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公开(公告)号:US11112304B2
公开(公告)日:2021-09-07
申请号:US16610238
申请日:2018-05-03
Applicant: Heptagon Micro Optics Pte. Ltd.
Inventor: Kotaro Ishizaki , Javier Miguel-Sánchez , Peter Roentgen
Abstract: Calibrating a spectrometer module includes performing measurements using the spectrometer module to generate wavelength-versus-operating parameter calibration data for the spectrometer module, performing measurements using the spectrometer module to generate optical crosstalk and dark noise calibration data for the spectrometer module, and performing measurements using the spectrometer module to generate full system response calibration data, against a known reflectivity standard, for the spectrometer module. The method further includes storing in memory, coupled to the spectrometer module, a calibration record that incorporates the wavelength-versus-operating parameter calibration data, the optical crosstalk and dark noise calibration data, and the full system response calibration data, and applying the calibration record to measurements by the spectrometer module.
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公开(公告)号:US10566363B2
公开(公告)日:2020-02-18
申请号:US15675955
申请日:2017-08-14
Applicant: Heptagon Micro Optics Pte. Ltd.
Inventor: Peter Riel , Markus Rossi , Daniel Pérez Calero , Matthias Gloor , Moshe Doron , Dmitry Bakin , Philippe Bouchilloux
IPC: H01L27/146 , G02B7/02 , H01L33/58 , H01L31/0232 , H01L33/48 , G02B7/00 , G03B21/14 , G03B21/20
Abstract: This disclosure describes various modules that can provide ultra-precise and stable packaging for an optoelectronic device such as a light emitter or light detector. The modules include vertical alignment features that can be machined, as needed, during fabrication of the modules, to establish a precise distance between the optoelectronic device and an optical element or optical assembly disposed over the optoelectronic device.
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公开(公告)号:US10199426B2
公开(公告)日:2019-02-05
申请号:US15828664
申请日:2017-12-01
Applicant: Heptagon Micro Optics Pte. Ltd.
Inventor: Hartmut Rudmann , Simon Gubser , Susanne Westenhöfer , Stephan Heimgartner , Jens Geiger , Sonja Hanselmann , Christoph Friese , Xu Yi , Thng Chong Kim , John A. Vidallon , Ji Wang , Qi Chuan Yu , Kam Wah Leong
IPC: H01L27/146 , H01L31/0203 , H01L31/0232 , H01L33/58
Abstract: Various optoelectronic modules are described that include an optoelectronic device (e.g., a light emitting or light detecting element) and a transparent cover. Non-transparent material is provided on the sidewalls of the transparent cover, which, in some implementations, can help reduce light leakage from the sides of the transparent cover or can help prevent stray light from entering the module. Fabrication techniques for making the modules also are described.
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公开(公告)号:US10088140B2
公开(公告)日:2018-10-02
申请号:US15614986
申请日:2017-06-06
Applicant: Heptagon Micro Optics Pte. Ltd.
Inventor: Martin Lukas Balimann , Matthias Gloor
Abstract: An eye-safe optoelectronic module includes a light source mounted on a support and operable to generate light along an emission axis. An eye-safe substrate has an eye-safe substrate refractive index and includes at least one diffusive surface. The eye-safe substrate is mounted such that the emission axis is intercepted by the diffusive surface. An optical assembly includes at least one optical element, is composed of an optical material and is mounted on the diffusive surface of the eye-safe substrate such that the optical material fills a diffusive surface of the eye-safe substrate. The optical assembly has an optical assembly refractive index that is substantially the same as the eye-safe substrate refractive index.
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公开(公告)号:US20180240824A1
公开(公告)日:2018-08-23
申请号:US15958494
申请日:2018-04-20
Applicant: Heptagon Micro Optics Pte. Ltd.
Inventor: Jukka Alasirniö
IPC: H01L27/146 , H01L31/0232 , H04N5/225 , H01L27/148
CPC classification number: H01L27/1463 , H01L27/14618 , H01L27/14621 , H01L27/14625 , H01L27/14643 , H01L27/14806 , H01L31/02325 , H04N5/2254 , H04N5/2257
Abstract: The disclosure describes customizable optoelectronic modules and methods for standardizing a plurality of the customizable optoelectronic modules. The customizable optoelectronic modules can be configured to mitigate dimensional variations and misalignments in a number of their respective constituent components such as optical assemblies and sensor covers. The customizable optoelectronic modules and methods for standardizing a plurality of the customizable optoelectronic modules can obviate the need for binning during manufacturing thereby saving considerable resources such as time and expense.
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公开(公告)号:US09992472B1
公开(公告)日:2018-06-05
申请号:US15625176
申请日:2017-06-16
Applicant: Heptagon Micro Optics Pte. Ltd.
Inventor: Florin Cutu
CPC classification number: H04N13/106 , H04N13/207 , H04N13/246 , H04N13/254
Abstract: The disclosure describes optoelectronic devices for collecting three-dimensional data without determining disparity. The approach permits significant flexibility relative to state-of-the-art approaches for collecting three-dimensional data. For example, the illuminations (e.g., patterns) generated by the disclosed devices need not exhibit the same degree of complexity or randomness of illuminations generally required by structured-light approaches. Further, the devices described in the present disclosure exhibit, in some instances, optimal resolution over a wide distance range. An optoelectronic device described herein is operable to generate an illumination comprising a plurality of high-intensity features that exhibit a distance-dependent alteration when imaged by an imager incorporated into the optoelectronic device.
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公开(公告)号:US09899251B2
公开(公告)日:2018-02-20
申请号:US15698991
申请日:2017-09-08
Applicant: Heptagon Micro Optics Pte. Ltd.
Inventor: Hartmut Rudmann , Stephan Heimgartner , John A. Vidallon
IPC: H01L21/68 , H01L21/683 , B32B37/18 , B32B38/18 , B32B37/12
CPC classification number: H01L21/6838 , B32B37/12 , B32B37/18 , B32B38/1858 , B32B2457/00 , B32B2551/00
Abstract: Techniques are described for holding a wafer or wafer sub-stack to facilitate further processing of the wafer of sub-stack. In some implementations, a wafer or wafer sub-stack is held by a vacuum chuck in a manner that can help reduce bending of the wafer or wafer sub-stack.
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公开(公告)号:US09875998B2
公开(公告)日:2018-01-23
申请号:US15460746
申请日:2017-03-16
Applicant: Heptagon Micro Optics Pte. Ltd.
Inventor: Hartmut Rudmann
IPC: H01L33/00 , H01L21/66 , H01L25/16 , H01L31/0232 , H01L31/18 , H01L33/58 , H01L31/167 , B29D11/00
CPC classification number: H01L25/165 , B29D11/00307 , B29D11/00375 , H01L25/167 , H01L27/14625 , H01L27/14632 , H01L27/14683 , H01L27/14685 , H01L27/14687 , H01L31/02325 , H01L31/167 , H01L31/18 , H01L31/1876 , H01L33/58 , H01L2924/0002 , H01L2933/0058 , H01L2924/00
Abstract: Fabricating an optics wafer includes providing a wafer comprising a core region composed of a glass-reinforced epoxy, the wafer further comprising a first resin layer on a top surface of the core region and a second resin layer on a bottom surface of the core region. The wafer further includes vertical transparent regions that's extend through the core region and the first and second resin layers. The wafer is thinned from its top surface and its bottom surface so that a resulting thickness is within a predetermined range without causing glass fibers of the core region to become exposed. Optical structures ate provided on one or more exposed surfaces of at least some of the transparent regions.
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公开(公告)号:US20170350581A1
公开(公告)日:2017-12-07
申请号:US15614986
申请日:2017-06-06
Applicant: Heptagon Micro Optics Pte. Ltd.
Inventor: Martin Lukas Balimann , Matthias Gloor
CPC classification number: F21V25/00 , F21V3/00 , F21V5/004 , F21Y2115/30 , H01S5/02212 , H01S5/02296 , H01S5/183 , H01S5/423
Abstract: An eye-safe optoelectronic module includes a light source mounted on a support and operable to generate light along an emission axis. An eye-safe substrate has an eye-safe substrate refractive index and includes at least one diffusive surface. The eye-safe substrate is mounted such that the emission axis is intercepted by the diffusive surface. An optical assembly includes at least one optical element, is composed of an optical material and is mounted on the diffusive surface of the eye-safe substrate such that the optical material fills a diffusive surface of the eye-safe substrate. The optical assembly has an optical assembly refractive index that is substantially the same as the eye-safe substrate refractive index.
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公开(公告)号:US20170317126A1
公开(公告)日:2017-11-02
申请号:US15651510
申请日:2017-07-17
Applicant: Heptagon Micro Optics Pte. Ltd.
Inventor: Stephan Heimgartner , Ville Kettunen , Nicola Spring , Alexander Bietsch , Mario Cesana , Hartmut Rudmann , Jukka Alasirnio , Robert Lenart
IPC: H01L27/146 , H01L31/18 , H01L31/0232 , G02B27/00 , H01L31/0216 , H04N5/225
CPC classification number: H01L27/14625 , G02B27/0025 , H01L27/14627 , H01L27/14685 , H01L27/14687 , H01L31/02162 , H01L31/02164 , H01L31/02325 , H01L31/18 , H04N5/2254 , Y10T29/49826
Abstract: Fabricating optical devices can include mounting a plurality of singulated lens systems over a substrate, adjusting a thickness of the substrate below at least some of the lens systems to provide respective focal length corrections for the lens systems, and subsequently separating the substrate into a plurality of optical modules, each of which includes one of the lens systems mounted over a portion of the substrate. Adjusting a thickness of the substrate can include, for example, micro-machining the substrate to form respective holes below at least some of the lens systems or adding one or more layers below at least some of the lens systems so as to correct for variations in the focal lengths of the lens systems.
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