WAVELENGTH CONVERSION ELEMENT AND METHOD FOR MANUFACTURING WAVELENGTH CONVERSION ELEMENT

    公开(公告)号:US20230159367A1

    公开(公告)日:2023-05-25

    申请号:US17921517

    申请日:2021-04-27

    发明人: Noritaka NIINO

    IPC分类号: C03B19/09 C09K11/02 C03B19/06

    摘要: A wavelength conversion element converts excitation light to light with a different wavelength. The wavelength conversion element includes a substrate including an upper surface, and a wavelength converter on the upper surface of the substrate. The wavelength converter includes a phosphor including a plurality of phosphor particles, molten glass in contact with the plurality of phosphor particles and binding the plurality of phosphor particles to one another, and voids at least between the plurality of phosphor particles, in the molten glass, or between the plurality of phosphor particles and the molten glass. A maximum area of areas of the voids is less than a maximum area of areas of the plurality of phosphor particles in a cross-sectional view of the wavelength converter.

    Light emitting device and manufacturing method of the same
    8.
    发明授权
    Light emitting device and manufacturing method of the same 有权
    发光器件及其制造方法相同

    公开(公告)号:US08860057B2

    公开(公告)日:2014-10-14

    申请号:US13550529

    申请日:2012-07-16

    摘要: The light emitting device 10 comprises a mounting substrate 11, LED chips 20 flip-chip bonded on the mounting substrate 11, and a glass sealing member 30 made of a plate-shaped glass material that seals the LED chips 20 formed on the mounting substrate 11. Here, the glass sealing member 30 is in a state in which fine voids are almost evenly dispersed and distributed between the powder grains of the glass material, and the powder grains are connected with each other, and the fine bumps/dips 30a are almost evenly dispersed and distributed on the surface of the glass sealing member 30.

    摘要翻译: 发光装置10包括安装基板11,贴合在安装基板11上的LED芯片20以及由形成在安装基板11上的LED芯片20的板状玻璃材料制成的玻璃密封部件30 这里,玻璃密封构件30处于微小的空隙几乎均匀地分散并分布在玻璃材料的粉末颗粒之间并且粉末颗粒彼此连接的状态,并且微小的凸起/凹陷30a几乎 均匀分散并分布在玻璃密封件30的表面上。