摘要:
A method for making a heat exchanger includes providing a first outer tube, and an inner tube disposed in the first outer tube; placing a first coiled heat-transfer tube in a space defined between the inner tube and the first outer tube without being fixed to either one of an outer peripheral surface of the inner tube and an inner peripheral surface of the first outer tube, the first coiled heat-transfer tube including a plurality of coiled sections, an inside space of the heat-transfer tube defining a first flow path, a coiled space defined between coiled sections of the heat-transfer tube in the space, defined between the inner tube and the first outer tube, defining a second flow path, wherein heat is exchanged between two fluids.
摘要:
A thermal module having an integral body including a base seat with a raised section and a heat dissipation unit with a recess such that the raised section of the base seat fits into the recess of the heat dissipation unit to connect the heat dissipation unit with the base seat. An inner end of the recess is formed with at least one lateral protrusion extended toward an opposite end of the recess and at least one end of the raised section is formed with a groove corresponding to the protrusion, the protrusion being inserted in and connected to the groove.
摘要:
A device having a first part shrink-fitted with a first shrink ring, the first shrink ring being shrink-fitted with a second shrink ring exhibiting a lower thermal expansion coefficient than a thermal expansion coefficient of the first shrink ring.
摘要:
The disclosure relates to a plate heat exchanger in a sealed design, with a stacked arrangement comprising a front-side and a rear-side end plate, wherein at least one end plate is constituted as a connection plate, heat exchanger plates which are arranged and stacked between the front-side and the rear-side end plate, in such a way that cavities for accommodating a plurality of heat exchanger media are formed between the heat exchanger plates, and sealing elements which are disposed to seal the cavities, and a clamping device, configured to exert an external clamping pressure on the stacked arrangement for the tensioning, wherein the clamping device is formed to encompass the stacked arrangement in a form-fit manner at least in sections, namely at least in a corner region of the stacked arrangement.
摘要:
A heat conduction member includes: a cylindrical ceramic body, a metal pipe on the outer periphery side of the cylindrical ceramic body, and an intermediate member held between the cylindrical ceramic body and the metal pipe. The cylindrical ceramic body has passages passing through from one end face to the other end face and allowing the first fluid to flow therethrough. The intermediate member is made of material having at least a part having a Young's modulus of 150 Gpa or less. The first fluid is allowed to flow through the inside of the cylindrical ceramic body while the second fluid having lower temperature than that of the first fluid is allowed to flow on the outer peripheral face side of the metal pipe to perform heat exchange between the first fluid and the second fluid.
摘要:
A manufacturing method of heat conductive device for an LED has steps of forming a heat sink and an engagement recess in the heat sink by cold forge, punching a heat-conducting disc to form an LED carrier having a mounting portion and a heat-conducting wall formed around the mounting portion, soldering multiple LEDs on the LED carrier, and heating the heat sink to thermally expand the heat sink and assembling the LED carrier and the heat sink so that the heat-conducting wall is assembled with the engagement recess and further chilling the heat sink to thermally retract and tightly hold the LED carrier. The manufacturing method increases contact area and reduces air gaps between the LED carrier and the heat sink to effectively enhance the heat-conducting efficiency of the LED carrier so that the LEDs are operated at a suitable operating temperature to secure a prolonged life duration.
摘要:
A heat dissipating device includes a heat dissipating fin and a heat pipe. The heat dissipating fin includes a fin body, a through hole and a closed ring-shaped portion, wherein the through hole is formed on the fin body, the closed ring-shaped portion extends from a periphery of the through hole and has a first U-shaped protruding ear, and the first U-shaped protruding ear has a first opening. The heat pipe has a heat dissipating end and a heat absorbing end, wherein the heat dissipating end is opposite to the heat absorbing end and is disposed in the through hole and the closed ring-shaped portion. After punching the closed ring-shaped portion, the first opening of the first U-shaped protruding ear shrinks, such that the closed ring-shaped portion fixes the heat dissipating end in a tight-fitting manner.
摘要:
A small heat exchanger can efficiently exchange heat, and can be produced at low cost in comparison with a conventional heat exchanger. In the heat exchanger, a heat-transfer tube can be easily replaced so that the heat exchanger can be used for a treatment which requires a low flow rate. A heat-transfer tube produced in the form of a coil is attached to, for example, a lower closing portion and an inner tube, which are integrally produced. The heat-transfer tube is pulled in the U-direction to reduce the diameter of the coiled portions and, thus, is closely bonded or welded to the inner tube. An outer tube and an upper closing portion are attached so that there is a slight gap between the outer tube and the outer diameter of the heat-transfer tube.
摘要:
A device including a first part made of ceramic material shrink fitted with a first shrink ring, in which an edge of an axial end of a cylindrical portion of the first part to which the first shrink ring is fitted and an edge of an axial end of the first shrink ring belong to one and the same transverse plane.
摘要:
A device having a first part shrink-fitted with a first shrink ring, the first shrink ring being shrink-fitted with a second shrink ring exhibiting a lower thermal expansion coefficient than a thermal expansion coefficient of the first shrink ring.