公开(公告)号：US20120100785A1

公开(公告)日：2012-04-26

申请号：US13264635

申请日：2010-03-30

申请人： Yukio Ishimasa ,  Ichiro Katayama ,  Tadahiro Kato ,  Kuniaki Oonishi

发明人： Yukio Ishimasa ,  Ichiro Katayama ,  Tadahiro Kato ,  Kuniaki Oonishi

IPC分类号： B24B1/00

CPC分类号： H01L21/02021 ,  B24B9/065

摘要： In a conventional wafer chamfering process, the chamfered shape (cross-sectional shape) of the wafer circumference is uniform. However, in the chamfering step in wafer manufacture, the uniform chamfered shape varies with respective circumferential positions. Therefore, a wafer chamfering method that takes into account deformation in the chamfering step in the wafer manufacture is to be provided. The wafer chamfering method is for chamfering a wafer by bringing a grooveless grindstone into contact with the edge (circumferential end) of a wafer. By this wafer chamfering method, a movement trajectory formed by moving the wafer and the grindstone in a relative manner in the Z-axis and Y-axis directions and forming the same cross-sectional shape on the entire wafer circumference is set as a reference. So as to perform a processing operation in which the relative positions of the wafer and the grindstone are changed from positions on the reference trajectory at least in one of the Z-axis and Y-axis directions depending on wafer rotation angle positions, different cross-sectional shapes are formed depending on the wafer rotation angle positions with the use of a piezoelectric actuator.

摘要翻译： 在传统的晶圆倒角工艺中，晶片圆周的倒角形状（横截面形状）是均匀的。 然而，在晶片制造中的倒角步骤中，均匀的倒角形状随着各个周向位置而变化。 因此，提供考虑到晶片制造中的倒角步骤中的变形的晶片倒角方法。 晶片倒角方法是通过使无槽磨石与晶片的边缘（圆周端）接触来倒角晶片。 通过该晶片倒角方法，设定通过使晶片和砂轮以相对于Z轴方向和Y轴方向移动而形成的移动轨迹，并且在整个晶片圆周上形成相同的横截面形状作为基准。 为了进行根据晶片旋转角位置至少在Z轴和Y轴方向之一上从基准轨迹上的位置改变晶片和磨石的相对位置的处理操作， 使用压电致动器，根据晶片旋转角度位置形成截面形状。

公开(公告)号：US20060009134A1

公开(公告)日：2006-01-12

申请号：US11174520

申请日：2005-07-06

申请人： Ichiro Katayama

发明人： Ichiro Katayama

IPC分类号： B24B1/00

CPC分类号： B24D7/18 ,  B24B9/065

摘要： The present invention provides the grinding wheel, the grinding apparatus and the grinding method of the present invention so that increase in the size of the grinding apparatus can be suppressed, and the back surface grinding of the wafer and the grinding of the peripheral edge part of the wafer are performed at the same time, whereby the peripheral edge part of the extremely thin wafer is prevented from being sharpened, and cracking and chipping of the wafer peripheral edge part can be prevented.

摘要翻译： 本发明提供了本发明的砂轮，研磨装置和研磨方法，从而可以抑制研磨装置的尺寸的增加，并且晶片的背面研磨和周边边缘部分的磨削 同时执行晶片，从而防止极薄晶片的周边部分被锐化，并且可以防止晶片周边部分的破裂和碎裂。

公开(公告)号：US06613999B2

公开(公告)日：2003-09-02

申请号：US10001831

申请日：2001-11-19

申请人： Ichiro Katayama ,  Hideo Wakui

发明人： Ichiro Katayama ,  Hideo Wakui

IPC分类号： B23K904

CPC分类号： B23K11/20 ,  B23K11/115

摘要： A method of joining a sintered hard alloy member 1 such as a cylindrical rod-shaped twist drill bit blank made of material whose main component is tungsten carbide to a softer metal member such as a stainless steel shank 2 includes the steps of connecting the hard alloy member 1 and the metal member 2 to separate electrodes 3 and 4, applying a longitudinally directed force couple to the hard alloy member 1 and metal member 2 to press end faces of the members together to form an electrically conductive contact region, and passing a pulse of current through electrodes 3 and 4 of sufficient energy to melt the two end face regions of the members, thereby welding them together. Preferably, the end face of the metal member has a convex conical shape.

公开(公告)号：US5443337A

公开(公告)日：1995-08-22

申请号：US85078

申请日：1993-07-02

申请人： Ichiro Katayama

发明人： Ichiro Katayama

IPC分类号： B23B27/14 ,  B23B51/00 ,  B23B51/02 ,  B23B51/10 ,  B23P15/28 ,  E21B10/44 ,  E21B10/56 ,  E21B10/567 ,  E21B10/58

CPC分类号： E21B10/5676 ,  B23B27/146 ,  B23B51/009 ,  B23B51/02 ,  B23B51/108 ,  B23P15/28 ,  E21B10/44 ,  E21B10/58 ,  B23B2226/125 ,  B23B2226/315 ,  B23B2240/08 ,  B23B2251/50 ,  Y10S76/12 ,  Y10T407/26 ,  Y10T408/81 ,  Y10T408/9097

摘要： A drill bit for cutting hard and abrasive materials has cutting lips formed from sintered polycrystalline diamond (PCD) or polycrystalline cubic boron nitride (PCBN) contained in one or more inserts installed in a drill bit blank. The inserts are made by forming depressions in the upper surface of a matrix slab of tungsten carbide, filling the depressions with fine mesh grains of diamonds or cubic born nitride, subjecting the slab to heat and pressure sufficient to fuse the grains to one another and to the surrounding matrix walls, and then cutting the matrix slab to remove individual inserts containing an elongated vein having an exposed PCD or PCBN surface supported by at least one and preferably two or more side walls of tungsten carbide. A rectangular slot having side walls parallel to one another and equidistant from the diameter of a cylindrical drill bit blank is cut into one transverse end wall of the blank, and one or more inserts placed in the slot. The tungsten carbide walls of the inserts are then brazed to the adjacent side walls of the slot. The bit is then ground to a desired configuration, in which PCD or PCBN material forms at least part of at least one cutting lip of the finished drill bit. Preferably, flutes are formed in drill bit blank as part of the grinding operation.

公开(公告)号：US06431961B1

公开(公告)日：2002-08-13

申请号：US09511354

申请日：2000-02-23

申请人： Ichiro Katayama ,  Masatami Iwaki ,  Kazumi Ikeda

发明人： Ichiro Katayama ,  Masatami Iwaki ,  Kazumi Ikeda

IPC分类号： B24B100

CPC分类号： B24B9/065 ,  B24B51/00 ,  H01L21/02021

摘要： A grindstone and a wafer are rotated at high speeds in the same direction. The rotating wafer is slowly moved toward the rotating grindstone to thereby gradually chamfer the periphery of the wafer.

摘要翻译： 磨石和晶片以相同的方向以高速旋转。 旋转的晶片缓慢地向旋转的磨石移动，从而逐渐倒角晶片的周边。

公开(公告)号：US5174270A

公开(公告)日：1992-12-29

申请号：US693568

申请日：1991-04-30

申请人： Ichiro Katayama ,  Yoshio Kamoshita

发明人： Ichiro Katayama ,  Yoshio Kamoshita

IPC分类号： B24B27/06 ,  B23D47/00 ,  B23D59/00 ,  B24B49/00 ,  B28D1/22 ,  B28D5/00 ,  B28D5/02

CPC分类号： B28D5/028 ,  B23D47/005 ,  B23D59/002 ,  Y10S125/901 ,  Y10T83/148

摘要： A slicing method includes slicing an ingot by a rotary blade while the inner peripheral cutting edge of the blade is kept in a highly rigid state. A slicing machine slices the ingot into thin pieces by use of an inner peripheral cutting edge of a doughnut-shaped rotary blade, where an axial force is applied to the blade prior to slicing in order to displace the blade in an axial direction. The inner peripheral cutting edge of the blade is kept rigid and the ingot is sliced accurately. The displacement of the blade is stored and controlled by a control unit.

公开(公告)号：US4209335A

公开(公告)日：1980-06-24

申请号：US909233

申请日：1978-05-24

申请人： Ichiro Katayama ,  Hirosuke Kubota ,  Mitsuo Mochizuki ,  Kuniyoshi Sakane ,  Toshimichi Mihara ,  Tokuzo Kitawaki

发明人： Ichiro Katayama ,  Hirosuke Kubota ,  Mitsuo Mochizuki ,  Kuniyoshi Sakane ,  Toshimichi Mihara ,  Tokuzo Kitawaki

IPC分类号： C02F11/00 ,  A62D3/00 ,  A62D3/36 ,  A62D3/37 ,  A62D101/22 ,  A62D101/24 ,  A62D101/26 ,  A62D101/28 ,  A62D101/43 ,  B09B3/00 ,  B09C1/08 ,  B09C1/10 ,  C04B18/04 ,  C04B28/02 ,  C04B28/26 ,  C04B32/00 ,  C09K17/00 ,  C09K17/02 ,  C09K17/08 ,  C09K17/10 ,  C09K103/00 ,  C04B7/02 ,  C04B7/35

CPC分类号： C04B28/26 ,  B09C1/08 ,  C04B18/0463 ,  C04B28/02 ,  C04B2111/00767 ,  Y02W30/91 ,  Y02W30/92

摘要： Solidification or consolidation, for fixation of various kinds of waste matter, soil etc. containing toxic contaminants affecting ecological system of the environment, by use of composition made up of hydraulic cement and particular additive. The additive essentially contains at least one sulfate, such as aluminum sulfate, alum or iron sulfate, and at least one alkaline metal salt, such as carbonate, bicarbonate or silicate.

摘要翻译： 通过使用由水硬性水泥和特定添加剂组成的组合物固化各种废物，含有影响环境生态系统的有毒污染物的土壤等的固化或固结。 添加剂基本上含有至少一种硫酸盐，例如硫酸铝，明矾或硫酸铁，以及至少一种碱金属盐，例如碳酸盐，碳酸氢盐或硅酸盐。

公开(公告)号：US07189149B2

公开(公告)日：2007-03-13

申请号：US10989513

申请日：2004-11-17

申请人： Ichiro Katayama ,  Youichi Nakamura

发明人： Ichiro Katayama ,  Youichi Nakamura

IPC分类号： B24B53/00

CPC分类号： B24B53/06 ,  B24B9/065

摘要： A truing method for a chamfering grindstone for performing chamfering work on a peripheral edge of a plate-shaped object, comprising the steps of: performing chamfering work on a truing grindstone with a master grindstone having a desired groove shape and forming a peripheral edge shape of the truing grindstone into a desired chamfered shape; and transferring the groove shape of the master grindstone onto the chamfering grindstone by performing grooving work on the chamfering grindstone with the chamfered truing grindstone to form the groove in the desired shape on the chamfering grindstone.

摘要翻译： 一种用于在板状物体的周缘上进行倒角加工的倒角磨石的修整方法，包括以下步骤：对具有期望槽形状的主砂轮进行修整砂轮的倒角加工，并形成周向边缘形状 修整磨石成为所需的倒角形状; 并通过对倒角磨石对倒角磨石进行切槽加工，将主磨石的槽形转移到倒角磨石上，以在倒角磨石上形成所需形状的槽。

公开(公告)号：US06769965B2

公开(公告)日：2004-08-03

申请号：US10127356

申请日：2002-04-19

申请人： Ichiro Katayama

发明人： Ichiro Katayama

IPC分类号： B24B100

CPC分类号： B24B3/245 ,  B24B19/04 ,  B24B55/06 ,  Y10T408/35 ,  Y10T408/381

摘要： An apparatus for pointing twist drill bits includes a processing unit which has a rotary index plate on which are mounted a plurality, e.g., five, of drill bit holders which are circumferentially spaced apart at equal, e.g., 72-degree intervals, and a loading unit which has located adjacent to the index plate a rotary pedestal on which are mounted an equal number of transfer arms. Located around the periphery of the processing unit and loading unit are a plurality of processing stations and loading unit operation stations, respectively. Under computer control, the index plate and pedestal are periodically rotated non-simultaneously in opposite directions and stopped for predetermined time periods during which sensors and actuators cause drill bits to be loaded from a container located at an input/output station onto a loading unit arm, cleaned, transferred to a drill bit holder, sequentially processed at processing stations, including a point grinding station, transferred back to a loading unit arm, discharged to a defectives container if defective, have a collar ring adjusted, and returned to the input/output station for discharge to a transport container. Prior to and after a grinding process, each drill bit is cleaned by a dirt removal apparatus which uses a plastically deformable body, preferably a toroidal roller which is pivoted into contact with a drill bit point, causing the point to pierce the body and transfer dirt thereto, the body is then pivoted away from the point with dirt adhered to the body.

摘要翻译： 用于指向麻花钻头的装置包括一个处理单元，该处理单元具有旋转分度板，多个（例如五个）钻头保持器安装在该旋转分度板上，所述多个钻头保持器以等间隔例如72度的间隔周向间隔开， 单元，其位于与折射板相邻的旋转基座上，其上安装有相等数量的传送臂。 位于处理单元周围的加载单元分别是多个处理站和装载单元操作站。 在计算机控制下，指纹板和基座在相反方向周期性地不同时旋转并停止预定的时间段，在此期间传感器和致动器使钻头从位于输入/输出站的容器装载到装载单元臂 被清洁，转移到钻头夹持器，在包括点研磨站在内的加工站顺序地处理，转移到装载单元臂，如果有缺陷则排出到缺陷容器中，调整套环环，并返回到输入/ 输出站，用于排放到运输集装箱。 在研磨过程之前和之后，每个钻头都通过污物去除装置进行清洁，该除尘装置使用可塑性变形的主体，优选地是与枢轴接触钻头点的环形辊，使得该点刺穿主体并且转移污物 于是，身体然后从附着在身体上的污垢的点枢转。

公开(公告)号：US06067976A

公开(公告)日：2000-05-30

申请号：US854701

申请日：1997-05-12

申请人： Ichiro Katayama ,  Shinji Shibaoka ,  Shozo Katamachi

发明人： Ichiro Katayama ,  Shinji Shibaoka ,  Shozo Katamachi

IPC分类号： B28D5/04 ,  B28D1/08

CPC分类号： B28D5/045

摘要： The moving direction of the wire line 15A at the cut portion 44 for cutting the columnar semiconductor ingot 18 corresponds to the vertical-downward direction. And, the semiconductor ingot 18 supported with the cut-feed means 20 is fed horizontally so as to be pushed in perpendicular to said wire line 15A, and the processing liquid 42 is supplied to the wire line 15A from the grind liquid supply nozzle 40 placed at the upper side of the cut portion 44. Therefore, the processing liquid 42 supplied to the wire line 15A flows along the wire line 15A, so that the processing liquid 42 can be surely supplied to the cut portion 44.

摘要翻译： 在用于切割柱状半导体锭18的切割部分44处的导线15A的移动方向对应于垂直向下的方向。 并且，用切割进给装置20支撑的半导体锭18被水平地供给，以便被垂直于所述线线15A推动，并且处理液体42从放置的研磨液供给喷嘴40供给到线路15A 因此，提供给线路15A的处理液体42沿着线路线15A流动，从而可以将处理液体42可靠地供给至切断部44。