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    HIGH PRECISION PHOTONIC DISTANCE METER CIRCUIT AND DISTANCE MEASURING METHOD
    5.
    发明公开
    HIGH PRECISION PHOTONIC DISTANCE METER CIRCUIT AND DISTANCE MEASURING METHOD 审中-公开

    公开(公告)号：US20230400576A1

    公开(公告)日：2023-12-14

    申请号：US17840523

    申请日：2022-06-14

    Applicant: PixArt Imaging Incorporation

    Inventor： Wen-Hao Ho

    IPC: G01S17/10 ,  G01S7/484 ,  G01S7/4865

    CPC classification number: G01S17/10 ,  G01S7/484 ,  G01S7/4865

    Abstract: A distance meter circuit includes: a driver for generating a driving pulse according to a measuring control signal to drive a laser diode to emit a light pulse to an object; a photonic sensing device for generating a first light conversion signal in response to the light pulse reflected by the object; a read-out circuit for measuring a TOF of the light pulse reflected by the object; an adjustable delay circuit for providing an adjustable delay time between the measuring control signal and the measuring trigger signal, or between the measuring control signal and the driving pulse; and a DLL controller for generating a delay control signal by comparing a phase difference between the measuring trigger signal and a driving related signal related to the driving pulse such that the phase difference is regulated to a predetermined value.

    PROXIMITY SENSOR INCLUDING ENCLOSED ACCOMODATION SPACE WITH SEALED LIGHT PASSAGE AND MANUFACTURING METHOD THEREOF
    6.
    发明申请
    PROXIMITY SENSOR INCLUDING ENCLOSED ACCOMODATION SPACE WITH SEALED LIGHT PASSAGE AND MANUFACTURING METHOD THEREOF 有权

    公开(公告)号：US20220317257A1

    公开(公告)日：2022-10-06

    申请号：US17842838

    申请日：2022-06-17

    Applicant: PixArt Imaging Incorporation

    Inventor： Nientse Chen

    IPC: G01S7/481 ,  G01S17/04

    Abstract: A proximity sensor includes: a transmitter unit for transmitting a light signal; a receiver unit for receiving the light signal reflected by an object to determine a proximity status of the object; and a housing defining a first enclosed accommodation space for accommodating the receiver unit, wherein the portion of the housing which defines the first enclosed accommodation space has a sealed light passage made of a light-transmissible material such that the receiver unit is capable of receiving the light signal reflected by the object through the light passage. The housing can further include a second enclosed accommodation space for accommodating the transmitter unit.

    WEARABLE DEVICE WITH COMBINED SENSING CAPABILITIES
    7.
    发明申请
    WEARABLE DEVICE WITH COMBINED SENSING CAPABILITIES 有权

    公开(公告)号：US20210041298A1

    公开(公告)日：2021-02-11

    申请号：US17067718

    申请日：2020-10-11

    Applicant: PixArt Imaging Incorporation

    Inventor： Chih-Ming Sun ,  Ming-Han Tsai

    IPC: G01J5/02 ,  B81B7/02 ,  H04N5/225 ,  B81B7/00 ,  G01J5/14 ,  G01J5/04 ,  G01J5/00

    Abstract: The present invention discloses a wearable device with combined sensing capabilities, which includes a wearable assembly and at least one multi-function sensor module. The wearable assembly is suitable to be worn on apart of a user's body. The wearable assembly includes at least one light-transmissible window. The multi-function sensor module is located inside the wearable assembly, for performing an image sensing function and an infrared temperature sensing function. The multi-function sensor module includes an image sensor module for sensing a physical or a biological feature of an object through the light-transmissible window by way of image sensing; and an infrared temperature sensor module for sensing temperature through the light-transmissible window by way of infrared temperature sensing.

    Semiconductor device and manufacturing method therefor
    8.
    发明授权
    Semiconductor device and manufacturing method therefor 有权

    公开(公告)号：US10418458B2

    公开(公告)日：2019-09-17

    申请号：US16357375

    申请日：2019-03-19

    Applicant: PixArt Imaging Incorporation

    Inventor： Chih-Ming Sun ,  Hsin-Hui Hsu ,  Ming-Han Tsai

    IPC: H01L29/51 ,  H01L29/423 ,  H01L29/40 ,  H01L21/308 ,  H01L21/762

    Abstract: The present invention discloses a manufacturing method for a semiconductor device. The manufacturing method includes: providing a substrate; forming a semiconductor stacked structure on the substrate; forming at least apart of a stacked cap layer on the semiconductor stacked structure, wherein the part of the stacked cap layer includes a nitride layer; removing a part of the nitride layer; forming the rest part of the stacked cap layer; forming a protection layer on the stacked cap layer, and etching the protection layer to form an opening, wherein the nitride layer is not exposed by the opening; and introducing an etchant material into the opening to etch the substrate. The present invention also provides a semiconductor device made by the method.

    Input system
    9.
    发明授权
    Input system 有权

    公开(公告)号：US10372224B2

    公开(公告)日：2019-08-06

    申请号：US15168825

    申请日：2016-05-31

    Applicant: Yu-Hao Huang ,  Yi-Fang Lee ,  Ming-Tsan Kao

    Inventor： Yu-Hao Huang ,  Yi-Fang Lee ,  Ming-Tsan Kao

    IPC: G06F3/01 ,  G06F3/03 ,  G06F3/0484

    Abstract: An input system includes a first gesture detection unit and a second gesture detection unit. The first gesture detection unit includes a first light emitting device for emitting a first light beam, a first light sensing device for receiving the first light beam reflected by a first motion trajectory generated by a user and outputting a first image signal, and a first processing unit for processing the first image signal and outputting a first command signal. The second gesture detection unit includes a second light emitting device for emitting a second light beam, a second light sensing device for receiving the second light beam reflected by a second motion trajectory generated by the user and outputting a second image signal, and a second processing unit for processing the second image signal and outputting a second command signal.

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