分类号： B32B38/10 ,  C08F20/00 ,  B32B5/16

    CPC分类号： C09J4/00 ,  C08K7/16 ,  C08L33/12 ,  C08L35/06 ,  C08L2666/04 ,  C09J5/06 ,  C09J11/08 ,  C09J133/14 ,  C09J2205/302 ,  Y10T428/254

    摘要： To provide a method for temporarily fixing an optical member suitable for processing of optical members, and an adhesive composition useful for such a method.An adhesive composition comprising (A) a polyfunctional (meth)acrylate, (B) a monofunctional (meth)acrylate and (C) a photopolymerization initiator, wherein the glass transition temperature of a cured resin obtained from the adhesive composition is from −50° C. to 40° C. A method for temporary fixing a member, which comprises bonding and temporarily fixing the member by means of the above adhesive composition, processing the temporarily fixed member, and immersing the processed is member in warm water of at most 90° C., thereby to remove a cured resin of the adhesive composition from the member.

    摘要翻译： 提供临时固定适合于光学部件的加工的光学部件的方法以及用于这种方法的粘合剂组合物。 一种粘合剂组合物，其包含（A）多官能（甲基）丙烯酸酯，（B）单官能（甲基）丙烯酸酯和（C）光聚合引发剂，其中由所述粘合剂组合物获得的固化树脂的玻璃化转变温度为-50℃ C.至40℃。一种用于临时固定构件的方法，其包括通过上述粘合剂组合物粘合和临时固定构件，处理临时固定构件，并将加工的构件浸入至多90℃的温水中 ℃，从而从该部件除去粘合剂组合物的固化树脂。

    Block copolymer composition
    8.
    发明授权
    Block copolymer composition 有权
    嵌段共聚物组成

    公开(公告)号：US07393898B2

    公开(公告)日：2008-07-01

    申请号：US10566372

    申请日：2004-07-28

    申请人： Jun Watanabe ,  Hiroyuki Kurimura ,  Shigeru Suzuki ,  Takeshi Oda ,  Norihiro Shimizu

    发明人： Jun Watanabe ,  Hiroyuki Kurimura ,  Shigeru Suzuki ,  Takeshi Oda ,  Norihiro Shimizu

    IPC分类号： C08F297/04

    CPC分类号： C08F299/022 ,  C08G81/022 ,  C08L53/02 ,  C08L2666/02

    摘要： To provide a block copolymer composition having a good balance in transparency and impact resistance, and particularly having an excellent impact resistance, by making a molded product of injection molding under high sear condition in such a manner as to hardly generate anisotropy. A block copolymer composed of a hard segment block comprising a block made mainly of a vinyl aromatic hydrocarbon and a soft segment block comprising a block made mainly of a conjugated diene, characterized by having a remarkably improved impact resistance without degrading transparency in respect of not only an extrusion-molded product and a blow-molded product but also an injection-molded product, by blending two kinds of block copolymers having a hard segment block of a specific structure.

    摘要翻译： 为了提供具有良好的透明性和耐冲击性的平衡，特别是具有优异的耐冲击性的嵌段共聚物组合物，通过以难以产生各向异性的方式在高烧结条件下制备注塑成型品。 由包含主要由乙烯基芳族烃制成的嵌段的硬链段嵌段和包含主要由共轭二烯制成的嵌段的软链段嵌段组成的嵌段共聚物，其特征在于不仅降低透明性，而且具有显着提高的耐冲击性 挤出成型品和吹塑成型品，也可以通过混合具有特定结构的硬链段的两种嵌段共聚物。