公开(公告)号：US08255843B2

公开(公告)日：2012-08-28

申请号：US12870365

申请日：2010-08-27

申请人： Yun-Hsiu Chen ,  Syun-Ming Jang ,  Pang-Yen Tsai

发明人： Yun-Hsiu Chen ,  Syun-Ming Jang ,  Pang-Yen Tsai

IPC分类号： G06F17/50

CPC分类号： H01L21/823807 ,  H01L21/823814 ,  H01L27/0207 ,  H01L29/7848

摘要： A method for fabricating a strained-silicon semiconductor device to ameliorate undesirable variation in selectively grown epitaxial film thickness. The layout or component configuration for the proposed semiconductor device is evaluated to determine areas of relatively light or dense population in order to determine whether local-loading-effect defects are likely to occur. If a possibility of such defects occurring exists, a dummy pattern of epitaxial structures may be indicated. If so, the dummy pattern appropriate to the proposed layout is created, incorporated into the mask design, and then implemented on the substrate along with the originally-proposed component configuration.

摘要翻译： 一种用于制造应变硅半导体器件以改善选择性生长的外延膜厚度的不期望的变化的方法。 评估所提出的半导体器件的布局或组件配置以确定相对较轻或密集的群体的区域，以便确定是否可能发生局部加载效应的缺陷。 如果存在这种缺陷的可能性，则可以指示外延结构的虚拟图案。 如果是这样，则创建适合于所提出的布局的虚拟图案，并入到掩模设计中，然后与原始提出的部件配置一起在基板上实现。

公开(公告)号：US20110008951A1

公开(公告)日：2011-01-13

申请号：US12870365

申请日：2010-08-27

申请人： Yun-Hsiu Chen ,  Syun-Ming Jang ,  Pang-Yen Tsai

发明人： Yun-Hsiu Chen ,  Syun-Ming Jang ,  Pang-Yen Tsai

IPC分类号： H01L21/20

CPC分类号： H01L21/823807 ,  H01L21/823814 ,  H01L27/0207 ,  H01L29/7848

摘要： A method for fabricating a strained-silicon semiconductor device to ameliorate undesirable variation in selectively grown epitaxial film thickness. The layout or component configuration for the proposed semiconductor device is evaluated to determine areas of relatively light or dense population in order to determine whether local-loading-effect defects are likely to occur. If a possibility of such defects occurring exists, a dummy pattern of epitaxial structures may be indicated. If so, the dummy pattern appropriate to the proposed layout is created, incorporated into the mask design, and then implemented on the substrate along with the originally-proposed component configuration.

摘要翻译： 一种用于制造应变硅半导体器件以改善选择性生长的外延膜厚度的不期望的变化的方法。 评估所提出的半导体器件的布局或组件配置以确定相对较轻或密集的群体的区域，以便确定是否可能发生局部加载效应的缺陷。 如果存在这种缺陷的可能性，则可以指示外延结构的虚拟图案。 如果是这样，则创建适合于所提出的布局的虚拟图案，并入到掩模设计中，然后与原始提出的部件配置一起在基板上实现。

公开(公告)号：US07592619B2

公开(公告)日：2009-09-22

申请号：US11622490

申请日：2007-01-12

申请人： Pang-Yen Tsai ,  Liang-Gi Yao ,  Chun-Chieh Lin ,  Wen-Chin Lee ,  Shih-Chang Chen

发明人： Pang-Yen Tsai ,  Liang-Gi Yao ,  Chun-Chieh Lin ,  Wen-Chin Lee ,  Shih-Chang Chen

IPC分类号： H01L29/15

CPC分类号： C30B25/00 ,  C30B29/06 ,  C30B29/52 ,  Y10S438/933

摘要： A method of forming an epitaxial layer of uniform thickness is provided to improve surface flatness. A substrate is first provided and a Si base layer is then formed on the substrate by epitaxy. A Si—Ge layer containing 5 to 10% germanium is formed on the Si base layer by epitaxy to normalize the overall thickness of the Si base layer and the Si—Ge layer containing 5 to 10% germanium.

摘要翻译： 提供了形成均匀厚度的外延层的方法以改善表面平坦度。 首先提供衬底，然后通过外延在衬底上形成Si基层。 通过外延在Si基底层上形成含有5〜10％锗的Si-Ge层，以使Si基层和含有5〜10％锗的Si-Ge层的整体厚度归一化。

公开(公告)号：US20080132019A1

公开(公告)日：2008-06-05

申请号：US11633721

申请日：2006-12-05

申请人： Keh-Chiang Ku ,  Pang-Yen Tsai ,  Chun-Feng Nieh ,  Li-Ting Wang

发明人： Keh-Chiang Ku ,  Pang-Yen Tsai ,  Chun-Feng Nieh ,  Li-Ting Wang

IPC分类号： H01L21/04

CPC分类号： H01L21/26586 ,  H01L21/26513 ,  H01L29/1083 ,  H01L29/665 ,  H01L29/6656 ,  H01L29/66628 ,  H01L29/66636 ,  H01L29/7833 ,  H01L29/7848

摘要： A method for forming a semiconductor structure includes providing a semiconductor substrate, forming a gate stack on the semiconductor substrate, and epitaxially growing a lightly-doped source/drain (LDD) region adjacent the gate stack, wherein carbon is simultaneously doped into the LDD region.

摘要翻译： 一种用于形成半导体结构的方法包括提供半导体衬底，在半导体衬底上形成栅极堆叠，以及外围生长与栅堆叠相邻的轻掺杂源极/漏极（LDD）区域，其中碳同时掺杂到LDD区域 。

公开(公告)号：US20070148919A1

公开(公告)日：2007-06-28

申请号：US11313768

申请日：2005-12-22

申请人： Li-Te Lin ,  Pang-Yen Tsai ,  Chih-Chien Chang ,  Tze-Liang Lee

发明人： Li-Te Lin ,  Pang-Yen Tsai ,  Chih-Chien Chang ,  Tze-Liang Lee

IPC分类号： H01L21/20 ,  H01L21/36

CPC分类号： H01L21/02639 ,  H01L21/02381 ,  H01L21/0245 ,  H01L21/02502 ,  H01L21/02532 ,  H01L21/0262 ,  H01L21/02661

摘要： A method for manufacturing a semiconductor device includes providing a substrate comprising silicon, cleaning the substrate, performing a first low pressure chemical vapor deposition (LPCVD) process using a first source gas to selectively deposit a seeding layer of silicon (Si) over the substrate, performing a second LPCVD process using a second source gas to selectively deposit a first layer of silicon germanium (SiGe) over the layer of Si, the second source gas including hydrochloride at a first flow rate, and performing a third LPCVD process using a third source gas including hydrochloride at a second flow rate. The first flow rate is substantially lower than the second flow rate.

摘要翻译： 一种制造半导体器件的方法包括提供包括硅的衬底，清洁衬底，使用第一源气体执行第一低压化学气相沉积（LPCVD）工艺，以在衬底上选择性地沉积硅（Si）晶种层， 使用第二源气体执行第二LPCVD处理，以选择性地在所述Si层上沉积第一层硅锗（SiGe），所述第二源气体以第一流速包括盐酸盐，并且使用第三源进行第三LPCVD处理 气体包括盐酸盐以第二流量。 第一流速基本上低于第二流量。

公开(公告)号：US07175709B2

公开(公告)日：2007-02-13

申请号：US10847099

申请日：2004-05-17

申请人： Pang-Yen Tsai ,  Liang-Gi Yao ,  Chun-Chieh Lin ,  Wen-Chin Lee ,  Shih-Chang Chen

发明人： Pang-Yen Tsai ,  Liang-Gi Yao ,  Chun-Chieh Lin ,  Wen-Chin Lee ,  Shih-Chang Chen

IPC分类号： C30B25/04

CPC分类号： C30B25/00 ,  C30B29/06 ,  C30B29/52 ,  Y10S438/933

摘要： A method of forming an epitaxial layer of uniform thickness is provided to improve surface flatness. A substrate is first provided and a Si base layer is then formed on the substrate by epitaxy. A Si—Ge layer containing 5 to 10% germanium is formed on the Si base layer by epitaxy to normalize the overall thickness of the Si base layer and the Si—Ge layer containing 5 to 10% germanium.

摘要翻译： 提供了形成均匀厚度的外延层的方法以改善表面平坦度。 首先提供衬底，然后通过外延在衬底上形成Si基层。 通过外延在Si基底层上形成含有5〜10％锗的Si-Ge层，以使Si基层和含有5〜10％锗的Si-Ge层的整体厚度归一化。

公开(公告)号：US20070010051A1

公开(公告)日：2007-01-11

申请号：US11174683

申请日：2005-07-05

申请人： Chii-Ming Wu ,  Chih-Wei Chang ,  Pang-Yen Tsai ,  Chih-Chien Chang

发明人： Chii-Ming Wu ,  Chih-Wei Chang ,  Pang-Yen Tsai ,  Chih-Chien Chang

IPC分类号： H01L21/8234 ,  H01L21/4763

CPC分类号： H01L29/665 ,  H01L21/28114 ,  H01L29/42376 ,  H01L29/6659 ,  H01L29/66636 ,  H01L29/7843

摘要： A method of forming MOS devices is provided. The method includes providing a semiconductor substrate, forming a gate dielectric over the semiconductor substrate, forming a gate electrode over the gate dielectric, forming a source/drain region in the semiconductor substrate, forming an additional layer, preferably by epitaxial growth, on the source/drain region, and siliciding at least a top portion of the additional layer. The additional layer compensates for at least a portion of the semiconductor material lost during manufacturing processes and increases the distance between the source/drain silicide and the substrate. As a result, the leakage current is reduced. A transistor formed using the preferred embodiment preferably includes a silicide over the gate electrode wherein the silicide extends beyond a sidewall boundary of the gate electrode.

摘要翻译： 提供了一种形成MOS器件的方法。 该方法包括提供半导体衬底，在半导体衬底上形成栅极电介质，在栅极电介质上形成栅电极，在半导体衬底中形成源/漏区，在源上形成附加层，优选通过外延生长 /漏极区域，并且至少将附加层的顶部部分硅化。 附加层补偿在制造过程中损失的半导体材料的至少一部分，并且增加源极/漏极硅化物和衬底之间的距离。 结果，泄漏电流降低。 使用优选实施例形成的晶体管优选地包括在栅极上的硅化物，其中硅化物延伸超过栅电极的侧壁边界。

公开(公告)号：US20060151808A1

公开(公告)日：2006-07-13

申请号：US11034282

申请日：2005-01-12

申请人： Chien-Hao Chen ,  Pang-Yen Tsai ,  Chie-Chien Chang ,  Tze-Liang Lee ,  Shih-Chang Chen

发明人： Chien-Hao Chen ,  Pang-Yen Tsai ,  Chie-Chien Chang ,  Tze-Liang Lee ,  Shih-Chang Chen

IPC分类号： H01L31/109 ,  H01L21/8234 ,  H01L21/477

CPC分类号： H01L21/26506 ,  H01L21/28518 ,  H01L21/28525 ,  H01L21/823807 ,  H01L29/165 ,  H01L29/45 ,  H01L29/517 ,  H01L29/518 ,  H01L29/66628 ,  H01L29/66636 ,  H01L29/7834 ,  H01L29/7848

摘要： MOSFETs having localized stressors are provided. The MOSFET has a stress-inducing layer formed in the source/drain regions, wherein the stress-inducing layer comprises a first semiconductor material and a second semiconductor material. A treatment is performed on the stress-inducing layer such that a reaction is caused with the first semiconductor material and the second semiconductor material is forced lower into the stress-inducing layer. The stress-inducing layer may be either a recessed region or non-recessed region. A first method involves forming a stress-inducing layer, such as SiGe, in the source/drain regions and performing a nitridation or oxidation process. A nitride or oxide film is formed in the top portion of the stress-inducing layer, forcing the Ge lower into the stress-inducing layer. Another method embodiment involves forming a reaction layer over the stress-inducing layer and performing a treatment process to cause the reaction layer to react with the stress-inducing layer.

公开(公告)号：US6041452A

公开(公告)日：2000-03-28

申请号：US221087

申请日：1998-12-24

申请人： Chien-Liang Hsiao ,  Pang-Yen Tsai

发明人： Chien-Liang Hsiao ,  Pang-Yen Tsai

IPC分类号： E03D1/14

CPC分类号： E03D1/145

摘要： A toilet water tank is provided with a water discharging seat which is in turn provided in the top thereof with an upright tube, a high water discharging port and a low water discharging port. The high and the low water discharging ports are movably covered with a cover respectively. The cover is fastened with the upright tube which is provided with a guide wheel member. A flush handle is located outside the toilet water tank such that the flush handle is connected with a control rod extending to the water discharging seat for locating two chains between the two covers and the control rods. The chains are located by the clamps such that the chains can be installed or replaced with ease and speed.

摘要翻译： 厕所水箱设有排水座，排水座又在其顶部设置有直立管，高排水口和低排水口。 高排水口和低排水口分别用盖子可移动地覆盖。 盖子用设有导向轮构件的立管固定。 冲水手柄位于马桶水箱外面，使得冲水手柄与延伸到排水座的控制杆连接，用于在两个盖和控制杆之间定位两条链条。 链条由夹具定位，使得链条可以方便和快速地安装或更换。

公开(公告)号：US08883598B2

公开(公告)日：2014-11-11

申请号：US13412099

申请日：2012-03-05

申请人： Che-Ting Chu ,  Shih-Hsun Chang ,  Pang-Yen Tsai

发明人： Che-Ting Chu ,  Shih-Hsun Chang ,  Pang-Yen Tsai

IPC分类号： H01L21/8232 ,  H01L21/20 ,  H01L29/66 ,  H01L29/10

CPC分类号： H01L29/1054 ,  H01L29/66651

摘要： Semiconductor devices and methods of forming the same. The method includes providing a semiconductor substrate having a channel layer over the substrate. A capping layer including silicon and having a first thickness is formed over the channel layer. The capping layer is partially oxidized to form an oxidized portion of the capping layer. The oxidized portion of the capping layer is removed to form a thinned capping layer having a second thickness less than the first thickness.

摘要翻译： 半导体器件及其形成方法。 该方法包括提供在衬底上方具有沟道层的半导体衬底。 包含硅并具有第一厚度的覆盖层形成在沟道层上。 覆盖层被部分氧化以形成覆盖层的氧化部分。 去除覆盖层的氧化部分以形成具有小于第一厚度的第二厚度的变薄的覆盖层。